Specifications
| Type | Description |
|---|---|
| Part Number | XL2601-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | DIP8, DIP8-M, SMD8 |
| Data Rate | 10 MBit/s |
| Isolation Voltage | 5000 Vrms |
| Operating Temperature | -40 to +85 °C |
| Output Type | Logic gate output |
| Molding Compound Flammability | UL 94V-0 |
| Forward Current | 50 mA max |
| Input Reverse Voltage | 5 V max |
| Power Dissipation | 100 mW max |
| Collector Output Power | 85 mW max |
| Output Current | 50 mA max |
| Supply Voltage | 7 V max |
| Output Voltage | 7 V max |
| Isolation Voltage | 5000 Vrms, 40 to 60% RH, AC for 1 minute |
| Operating Temperature | -40 to +85 °C, thermal characteristics |
| Storage Temperature Range | -55 to +125 °C |
| Soldering Temperature | 260 °C for 10 seconds |
| Forward Voltage | 1.33 V typ, 1.75 V max |
| Reverse Breakdown Voltage | 5 V min |
| Input Capacitance | 70 pF typ |
| Diode Temperature Coefficient | -1.4 mV/°C typ |
| High Level Supply Current | 6.5 mA typ, 10 mA max |
| Low Level Supply Current | 9 mA typ, 13 mA max |
| Low Level Enable Current | -0.8 mA typ, -1.6 mA max |
| High Level Enable Current | -0.6 mA typ, -1.6 mA max |
| High Level Enable Voltage | 2.0 V min |
| Low Level Enable Voltage | 0.8 V max |
| High Level Output Current | 100 µA max |
| Low Level Output Voltage | 0.35 V typ, 0.6 V max |
| Input Threshold Current | 3 mA typ, 5 mA max |
| Isolation Resistance | 1×10^12 Ω min |
| Floating Capacitance | 0.6 pF typ |
| Propagation Delay Time to Output High Level | 20 ns min, 41 ns typ, 100 ns max |
| Propagation Delay Time to Output Low Level | 25 ns min, 50 ns typ, 100 ns max |
| Pulse Width Distortion | 5 ns typ, 35 ns max |
| Output Rise Time | 30 ns typ |
| Output Fall Time | 10 ns typ |
| Enable Propagation Delay Time to Output High Level | 15 ns |
| Enable Propagation Delay Time to Output Low Level | 40 ns |
| Common Mode Transient Immunity at Output High Level | 5000 V/µs min, 10000 V/µs typ |
| Common Mode Transient Immunity at Output Low Level | 5000 V/µs min, 10000 V/µs typ |
| Reflow Preheat Temperature | 150 to 200 °C |
| Reflow Preheat Time | 60 to 120 s |
| Reflow Ramp-Up Rate | 3 °C/s max |
| Reflow Liquidus Temperature | 217 °C |
| Reflow Time Above Liquidus | 60 to 150 s |
| Reflow Peak Temperature | 260 °C |
| Hand Soldering Temperature | 360 °C +5°C within 3 s |
| DIP8 Tube Quantity | 45 pcs/tube |
| SMD8 Reel Quantity | 1000 pcs/reel |
| Datasheet Status | request_only |
Product Overview
The XL2601-G is a XINGLIGHT high speed optocoupler in the LED category, specified for DIP8, DIP8-M, and SMD8 package cases. It provides a logic gate output, 10 MBit/s data rate, and 5000 Vrms isolation voltage for input-to-output separation.
Electrical ratings include 50 mA maximum forward current, 5 V maximum input reverse voltage, 100 mW maximum input power dissipation, 85 mW maximum collector output power, 50 mA maximum output current, and 7 V maximum supply and output voltage ratings. Input-side parameters include 1.33 V typical and 1.75 V maximum forward voltage at IF=10 mA, 5 V minimum reverse breakdown voltage, and 70 pF typical input capacitance.
Timing characteristics include 41 ns typical propagation delay to output high level and 50 ns typical propagation delay to output low level under the stated 5 V, 7.5 mA, 15 pF, and 350 Ω test conditions. Assembly data covers 150 to 200 °C reflow preheat, 217 °C liquidus temperature, 260 °C reflow peak temperature, and 360 °C +5°C hand soldering within 3 seconds.
Key Features
- 10 MBit/s high speed optocoupler data rate
- 5000 Vrms input-to-output isolation rating
- Logic gate output specified in feature data
- DIP8, DIP8-M, and SMD8 package cases
- -40 to +85 °C operating temperature range
- 50 mA maximum forward current rating
- 7 V maximum supply and output voltage ratings
- 1×10^12 Ω minimum isolation resistance
- 5000 V/µs minimum common mode transient immunity
- 260 °C peak reflow soldering profile
Typical Applications
- Isolated logic signal interfaces
- High speed digital isolation
- Logic gate output isolation
- 5 V optocoupler signal paths
- Common-mode transient environments
- DIP8 through-hole assemblies
- SMD8 surface-mount assemblies
Procurement Notes
When requesting a quote for XL2601-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is the XL2601-G?
The XL2601-G is specified as a XINGLIGHT high speed optocoupler in the LED category. Its datasheet facts identify a 10 MBit/s data rate, logic gate output, and DIP8, DIP8-M, or SMD8 package cases.
What isolation rating does the XL2601-G provide?
The extracted datasheet facts list 5000 Vrms isolation voltage. A detailed condition also specifies 5000 Vrms at 40 to 60% relative humidity with AC applied for 1 minute.
What operating temperature range is specified?
The XL2601-G operating temperature range is -40 to +85 °C. The same range appears in the feature specification and in the thermal characteristics facts from the manufacturer technical datasheet.
What soldering limits are provided for assembly?
Assembly data lists 260 °C soldering temperature for 10 seconds, a 260 °C reflow peak temperature, 150 to 200 °C reflow preheat, and 360 °C +5°C hand soldering within 3 seconds for rework or sample testing.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.