Specifications
| Type | Description |
|---|---|
| Part Number | XL3H4(X)-E |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package/Case | SSOP4; package outline dimensions referenced in mm but numeric dimensions not provided in extracted text |
| Component Type | Other |
| Current Transfer Ratio | 20-300 %; IF=±1 mA, VCE=5 V |
| Isolation Voltage | 3750 Vrms; between input and output |
| Collector-Emitter Breakdown Voltage | ≥80 V; BVCEO |
| Operating Temperature | -55 to +100 °C; ambient operating range |
| Package | SSOP4; case/package type |
| Molding Compound Flammability | UL 94V-0; case molding compound |
| Terminal Finish | matte tin-plated leads; solderability per MIL-STD-202 Method 208 |
| Shipping Quantity | 5000 pcs/tape & reel; XL3H4A SSOP4 ordering option |
| Marking Code | XL3H4A; XL3H4A part number |
| Input Forward Current | ±50 mA; maximum rating, TA=25°C unless otherwise specified |
| Input Power Dissipation | 70 mW; maximum rating, TA=25°C unless otherwise specified |
| Input Power Dissipation Derating Factor | 2.9 mW/°C; above TA=100°C |
| Input Thermal Resistance Junction-Ambient | 325 °C/W; maximum rating table |
| Input Thermal Resistance Junction-Case | 200 °C/W; maximum rating table |
| Output Power Dissipation | 150 mW; maximum rating, TA=25°C unless otherwise specified |
| Collector Current | 50 mA; maximum rating, TA=25°C unless otherwise specified |
| Collector-Emitter Voltage | 80 V; VCEO maximum rating |
| Emitter-Collector Voltage | 7 V; VECO maximum rating |
| Total Power Dissipation | 200 mW; thermal characteristics |
| Isolation Voltage | 3750 Vrms; 40-60% RH, AC for 1 minute |
| Storage Temperature Range | -55 to +125 °C; thermal characteristics |
| Soldering Temperature | 260 °C; for 10 seconds |
| Forward Voltage | typ 1.2 V, max 1.4 V; IF=±20 mA, TA=25°C |
| Input Terminal Capacitance | typ 30 pF, max 250 pF; V=0, f=1 kHz |
| Collector-Emitter Dark Current | max 100 nA; VCE=20 V, IF=0 |
| Collector-Emitter Breakdown Voltage | min 80 V; IC=0.1 mA, IF=0 |
| Emitter-Collector Breakdown Voltage | min 7 V; IE=10 µA, IF=0 |
| Current Transfer Ratio | min 20 %, max 300 %; IF=±1 mA, VCE=5 V |
| Collector-Emitter Saturation Voltage | typ 0.1 V, max 0.2 V; IF=±20 mA, IC=1 mA |
| Isolation Resistance | min 5x10^10 Ω, typ 1x10^11 Ω; DC 500 V, 40-60% RH |
| Floating Capacitance | typ 0.6 pF, max 1.0 pF; V=0, f=1 MHz |
| Cut-off Frequency | typ 80 kHz; VCE=5 V, IC=2 mA, RL=100 Ω, -3 dB |
| Rise Time | max 18 µs; VCE=2 V, RL=100 Ω, IC=2 mA |
| Fall Time | max 18 µs; VCE=2 V, RL=100 Ω, IC=2 mA |
| CTR Rank A | 50-150 %; IF=±1 mA, VCE=5 V |
| CTR Rank B | 100-300 %; IF=±1 mA, VCE=5 V |
| CTR No Mark Rank | 20-300 %; IF=±1 mA, VCE=5 V |
| Reflow Preheat Temperature | 150-200 °C; Ts |
| Reflow Preheat Time | 60-120 s; ts |
| Reflow Ramp-Up Rate | 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; TL |
| Reflow Time Above Liquidus | 60-150 s; tL above TL |
| Reflow Peak Temperature | 260 °C; Tp |
| Reflow Peak Dwell Time | 30 s; Tc between TP-5 and TP |
| Reflow Ramp-Down Rate | 6 °C/s; TP to TL |
| Reflow Cycle Limit | no more than 3 times; recommended reflow profile |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; profile feature |
| Wave Soldering Heating Rate During Preheat | typ 1-2 °C/s, max 4 °C/s; preheat |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp |
| Wave Soldering Peak Time | 10 s; within peak temperature tp |
| Wave Soldering Ramp-Down Rate | max 5 °C/s; profile feature |
| Hand Soldering Iron Temperature | 360 °C +5°C within 3 s; for product rework or sample testing |
