Specifications
| Type | Description |
|---|---|
| Part Number | XL3H4(X)-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package Case | SSOP4 |
| Current Transfer Ratio | 20-300 %; IF=±1 mA, VCE=5 V |
| Isolation Voltage | 3750 Vrms; Input to output |
| Collector-Emitter Breakdown Voltage | ≥80 V; BVCEO |
| Operating Temperature | -55 to +100 °C; Operating range |
| Package | SSOP4; Case type |
| Molding Compound Flammability | UL 94V-0; Package material rating |
| Lead Finish | Matte tin-plated leads; Terminals |
| Solderability Standard | MIL-STD-202, Method 208; Terminals |
| Shipping Quantity | 5000 pcs/Tape & Reel; Part number XL3H4A, SSOP4 |
| Marking Code | XL3H4A; Part number XL3H4A |
| Forward Current | ±50 mA; Maximum rating, TA=25°C unless otherwise specified |
| Input Power Dissipation | 70 mW; Maximum rating, TA=25°C unless otherwise specified |
| Input Power Dissipation Derating Factor | 2.9 mW/°C; Above TA=100°C |
| Thermal Resistance Junction-Ambient | 325 °C/W; Maximum rating |
| Thermal Resistance Junction-Case | 200 °C/W; Maximum rating |
| Output Power Dissipation | 150 mW; Maximum rating, TA=25°C unless otherwise specified |
| Collector Current | 50 mA; Maximum rating, TA=25°C unless otherwise specified |
| Collector-Emitter Voltage | 80 V; Maximum rating, VCEO |
| Emitter-Collector Voltage | 7 V; Maximum rating, VECO |
| Total Power Dissipation | 200 mW; Maximum rating |
| Isolation Voltage | 3750 Vrms; 40 to 60% RH, AC for 1 minute |
| Operating Temperature | -55 to +100 °C; TOPR |
| Storage Temperature Range | -55 to +125 °C; TSTG |
| Soldering Temperature | 260 °C; For 10 seconds |
| Forward Voltage | Typ 1.2 V, Max 1.4 V; IF=±20 mA, TA=25°C unless otherwise specified |
| Input Terminal Capacitance | Typ 30 pF, Max 250 pF; V=0, f=1 kHz |
| Collector-Emitter Dark Current | Max 100 nA; VCE=20 V, IF=0 |
| Collector-Emitter Breakdown Voltage | Min 80 V; IC=0.1 mA, IF=0 |
| Emitter-Collector Breakdown Voltage | Min 7 V; IE=10 µA, IF=0 |
| Current Transfer Ratio | Min 20 %, Max 300 %; IF=±1 mA, VCE=5 V |
| Collector-Emitter Saturation Voltage | Typ 0.1 V, Max 0.2 V; IF=±20 mA, IC=1 mA |
| Isolation Resistance | Min 5x10^10 Ω, Typ 1x10^11 Ω; DC 500 V, 40-60% R.H. |
| Floating Capacitance | Typ 0.6 pF, Max 1.0 pF; V=0, f=1 MHz |
| Cut-off Frequency | Typ 80 kHz; VCE=5 V, IC=2 mA, RL=100 Ω, -3 dB |
| Rise Time | Max 18 µs; VCE=2 V, RL=100 Ω, IC=2 mA |
| Fall Time | Max 18 µs; VCE=2 V, RL=100 Ω, IC=2 mA |
| CTR Rank A | 50-150 %; IF=±1 mA, VCE=5 V |
| CTR Rank B | 100-300 %; IF=±1 mA, VCE=5 V |
| CTR No Mark Rank | 20-300 %; IF=±1 mA, VCE=5 V |
| Reflow Preheat Temperature | 150-200 °C; Ts |
| Reflow Preheat Time | 60-120 s; ts |
| Reflow Ramp-up Rate | 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; TL |
| Reflow Time Above Liquidus | 60-150 s; tL |
| Reflow Peak Temperature | 260 °C; Tp |
| Reflow Peak Dwell Time | 30 s; Tc between TP-5 and TP |
| Reflow Ramp-down Rate | 6 °C/s; TP to TL |
| Reflow Cycle Limit | No more than 3 times; Recommended reflow profile |
| Wave Soldering Average Ramp-up Rate | ~200 °C/s; Profile feature |
| Wave Soldering Heating Rate During Preheat | Typical 1-2 °C/s, Max 4 °C/s; Preheat |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp |
| Wave Soldering Time Within Peak Temperature | 10 s; tp |
| Wave Soldering Ramp-down Rate | Max 5 °C/s; Profile feature |
| Hand Soldering Iron Temperature | 360 °C +5 °C; Within 3 s; for rework or sample testing |
