Specifications
| Type | Description |
|---|---|
| Part Number | XL-A324SURSYGC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Inferred Category | LED |
| Component Type | LED |
| Package / Case | F3, 3.8 x 3.0 x 5.2 x 28 mm, transparent common-cathode through-hole LED |
| Appearance Dimension | F3 / 3.8 x 3.0 x 5.2 x 28 mm |
| Luminous Color and Colloid | High brightness red and yellow-green bicolor, water clear/transparent colloid |
| Common Configuration | Common cathode |
| Moisture Sensitivity Level | MSL 2 |
| RoHS Compliance | Meets RoHS requirements |
| Maximum Power Dissipation, Red | 50 mW at Ta=25°C |
| Maximum Power Dissipation, YG | 50 mW at Ta=25°C |
| Maximum Continuous Forward Current, Red | 20 mA at Ta=25°C |
| Maximum Continuous Forward Current, YG | 20 mA at Ta=25°C |
| Peak Forward Current, Red | 80 mA at Ta=25°C |
| Peak Forward Current, YG | 80 mA at Ta=25°C |
| Operating Temperature Range | -20 to +85 °C |
| Storage Temperature Range | -40 to +85 °C |
| Wave Soldering Temperature/Time | 240°C, ≤6 s; soldering point more than 2.0 mm from colloid bottom |
| Manual Soldering Temperature/Time | 300°C, 3 s; soldering point more than 2.0 mm from colloid bottom |
| Luminous Intensity, Red | 400 min, 700 max mcd at IF=20 mA, Ta=25°C |
| Luminous Intensity, YG | 50 min, 200 max mcd at IF=20 mA, Ta=25°C |
| Dominant Wavelength, Red | 630 min, 640 max nm at IF=20 mA, Ta=25°C |
| Dominant Wavelength, YG | 565 min, 575 max nm at IF=20 mA, Ta=25°C |
| Peak Wavelength, Red | 640 typ nm at IF=20 mA, Ta=25°C |
| Peak Wavelength, YG | 570 typ nm at IF=20 mA, Ta=25°C |
| Forward Voltage, Red | 1.8 min, 2.4 max V at IF=20 mA, Ta=25°C |
| Forward Voltage, YG | 2.0 min, 2.6 max V at IF=20 mA, Ta=25°C |
| Viewing Angle | 30 typ deg at IF=20 mA, Ta=25°C, red and YG, 2θ1/2 |
| Reverse Current, Red | ≤10 µA at VR=5 V, Ta=25°C |
| Reverse Current, YG | ≤10 µA at VR=5 V, Ta=25°C |
| Brightness Bin A1 | 50 to 100 mcd at IF=20 mA |
| Brightness Bin A2 | 100 to 200 mcd at IF=20 mA |
| Brightness Bin A5 | 400 to 500 mcd at IF=20 mA |
| Brightness Bin A6 | 500 to 700 mcd at IF=20 mA |
| Voltage Bin N12-7 | 1.8 to 2.0 V at IF=20 mA |
| Voltage Bin N12-8 | 2.0 to 2.2 V at IF=20 mA |
| Voltage Bin N12-9 | 2.2 to 2.4 V at IF=20 mA |
| Voltage Bin N13-1 | 2.4 to 2.6 V at IF=20 mA |
| Wavelength Bin HR04 | 630 to 635 nm at IF=20 mA |
| Wavelength Bin HR05 | 635 to 640 nm at IF=20 mA |
| Wavelength Bin HYG03 | 565 to 567.5 nm at IF=20 mA |
| Wavelength Bin HYG04 | 567.5 to 570 nm at IF=20 mA |
| Wavelength Bin HYG05 | 570 to 572.5 nm at IF=20 mA |
| Wavelength Bin HYG06 | 572.5 to 575 nm at IF=20 mA |
| Optical Intensity Tolerance | ±10% |
| Voltage Tolerance | ±0.1 V |
| Chromaticity Coordinate Tolerance | ±0.01 |
| Wavelength Tolerance | ±1 nm |
| Working Life Test | 1000 hrs, 22 pcs, fail quantity 0/1 at Ta=25°C ±5°C, IF=20 mA |
| High Temperature High Humidity Test | 1000 hrs, 22 pcs, fail quantity 0/1 at Ta=85°C ±5°C, RH=85-90% |
| High Temperature Storage Test | 1000 hrs, 22 pcs, fail quantity 0/1 at ambient temperature Ta=85°C ±5°C |
| Low Temperature Storage Test | 1000 hrs, 22 pcs, fail quantity 0/1 at ambient temperature Ta=-40°C ±5°C |
| Cold and Hot Cycle Test | 100 cycles, 22 pcs, fail quantity 0/1; 100°C ±5°C for 30 min, transition 5 min, -40°C ±5°C for 30 min |
| Hot and Cold Impact Test | 100 cycles, 22 pcs, fail quantity 0/1; 105°C ±5°C for 5 min, transition 5 min, -45°C ±5°C |
| Resistance to Soldering Heat Test | 2 times, 22 pcs, fail quantity 0/1; solder temperature T.sol=250°C ±5°C |
| Lead Integrity Test | 3 times, 22 pcs, fail quantity 0/1; load 2.5 N / 0.25 kgf, 0° to 90° to 0° |
