XL3H7(X)-G SSOP4 Phototransistor Optocoupler

XINGLIGHT LED - specifications, applications, sourcing support and RFQ.

XL3H7(X)-G SSOP4 Phototransistor Optocoupler

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Part Number
XL3H7(X)-G
Manufacturer
XINGLIGHT
Package
SSOP4
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL3H7(X)-G from XINGLIGHT is an LED-category phototransistor optocoupler in an SSOP4 package. The device provides a current transfer ratio of 80-600% at IF=5 mA and VCE=5 V, with rank options from A through D. Isolation ratings include 3750 Vrms for 1 minute, 5000 V rated impulse isolation voltage, and 600 V rated repetitive peak isolation voltage. Electrical limits include 50 mA forward current, 80 V collector-emitter voltage, and 200 mW total power dissipation. It is suited for isolated signal transfer, digital interface isolation, feedback sensing, and compact surface-mount control circuits requiring tape-and-reel assembly.

Specifications

TypeDescription
Part NumberXL3H7(X)-G
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
PackageSSOP4; ordering information
Shipping Quantity5000 pcs/Tape & Reel; part number XL3H7A
Marking CodeXL3H7A; part number XL3H7A
Current Transfer Ratio80-600 %; IF=5 mA, VCE=5 V
Isolation Voltage3750 Vrms; 40-60% RH, AC for 1 minute
Collector-Emitter Breakdown Voltagemin 80 V; IC=0.1 mA, IF=0
Forward Currentmax 50 mA; TA=25°C unless otherwise specified
Peak Forward Currentmax 1 A; pulse width <=1 us, duty ratio 0.001
Reverse Voltagemax 6 V; TA=25°C unless otherwise specified
Input Power Dissipationmax 70 mW; TA=25°C unless otherwise specified
Collector Power Dissipationmax 150 mW; TA=25°C unless otherwise specified
Collector Current Ratingmax 50 mA; TA=25°C unless otherwise specified
Collector-Emitter Voltagemax 80 V; TA=25°C unless otherwise specified
Emitter-Collector Voltagemax 7 V; TA=25°C unless otherwise specified
Total Power Dissipationmax 200 mW; TA=25°C unless otherwise specified
Rated Impulse Isolation Voltage5000 V; thermal characteristics
Rated Repetitive Peak Isolation Voltage600 V; thermal characteristics
Thermal Resistance Junction-to-Air430 °C/W; thermal characteristics
Thermal Resistance Junction-to-Case350 °C/W; thermal characteristics
Thermal Resistance Junction-to-Lead368 °C/W; thermal characteristics
Operating Temperature-55 to +110 °C; thermal characteristics
Storage Temperature Range-55 to +125 °C; thermal characteristics
Soldering Temperature260 °C; for 10 seconds
Forward Voltagetyp 1.2 V, max 1.4 V; IF=20 mA, TA=25°C
Peak Forward Voltagemax 3.0 V; IFM=0.5 A, TA=25°C
Reverse Currentmax 10 uA; VR=4 V, TA=25°C
Input Capacitancetyp 30 pF, max 250 pF; VR=0 V, f=1 kHz, TA=25°C
Collector-Emitter Dark Currentmax 100 nA; VCE=20 V, IF=0, TA=25°C
Emitter-Collector Breakdown Voltagemin 7 V; IE=10 uA, IF=0, TA=25°C
Collector Current Transfer Testmin 2.5 mA, max 30 mA; IF=5 mA, VCE=5 V, TA=25°C
Collector-Emitter Saturation Voltagetyp 0.1 V, max 0.2 V; IF=20 mA, IC=1 mA, TA=25°C
Isolation Resistancemin 1×10^12 ohm; VIO=500 Vdc, 40-60% RH
Isolation Currentmax 2 uA; DC6000 V, 40-60% RH
Floating Capacitancetyp 0.6 pF, max 1.0 pF; VIO=0, f=1 MHz, TA=25°C
Cut-off Frequencytyp 80 kHz; VCE=5 V, IC=2 mA, RL=100 ohm, -3 dB
Turn-On Timetyp 4 us, max 18 us; VCE=2 V, RL=100 ohm, IC=2 mA
Turn-Off Timetyp 3 us, max 18 us; VCE=2 V, RL=100 ohm, IC=2 mA
CTR Rank A80-160 %; IF=5 mA, VCE=5 V
CTR Rank B130-260 %; IF=5 mA, VCE=5 V
CTR Rank C200-400 %; IF=5 mA, VCE=5 V
CTR Rank D300-600 %; IF=5 mA, VCE=5 V
CTR No Mark80-600 %; IF=5 mA, VCE=5 V
Reflow Preheat Temperature150-200 °C; reflow soldering profile
Reflow Preheat Time60-120 s; reflow soldering profile
Reflow Ramp-Up Ratemax 3 °C/s; TL to TP
Reflow Liquidus Temperature217 °C; reflow soldering profile
Reflow Time Above Liquidus60-150 s; temperature above TL
Reflow Peak Temperature260 °C; reflow soldering profile
Reflow Peak Time30 s; time between TP-5 and TP
Reflow Ramp-Down Ratemax 6 °C/s; TP to TL
Wave Soldering Peak Temperature260 °C; wave soldering profile
Wave Soldering Peak Time10 s; time within peak temperature
Hand Soldering Iron Temperature360 °C +5 °C; within 3 s, product rework or sample testing
Packing Quantity Per Reel5000 pcs/reel; SSOP4 reel, diameter 330 mm
Packing Quantity Per Box10000 pcs/box; 2 reels/box
Packing Quantity Per Carton100000 pcs/carton; 10 boxes/carton
Datasheet Statusrequest_only

