Specifications
| Type | Description |
|---|---|
| Part Number | XL-3528UYC-FJ |
| Manufacturer | XINGLIGHT |
| Product Type | Yellow SMD LED |
| Category | LED |
| Package/Case | 3528 SMD LED, 3.5 x 2.8 x 1.9 mm |
| Package Dimensions | 3.5 x 2.8 x 1.9 mm |
| Emitted Color | Yellow |
| Lens / Colloid Color | Water clear / transparent colloid |
| RoHS Compliance | Complies with RoHS Directive |
| Moisture Sensitivity Level | MSL 3 |
| Standard Packaging | EIA standard packaging |
| SMT Process Compatibility | Suitable for SMT automatic production |
| Reflow Process Compatibility | Suitable for infrared reflow soldering process |
| Maximum Power Dissipation | 50 mW |
| Maximum Continuous Forward Current | 20 mA |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10 |
| Maximum Reverse Voltage | 5 V |
| ESD Rating | 2000 V |
| Operating Temperature Range | -40 to +85 °C |
| Storage Temperature Range | -40 to +85 °C |
| Lead Soldering Temperature / Time | 260°C <=6 s |
| Luminous Intensity | 800 min, 1000 typ, 1300 max mcd at IF=20 mA, Ta=25°C |
| Dominant Wavelength | 585 min, 595 max nm at IF=20 mA, Ta=25°C |
| Peak Wavelength | 590 typ nm at IF=20 mA, Ta=25°C |
| Forward Voltage | 1.8 min, 2.4 max V at IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ at IF=20 mA, Ta=25°C |
| Half Wave Width | 20 typ nm at IF=20 mA, Ta=25°C |
| Reverse Current | <=5 µA at VR=5 V, Ta=25°C |
| Brightness Bin E8 | 800 to 900 mcd at IF=20 mA |
| Brightness Bin E9 | 900 to 1000 mcd at IF=20 mA |
| Brightness Bin F1 | 1000 to 1150 mcd at IF=20 mA |
| Brightness Bin F2 | 1150 to 1300 mcd at IF=20 mA |
| Voltage Bin N12-7 | 1.8 to 2.0 V at IF=20 mA |
| Voltage Bin N12-8 | 2.0 to 2.2 V at IF=20 mA |
| Voltage Bin N12-9 | 2.2 to 2.4 V at IF=20 mA |
| Dominant Wavelength Bin HY03 | 585 to 587.5 nm at IF=20 mA |
| Dominant Wavelength Bin HY04 | 587.5 to 590 nm at IF=20 mA |
| Dominant Wavelength Bin HY05 | 590 to 592.5 nm at IF=20 mA |
| Dominant Wavelength Bin HY06 | 592.5 to 595 nm at IF=20 mA |
| Test Ambient Temperature | 25±5°C unless otherwise indicated |
| Working Life Reliability Test | 1000 hours; continuous lighting at 20 mA |
| High Temperature / High Humidity Storage Test | 240 hours ±2 hours; Ta=85±5°C, RH=90-95% |
| High Temperature Storage Test | 1000 hours at Ta=85±5°C |
| Low Temperature Storage Test | Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min -> 25°C 5 min -> -55°C 30 min -> 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; 100±5°C to -40±5°C, 20 min each |
| Anti-Tin Test | 260±5°C, 10±1 s, 2 times |
| Leaded Infrared Reflow Profile | 235°C +5/-0°C peak, 10-15 s at peak |
| Lead-Free Infrared Reflow Profile | 255°C +0/-5°C peak, 5-10 s at peak |
| Weldability Test | 235±5°C, immersion time 2±0.5 s; tin loading rate >=95% pad area |
| Mechanical Tolerance | ±0.25 mm unless otherwise noted |
| Tape / Reel Dimensional Tolerance | ±0.1 mm |
| Hand Soldering Limit | Soldering iron <30 W, temperature <300°C, <3 s per terminal, one time only |
| Recommended Maximum Welding Temperature | 240±5°C / 6 s |
| Maximum Reflow Count | 2 times |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or 50°C for 30 s |
| Ultrasonic Cleaning Limit | <=300 W; pretest required |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 hours / 7 days |
| Recommended Workshop Condition | <=30°C, <=60% RH |
| Baking Condition | 60±5°C for 24 hours |
| Datasheet Status | request_only |
Product Overview
XL-3528UYC-FJ is a XINGLIGHT yellow SMD LED supplied in a 3528 surface-mount package. The package dimensions are 3.5 x 2.8 x 1.9 mm, with a water-clear transparent colloid for yellow emission. It is categorized as an LED component and is suitable for SMT automatic production.
Key Features
- Yellow emission with water-clear transparent colloid
- 3528 SMD package measuring 3.5 x 2.8 x 1.9 mm
- 800 to 1300 mcd luminous intensity at 20 mA
- 585 to 595 nm dominant wavelength range
- 1.8 to 2.4 V forward voltage at 20 mA
- 120° typical viewing angle for indicator visibility
- 20 mA maximum continuous forward current rating
- 2000 V antistatic ability at Ta=25°C
- Suitable for SMT automatic production processes
- Compatible with infrared reflow soldering
Typical Applications
- Yellow status indicators
- Surface-mount indicator assemblies
- SMT production boards
- Reflow-soldered LED layouts
- Panel indication circuits
- Color-coded device indication
- Compact 3528 LED positions
Procurement Notes
When requesting a quote for XL-3528UYC-FJ, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package is used by XL-3528UYC-FJ?
XL-3528UYC-FJ uses a 3528 SMD LED package with outline dimensions of 3.5 x 2.8 x 1.9 mm. The datasheet lists a general mechanical tolerance of ±0.25 mm unless otherwise noted.
What are the optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED has 800 to 1300 mcd luminous intensity, 585 to 595 nm dominant wavelength, 590 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle.
What soldering processes are specified for this LED?
The datasheet states compatibility with SMT automatic production and infrared reflow soldering. Reflow should not be performed more than two times, and the recommended maximum welding temperature is 240±5°C for 6 seconds.
How should opened reels be stored before soldering?
After opening the moisture-proof anti-electrostatic package, the LEDs should be stored at <=30°C and <=40% RH and soldered within 168 hours, or 7 days. Baking is specified at 60±5°C for 24 hours if required.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.