Specifications
| Type | Description |
|---|---|
| Part Number | XL3120 |
| Manufacturer | XINGLIGHT |
| Product Type | Operational Amplifier |
| Category | Signal Chain |
| Inferred Category | Signal_Chain |
| Component Type | Power_IC |
| Package Case | DIP8, DIP8-M, SMD8; package outline dimensions referenced in mm but numeric dimensions not present in provided text |
| Common Mode Rejection | 35 kV/us minimum; condition: Feature summary; source page: 1 |
| Operating VCC Range | 15 to 30 V; condition: Feature summary; source page: 1 |
| Maximum Peak Output Current | 2.5 A; condition: Feature summary; source page: 1 |
| Creepage Distance | >7.0 mm; condition: Feature summary; source page: 1 |
| Operating Temperature | -55 to 110 deg C; condition: Feature summary; source page: 1 |
| Package Options | DIP8, DIP8-M, SMD8; condition: Mechanical data; source page: 1 |
| Molding Compound Flammability Rating | UL 94V-0; condition: Mechanical data; source page: 1 |
| Terminal Finish | Matte tin-plated leads; condition: Solderability per MIL-STD-202, Method 208; source page: 1 |
| Part Number XL3120X Package | DIP8; condition: 45 pcs/tube, marking code XL3120X; source page: 2 |
| Part Number XL3120MX Package | DIP8-M; condition: 45 pcs/tube, marking code XL3120X; source page: 2 |
| Part Number XL3120SX Package | SMD-8; condition: 1000 pcs/tape and reel, marking code XL3120X; source page: 2 |
| Forward Current | 50 mA; condition: Maximum rating, TA=25 deg C unless otherwise specified; source page: 2 |
| Input Power Dissipation | 45 mW; condition: Maximum rating, TA=25 deg C unless otherwise specified; source page: 2 |
| Reverse Voltage | 5 V; condition: Maximum rating, TA=25 deg C unless otherwise specified; source page: 2 |
| Peak Output Current | 3 A; condition: Maximum rating, TA=25 deg C unless otherwise specified; source page: 2 |
| Output Supply Voltage | 0 to 30 V; condition: VDD-VSS maximum rating, TA=25 deg C unless otherwise specified; source page: 2 |
| Output Voltage | 0 to VDD V; condition: VO maximum rating, TA=25 deg C unless otherwise specified; source page: 2 |
| Isolation Voltage | 5000 Vrms; condition: 40 to 60% RH, AC for 1 minute; source page: 3 |
| Total Power Consumption | 200 mW; condition: Thermal characteristics; source page: 3 |
| Operating Temperature Range | -55 to +100 deg C; condition: Thermal characteristics; source page: 3 |
| Storage Temperature Range | -55 to +125 deg C; condition: Thermal characteristics; source page: 3 |
| Soldering Temperature | 260 deg C; condition: For 10 seconds; source page: 3 |
| Forward Voltage | Min 1.2 V, Typ 1.5 V, Max 1.8 V; condition: IF=10 mA, TA=25 deg C unless otherwise specified; source page: 3 |
| Reverse Current | Max 10 uA; condition: VR=5 V, TA=25 deg C unless otherwise specified; source page: 3 |
| Input Turn-On Current | Typ 2.8 mA, Max 5.0 mA; condition: IO=0 mA, VO>5 V; source page: 3 |
| Input Turn-Off Voltage | Min 0.8 V; condition: IO=0 mA, VO<5 V; source page: 3 |
| UVLO Positive Threshold | Min 11.5 V, Typ 12.7 V, Max 13.5 V; condition: IF=10 mA, VO>5 V; source page: 3 |
| UVLO Negative Threshold | Min 10.0 V, Typ 11.2 V, Max 12 V; condition: IF=10 mA, VO<5 V; source page: 3 |
| UVLO Hysteresis | Typ 1.5 V; condition: TA=25 deg C unless otherwise specified; source page: 3 |
| High Level Output Current | Min -1.0 A, Typ -2.0 A, Max -2.5 A; condition: VO=VDD-3 V; source page: 3 |
| High Level Output Current | Min -2.0 A, Max -2.5 A; condition: VO=VDD-6 V; source page: 3 |
| Low Level Output Current | Min 1.0 A, Typ 2.0 A, Max 2.5 A; condition: VO=VSS+3 V; source page: 3 |
| Low Level Output Current | Min 2.0 A, Max 2.5 A; condition: VO=VSS+6 V; source page: 3 |
| High Level Output Voltage | Min VDD-6.25 V, Typ VDD-2.5 V; condition: IF=10 mA, IO=-2.5 A; source page: 3 |
