Specifications
| Type | Description |
|---|---|
| Part Number | XL306X-E |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Inferred Category | LED |
| Component Type | Other |
| Package Case | DIP6, DIP6-M, SMD6; package outline dimensions shown in mm but numeric dimensions not legible in provided text |
| Peak Breakdown Voltage | 600 V |
| Isolation Voltage | 5000 Vrms |
| Operating Temperature | -55 to +100 °C |
| Package Options | DIP6, DIP6-M, SMD6 |
| Molding Compound Flammability | UL 94V-0 |
| DIP6 Shipping Quantity | 65 pcs/tube |
| DIP6-M Shipping Quantity | 65 pcs/tube |
| SMD6 Shipping Quantity | 1000 pcs/tape and reel |
| Input Forward Current Absolute Maximum | 60 mA |
| Input Reverse Voltage Absolute Maximum | 6 V |
| Input Power Dissipation | 100 mW |
| Input Power Dissipation Derating Factor | 3.8 mW/°C |
| Output Power Dissipation | 300 mW |
| Output Power Dissipation Derating Factor | 7.6 mW/°C |
| Off-State Output Terminal Voltage | 600 V |
| Peak Repetitive Surge Current | 1 A |
| Turn-On Current RMS | 100 mA |
| Total Power Dissipation | 350 mW |
| Isolation Voltage | 5000 Vrms |
| Storage Temperature Range | -55 to +125 °C |
| Soldering Temperature | 260 °C |
| Forward Voltage | typ 1.2 V, max 1.4 V |
| Reverse Leakage Current | max 10 µA |
| Peak Blocking Current | max 500 nA |
| Peak On-State Voltage | max 3 V |
| Critical Rate of Rise of Off-State Voltage | min 1000 V/µs |
| Inhibition Voltage | 20 V |
| Leakage in Inhibited State | 500 µA |
| LED Trigger Current | max 15 mA |
| LED Trigger Current | max 10 mA |
| LED Trigger Current | max 5 mA |
| LED Trigger Current | max 3 mA |
| Holding Current | typ 250 µA |
| Reflow Preheat Temperature | 150 to 200 °C |
| Reflow Preheat Time | 60 to 120 s |
| Reflow Ramp-Up Rate | max 3 °C/s |
| Reflow Liquidus Temperature | 217 °C |
| Reflow Time Above Liquidus | 60 to 150 s |
| Reflow Peak Temperature | 260 °C |
| Reflow Peak Dwell Time | max 30 s |
| Reflow Ramp-Down Rate | max 6 °C/s |
| Reflow Cycle Limit | No more than 3 times |
| Wave Soldering Peak Temperature | 260 °C |
| Wave Soldering Peak Time | 10 s |
| Hand Soldering Iron Temperature | 360 °C ±5 °C |
| DIP6 Carton Quantity | 32500 pcs/carton |
| SMD6 Carton Quantity | 20000 pcs/carton |
| Document Validity | Valid until Dec 31, 2026 |
| Datasheet Status | request_only |
Product Overview
The XINGLIGHT XL306X-E is documented as a zero cross triac driver in the LED category. It is part of the XL306X series, with 600 V peak breakdown voltage and 600 V off-state output terminal voltage. Input-to-output isolation is specified at 5000 Vrms, including the VISO condition with pins 1, 2, and 3 shorted and pins 4, 5, and 6 shorted for an AC 1 minute test at 40-60% RH.
Package options include DIP6, DIP6-M, and SMD6. The extracted datasheet text indicates package outline dimensions are shown in millimeters, but the numeric dimensions are not legible in the provided text. Shipping data lists 65 pcs/tube for DIP6 and DIP6-M, and 1000 pcs/tape and reel for SMD6.
Assembly data includes 260 °C soldering temperature for 10 seconds, a 260 °C reflow peak, and a recommended limit of no more than three reflow cycles. The device parameters support isolated zero-cross triac drive interfaces for AC switching applications where 600 V blocking capability and 5000 Vrms isolation are required.
Key Features
- Zero cross triac driver product type
- 600 V peak breakdown voltage for XL306X series
- 5000 Vrms isolation between input and output
- -55 to +100 °C operating temperature range
- DIP6, DIP6-M, and SMD6 package options
- UL 94V-0 molding compound flammability rating
- 60 mA absolute maximum input forward current
- 100 mA RMS turn-on current rating
- Minimum 1000 V/µs off-state dv/dt
- 260 °C peak reflow temperature profile
Typical Applications
- Isolated AC switching interfaces
- Zero-cross triac triggering circuits
- 600 V off-state control designs
- Input-to-output isolation barriers
- SMD6 tape-and-reel assemblies
- DIP6 tube-packed assemblies
Procurement Notes
When requesting a quote for XL306X-E, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is XL306X-E?
XL306X-E is identified in the extracted datasheet facts as a XINGLIGHT zero cross triac driver in the LED category. The available package options are DIP6, DIP6-M, and SMD6.
What isolation voltage is specified for XL306X-E?
The datasheet facts specify 5000 Vrms isolation between input and output. A second condition lists VISO at 5000 Vrms for AC 1 minute with input pins shorted together and output pins shorted together.
What package and shipping options are listed?
The package options are DIP6, DIP6-M, and SMD6. DIP6 and DIP6-M are listed at 65 pcs/tube, while SMD6 is listed at 1000 pcs/tape and reel.
What soldering limits are provided in the datasheet facts?
The extracted facts list 260 °C soldering temperature for 10 seconds, 260 °C reflow peak temperature, no more than three reflow cycles, and wave soldering at 260 °C for 10 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.