| Packing Form | reel, φ330 mm; SSOP4 packing |
| Quantity Per Reel | 5000 pcs/reel; SSOP4 reel packing |
| Quantity Per Box | 2 reels/box; 10000 pcs/box; SSOP4 reel packing |
| Quantity Per Carton | 10 boxes/carton; 100000 pcs/carton; SSOP4 reel packing |
| Antistatic Bag Specification | 380*420 mm; SSOP4 packing |
| Box Specification | 350*340*60 mm; SSOP4 packing |
| Carton Specification | 365*330*370 mm; SSOP4 packing |
| Datasheet Status | request_only |
Product Overview
The XL3H4(X)-E is a XINGLIGHT phototransistor optocoupler listed in the LED category and supplied in an SSOP4 package. The extracted package information identifies SSOP4 and notes that package outline dimensions are referenced in millimeters, although numeric outline dimensions are not provided in the extracted text.
Key isolation and transfer parameters include 3750 Vrms isolation voltage between input and output, 20-300% current transfer ratio at IF=±1 mA and VCE=5 V, and 5x10^10 Ω minimum isolation resistance at DC 500 V and 40-60% RH. CTR rank options are specified as A at 50-150%, B at 100-300%, and no-mark at 20-300%.
Input and output limits include ±50 mA input forward current, 70 mW input power dissipation, 50 mA collector current, 80 V collector-emitter voltage, and 7 V emitter-collector voltage. Assembly information includes 260 °C soldering for 10 seconds, reflow peak temperature of 260 °C, wave soldering peak temperature of 260 °C, and hand soldering at 360 °C +5 °C within 3 seconds.
Key Features
- Phototransistor optocoupler in SSOP4 package
- 3750 Vrms input-output isolation voltage
- 20-300% CTR at IF=±1 mA, VCE=5 V
- 80 V collector-emitter voltage rating
- 50 mA collector current maximum rating
- -55 to +100 °C operating temperature range
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads for specified solderability
- 80 kHz typical cut-off frequency
- 18 µs maximum rise and fall times
- 260 °C peak reflow temperature
- 5000 pcs per SSOP4 reel
Typical Applications
- Input-output signal isolation
- CTR-ranked optocoupler circuits
- SSOP4 isolated interface designs
- Low-current phototransistor coupling
- Reflow-assembled optocoupler boards
- Wave-soldered isolated circuits
- Tape-and-reel automated assembly
Procurement Notes
When requesting a quote for XL3H4(X)-E, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is the XL3H4(X)-E?
The XL3H4(X)-E is identified as a XINGLIGHT phototransistor optocoupler in the LED category. The extracted facts list an SSOP4 package and specify input-output isolation, current transfer ratio, and phototransistor output parameters.
What isolation voltage is specified for XL3H4(X)-E?
The extracted datasheet facts specify 3750 Vrms isolation voltage between input and output. Another extracted condition lists 3750 Vrms at 40-60% RH with AC applied for 1 minute.
What CTR range does this optocoupler provide?
The XL3H4(X)-E current transfer ratio is specified as 20-300% at IF=±1 mA and VCE=5 V. CTR ranks are also listed: rank A is 50-150%, rank B is 100-300%, and no-mark rank is 20-300%.
What package and packing information is provided?
The device is supplied in an SSOP4 package. Packing facts specify a φ330 mm reel, 5000 pcs per reel, 2 reels or 10000 pcs per box, and 10 boxes or 100000 pcs per carton.
What soldering limits are listed for XL3H4(X)-E?
The extracted facts list 260 °C soldering temperature for 10 seconds, a reflow peak temperature of 260 °C, a wave soldering peak temperature of 260 °C for 10 seconds, and hand soldering at 360 °C +5 °C within 3 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.