| Packing Form | Reel, φ330 mm; SSOP4 package |
| Quantity Per Reel | 5000 pcs/reel; SSOP4 package |
| Quantity Per Box | 2 reels/box, 10000 pcs/box; SSOP4 package |
| Quantity Per Carton | 10 boxes/carton, 100000 pcs/carton; SSOP4 package |
| Antistatic Bag Specification | 380 x 420 mm; SSOP4 packing |
| Box Specification | 350 x 340 x 60 mm; SSOP4 packing |
| Carton Specification | 365 x 330 x 370 mm; SSOP4 packing |
| Tape Leader and Trailer | Leave 50 spaces at beginning and 100 spaces at end; SSOP4 reel packing |
| Document Validity | Valid until Dec 31, 2026; Datasheet notice |
| Datasheet Status | request_only |
Product Overview
The XL3H4(X)-G is a XINGLIGHT phototransistor optocoupler in the LED category. Its SSOP4 case combines an input emitter and phototransistor output for isolated signal coupling, with 3750 Vrms isolation specified from input to output. Electrical transfer performance is defined by a 20-300% CTR at IF=±1 mA and VCE=5 V, with rank options of A at 50-150%, B at 100-300%, and no-mark rank at 20-300%.
Output-side ratings include 80 V collector-emitter voltage, 7 V emitter-collector voltage, 50 mA collector current, and at least 80 V collector-emitter breakdown voltage. Dynamic characteristics include 80 kHz typical cut-off frequency and maximum 18 µs rise and fall times under the stated test conditions.
The package uses UL 94V-0 molding compound and matte tin-plated leads meeting MIL-STD-202 Method 208 solderability. Assembly guidance covers 260 °C peak reflow, wave soldering at 260 °C, and hand soldering at 360 °C +5 °C within 3 seconds for rework or sample testing.
Key Features
- Phototransistor optocoupler in compact SSOP4 package
- 3750 Vrms input-to-output isolation voltage rating
- 20-300% CTR at IF=±1 mA, VCE=5 V
- Minimum 80 V collector-emitter breakdown voltage
- -55 to +100 °C operating temperature range
- UL 94V-0 rated molding compound
- Matte tin-plated leads with MIL-STD-202 Method 208 solderability
- Typical 80 kHz cut-off frequency
- Maximum 18 µs rise and fall times
- 5000 pcs/reel SSOP4 tape-and-reel packing
Typical Applications
- Isolated signal transfer
- PLC input interfaces
- Microcontroller I/O isolation
- Industrial control circuits
- Compact optocoupler coupling
- Low-frequency digital isolation
- Equipment requiring 3750 Vrms isolation
Procurement Notes
When requesting a quote for XL3H4(X)-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is XL3H4(X)-G?
XL3H4(X)-G is a XINGLIGHT phototransistor optocoupler in the LED category. The extracted datasheet facts identify the package as SSOP4 and specify current transfer, isolation, output transistor, thermal, soldering, and packing parameters.
What isolation voltage is specified for XL3H4(X)-G?
The datasheet facts specify 3750 Vrms isolation voltage from input to output. A second rating lists 3750 Vrms under 40 to 60% relative humidity with AC applied for 1 minute.
What current transfer ratio does this optocoupler provide?
The current transfer ratio is specified as 20-300% at IF=±1 mA and VCE=5 V. Rank A is 50-150%, rank B is 100-300%, and the no-mark rank is 20-300% under the same test condition.
What assembly temperature limits are listed?
The reflow profile lists 150-200 °C preheat, 217 °C liquidus, 260 °C peak temperature, and no more than three reflow cycles. Wave soldering also lists a 260 °C peak, while hand soldering is 360 °C +5 °C within 3 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.