| Outline Dimension Tolerance | ±0.50 mm unless otherwise specified |
| Packaging Type | In bags |
| Packaging Protection | Moisture-proof and anti-electrostatic foil bag |
| Recommended Storage Environment | Temperature ≤30°C, relative humidity ≤70% |
| Recommended Original Package Storage Duration | No more than 3 months |
| Cleaning Solvent and Time | Ethanol wipe or soak, no more than 3 minutes |
| Lead Bend Distance | At least 2 mm from colloid |
| ESD Human Body Model Limit | HBM <1000 V |
| ESD Machine Model Limit | Machine discharge mode <100 V |
| Datasheet Status | request_only |
Product Overview
XL-A324SURSYGC is a XINGLIGHT red and yellow-green bicolor LED supplied in an F3 transparent through-hole package. The package dimensions are listed as 3.8 x 3.0 x 5.2 x 28 mm, and the device uses a common-cathode structure with water-clear/transparent colloid.
Electrical and optical characteristics are specified at IF=20 mA and Ta=25°C. The red die has 400 to 700 mcd luminous intensity, 630 to 640 nm dominant wavelength, 640 nm typical peak wavelength, and 1.8 to 2.4 V forward voltage. The yellow-green die has 50 to 200 mcd luminous intensity, 565 to 575 nm dominant wavelength, 570 nm typical peak wavelength, and 2.0 to 2.6 V forward voltage.
Assembly limits include wave soldering at 240°C for no more than 6 seconds and manual soldering at 300°C for 3 seconds, with the solder point more than 2.0 mm from the colloid bottom. The device is suitable for bicolor status indication, panel indicators, signal displays, and common-cathode LED indication circuits.
Key Features
- Red and yellow-green bicolor LED output
- F3 through-hole transparent package construction
- Common-cathode electrical configuration
- 3.8 x 3.0 x 5.2 x 28 mm dimensions
- 20 mA continuous forward current per color
- 80 mA peak forward current per color
- 30° typical viewing angle at IF=20 mA
- MSL 2 moisture sensitivity level
- RoHS requirements met per datasheet
- Moisture-proof anti-electrostatic foil bag packaging
Typical Applications
- Bicolor status indicators
- Panel-mounted signal lamps
- Common-cathode indication circuits
- Red/yellow-green equipment displays
- Through-hole PCB indicators
- Maintenance and warning indicators
- Discrete LED display assemblies
Procurement Notes
When requesting a quote for XL-A324SURSYGC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Alternatives
TOGIALED
TJ-L3FYTXHTCSLC2R7K-A5
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
Application Verification Recommended
Related Technical Articles
FAQ
What type of LED is XL-A324SURSYGC?
XL-A324SURSYGC is a XINGLIGHT red yellow-green bicolor LED. The datasheet identifies it as an F3 transparent through-hole LED with a common-cathode configuration and water-clear/transparent colloid.
What are the main optical specifications at 20 mA?
At IF=20 mA and Ta=25°C, the red channel is rated 400 to 700 mcd with 630 to 640 nm dominant wavelength. The yellow-green channel is rated 50 to 200 mcd with 565 to 575 nm dominant wavelength.
What current ratings apply to each LED channel?
Both the red and yellow-green channels are specified for 20 mA maximum continuous forward current and 80 mA peak forward current at Ta=25°C. Maximum power dissipation is 50 mW for each channel.
What soldering limits are listed for this LED?
Wave soldering is specified at 240°C for no more than 6 seconds. Manual soldering is specified at 300°C for 3 seconds. In both cases, the soldering point must be more than 2.0 mm from the colloid bottom.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.