| High Level Output Voltage | Min VDD-0.3 V, Typ VDD-0.1 V; condition: IF=10 mA, IO=-100 mA; source page: 3 |
| Low Level Output Voltage | Typ VSS+2.5 V, Max VSS+6.25 V; condition: IF=0 mA, IO=2.5 A; source page: 3 |
| Low Level Output Voltage | Typ VSS+0.1 V, Max VSS+0.3 V; condition: IF=0 mA, IO=100 mA; source page: 3 |
| High Level Power Supply Current | Typ 1.8 mA, Max 3.8 mA; condition: VO=open, IF=7 to 16 mA; source page: 3 |
| Low Level Power Supply Current | Typ 2.1 mA, Max 3.8 mA; condition: VO=open, VF=0 to 0.8 V; source page: 3 |
| Propagation Delay Time to Low Output Level | Typ 71 ns, Max 400 ns; condition: IF=7 mA to 16 mA, Rg=10 ohm, Cg=10 nF, F=10 kHz, duty cycle=50%; source page: 4 |
| Propagation Delay Time to High Output Level | Typ 68 ns, Max 400 ns; condition: IF=7 mA to 16 mA, Rg=10 ohm, Cg=10 nF, F=10 kHz, duty cycle=50%; source page: 4 |
| Pulse Width Distortion | Typ 3 ns, Max 100 ns; condition: IF=7 mA to 16 mA, Rg=10 ohm, Cg=10 nF, F=10 kHz, duty cycle=50%; source page: 4 |
| Propagation Delay Difference Between Any Two Parts | Min -250 ns, Max 250 ns; condition: IF=7 mA to 16 mA, Rg=10 ohm, Cg=10 nF, F=10 kHz, duty cycle=50%; source page: 4 |
| Output Rise Time | Typ 60 ns; condition: 10% to 90%, IF=7 mA to 16 mA, Rg=10 ohm, Cg=10 nF, F=10 kHz, duty cycle=50%; source page: 4 |
| Output Drop Time | Typ 60 ns; condition: 90% to 10%, IF=7 mA to 16 mA, Rg=10 ohm, Cg=10 nF, F=10 kHz, duty cycle=50%; source page: 4 |
| Isolation Resistance | Typ 10^11 ohm; condition: VI-O=500 V, 40 to 60% RH; source page: 4 |
| Isolation Capacitance | Typ 1 pF; condition: VI-O=0 V, frequency=1 MHz; source page: 4 |
| UVLO Turn-On Delay | Typ 1.6 us; condition: IF=10 mA, VO>5 V; source page: 4 |
| UVLO Turn-Off Delay | Typ 0.4 us; condition: IF=10 mA, VO<5 V; source page: 4 |
| Output High Level Common Mode Transient Immunity | Min 35 kV/us, Typ 50 kV/us; condition: TA=25 deg C, VDD=30 V, VCM=2000 V; source page: 4 |
| Output Low Level Common Mode Transient Immunity | Min 35 kV/us, Typ 50 kV/us; condition: IF=7 to 16 mA, VF=0 V; source page: 4 |
| Reflow Preheat Temperature | Min 150 deg C, Max 200 deg C; condition: Reflow soldering profile; source page: 11 |
| Reflow Preheat Time | Min 60 s, Max 120 s; condition: Reflow soldering profile; source page: 11 |
| Reflow Ramp-Up Rate | 3 deg C/s; condition: TL to TP; source page: 11 |
| Reflow Liquidus Temperature | 217 deg C; condition: Reflow soldering profile; source page: 11 |
| Reflow Time Above Liquidus | Min 60 s, Max 150 s; condition: Above TL; source page: 11 |
| Reflow Peak Temperature | 260 deg C; condition: Reflow soldering profile; source page: 11 |
| Reflow Peak Time | 30 s; condition: Time during which Tc is between TP-5 and TP; source page: 11 |
| Reflow Ramp-Down Rate | 6 deg C/s; condition: TP to TL; source page: 11 |
| Maximum Reflow Cycles | No more than 3 times; condition: Recommended reflow soldering temperatures and times; source page: 11 |
| Wave Soldering Average Ramp-Up Rate | ~200 deg C/s; condition: Wave soldering profile; source page: 11 |
| Wave Soldering Heating Rate During Preheat | Typical 1 to 2 deg C/s, Max 4 deg C/s; condition: Wave soldering profile; source page: 11 |
| Wave Soldering Final Preheat Temperature | ~130 deg C; condition: Ts; source page: 11 |
| Wave Soldering Preheat Time | >60 s; condition: 25 deg C to Ts; source page: 11 |
| Wave Soldering Peak Temperature | 260 deg C; condition: Tp; source page: 11 |
| Wave Soldering Peak Time | 10 s; condition: Time within peak temperature; source page: 11 |
| Wave Soldering Ramp-Down Rate | 5 deg C/s maximum; condition: Wave soldering profile; source page: 11 |
| Hand Soldering Iron Temperature | 360 deg C +5 deg C; condition: Within 3 s, product rework or sample testing; source page: 11 |