Product Overview

The XL3H7(X)-G is a XINGLIGHT phototransistor optocoupler classified in the LED category and supplied in an SSOP4 package. Its ordering information identifies the package as SSOP4, with XL3H7A marking code and 5000 pcs per tape-and-reel shipping quantity for the XL3H7A part number variant.

Key transfer and isolation parameters include 80-600% current transfer ratio at IF=5 mA and VCE=5 V, 3750 Vrms isolation voltage for 1 minute at 40-60% RH, and minimum 1×10^12 ohm isolation resistance at VIO=500 Vdc. Output-side ratings include 80 V maximum collector-emitter voltage, 50 mA maximum collector current, and minimum 80 V collector-emitter breakdown voltage.

For assembly, the datasheet gives a 260 °C soldering temperature for 10 seconds, a reflow peak temperature of 260 °C, and SSOP4 reel packing of 5000 pcs per 330 mm reel. These facts support use in compact isolated interfaces, signal feedback paths, and surface-mount control assemblies.

Key Features

  • SSOP4 phototransistor optocoupler package
  • 80-600% CTR at IF=5 mA, VCE=5 V
  • 3750 Vrms isolation voltage for one minute
  • Minimum 80 V collector-emitter breakdown voltage
  • Maximum 50 mA forward current rating
  • Typical 80 kHz cut-off frequency
  • Typical 4 us turn-on time
  • Typical 3 us turn-off time
  • -55 to +110 °C operating temperature range
  • 260 °C peak reflow temperature
  • 5000 pcs per 330 mm SSOP4 reel
  • CTR ranks A, B, C, and D available

Typical Applications

  • Isolated digital signal transfer
  • Microcontroller input isolation
  • Feedback signal isolation
  • Compact surface-mount control boards
  • Low-current transistor output interfaces
  • 80 kHz optocoupled signal paths
  • Tape-and-reel automated assembly

Procurement Notes

When requesting a quote for XL3H7(X)-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package is used for XL3H7(X)-G?

XL3H7(X)-G is specified as an SSOP4 phototransistor optocoupler. The ordering information lists the SSOP4 package, and the packing information describes SSOP4 reels with 5000 pcs per reel.

What is the CTR range of this optocoupler?

The datasheet facts specify an overall current transfer ratio of 80-600% at IF=5 mA and VCE=5 V. Rank options include A at 80-160%, B at 130-260%, C at 200-400%, and D at 300-600%.

What isolation ratings are listed for XL3H7(X)-G?

The extracted datasheet facts list 3750 Vrms isolation voltage for 1 minute at 40-60% RH, 5000 V rated impulse isolation voltage, 600 V rated repetitive peak isolation voltage, and minimum 1×10^12 ohm isolation resistance.

What soldering limits are provided by the datasheet?

The device has a 260 °C soldering temperature for 10 seconds. The reflow profile lists 150-200 °C preheat, 217 °C liquidus, 260 °C peak temperature, and 30 seconds between TP-5 and TP.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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