| DIP8 Packing Quantity | 45 pcs/tube, 2250 pcs/box, 22500 pcs/carton; condition: Tube 500 mm, 50 tubes/box, 10 boxes/carton; source page: 12 |
| DIP8-M Packing Quantity | 45 pcs/tube, 2250 pcs/box, 22500 pcs/carton; condition: Tube 500 mm, 50 tubes/box, 10 boxes/carton; source page: 12 |
| SMD8 Packing Quantity | 1000 pcs/reel, 2000 pcs/box, 20000 pcs/carton; condition: Reel diameter 330 mm, 2 reels/box, 10 boxes/carton; source page: 12 |
| Datasheet Status | request_only |
Product Overview
The XL3120 is a XINGLIGHT gate drive optocoupler categorized under Signal_Chain and identified as a Power_IC component type in the extracted data. It is specified for isolated gate-drive signaling, with an operating VCC range of 15 to 30 V and output supply voltage maximum rating of 0 to 30 V across VDD-VSS. The output voltage maximum rating is 0 to VDD V.
Input-side ratings include 50 mA forward current, 45 mW input power dissipation, and 5 V reverse voltage. Electrical characteristics list 1.2 V minimum, 1.5 V typical, and 1.8 V maximum forward voltage at IF=10 mA, plus 10 uA maximum reverse current at VR=5 V.
Isolation and transient performance include 5000 Vrms isolation voltage for 1 minute, greater than 7.0 mm creepage distance, and output high and low common-mode transient immunity of 35 kV/us minimum and 50 kV/us typical. Available ordering/package formats include XL3120X in DIP8, XL3120MX in DIP8-M, and XL3120SX in SMD-8, with tube or tape-and-reel packing options.
Key Features
- 15 to 30 V operating VCC range
- 2.5 A maximum peak output current feature
- 3 A peak output current maximum rating
- 35 kV/us minimum common-mode rejection
- 5000 Vrms isolation voltage for one minute
- Greater than 7.0 mm creepage distance
- DIP8, DIP8-M, and SMD8 package options
- UL 94V-0 molding compound flammability rating
- Typical 68 ns propagation delay to high output
- Typical 71 ns propagation delay to low output
- Typical 1.5 V UVLO hysteresis
- 260 deg C peak reflow temperature
Typical Applications
- Isolated gate-drive signal paths
- Power switch gate driving
- Systems requiring 5000 Vrms isolation
- Designs using DIP8 optocoupler packages
- SMD-8 tape-and-reel assemblies
- Circuits needing UVLO behavior
- Common-mode transient environments
Procurement Notes
When requesting a quote for XL3120, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For analog and signal-chain sourcing, supply voltage, bandwidth, accuracy, noise level, package, temperature grade, input/output configuration and qualification requirements should be verified before approval.
FAQ
What type of device is the XL3120?
The XL3120 is a XINGLIGHT gate drive optocoupler in the Signal_Chain category. The extracted data also identifies it as a Power_IC component type and lists DIP8, DIP8-M, and SMD8 package options.
What output current is specified for the XL3120?
The feature summary lists 2.5 A maximum peak output current. The maximum ratings section lists 3 A peak output current at TA=25 deg C unless otherwise specified.
What isolation parameters are available for XL3120?
The extracted facts list 5000 Vrms isolation voltage for AC for 1 minute at 40 to 60% RH, creepage distance greater than 7.0 mm, typical 10^11 ohm isolation resistance, and typical 1 pF isolation capacitance.
Which package and packing options are listed?
The listed package options are DIP8, DIP8-M, and SMD8. XL3120X is DIP8, XL3120MX is DIP8-M, and XL3120SX is SMD-8. DIP packages are listed at 45 pcs per tube, while SMD8 is listed at 1000 pcs per reel.
What soldering profiles are specified for XL3120?
Reflow data includes 150 to 200 deg C preheat, 217 deg C liquidus, 260 deg C peak temperature, and no more than three reflow cycles. Wave soldering lists 260 deg C peak temperature for 10 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.