Specifications
| Type | Description |
|---|---|
| Part Number | XL4502-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Inferred Category | LED |
| Component Type | Other |
| Package / Case | DIP8, DIP8-M, SMD8; package outline dimensions referenced in mm but numeric dimensions not provided in text |
| Data Rate | 1 MBit/s; feature statement |
| Output Type | Open-collector output; feature statement |
| Isolation Voltage Feature | 5000 Vrms; between input and output |
| Operating Temperature Feature | -40 to +100 °C; feature statement |
| Package Options | DIP8, DIP8-M, SMD8; mechanical data / ordering information |
| Molding Compound Flammability | UL 94V-0; mechanical data |
| Terminal Finish | Matte tin-plated leads; solderability per MIL-STD-202, Method 208 |
| DIP8 Shipping Quantity | 45 pcs/tube; part number XL4502*1, package DIP8 |
| DIP8-M Shipping Quantity | 45 pcs/tube; part number XL4502*1M, package DIP8-M |
| SMD8 Shipping Quantity | 1000 pcs/tape and reel; part number XL4502*1S, package SMD8 |
| DC/Average Forward Input Current | 25 mA maximum; Ta=25°C unless otherwise specified |
| Peak Forward Input Current | 50 mA maximum; 50% duty cycle, 1 ms pulse width |
| Input Reverse Voltage | 5 V maximum; Ta=25°C unless otherwise specified |
| Peak Transient Input Current | 1 A maximum; pulse width <=1 us, 300 pps |
| Input Power Dissipation | 45 mW maximum; Ta=25°C unless otherwise specified |
| Supply Voltage | -0.5 to 30 V maximum rating; Ta=25°C unless otherwise specified |
| Output Current | 8 mA maximum; Ta=25°C unless otherwise specified |
| Peak Output Current | 16 mA maximum; Ta=25°C unless otherwise specified |
| Output Power Dissipation | 100 mW maximum; Ta=25°C unless otherwise specified |
| Output Voltage | -0.5 to 20 V maximum rating; Ta=25°C unless otherwise specified |
| Emitter-Base Reverse Voltage | 5 V maximum; Ta=25°C unless otherwise specified |
| Base Current | 5 mA maximum; Ta=25°C unless otherwise specified |
| Isolation Voltage Maximum Rating | 5000 Vrms; 40 to 60% RH, AC for 1 minute |
| Operating Temperature Range | -40 to +100 °C; thermal characteristic |
| Storage Temperature Range | -55 to +125 °C; thermal characteristic |
| Soldering Temperature | 260 °C maximum for 10 seconds |
| Forward Voltage | typ 1.45 V, max 1.7 V; IF=16 mA, Ta=25°C |
| Reverse Breakdown Voltage | min 5 V, typ 20 V; IR=10 uA, Ta=25°C |
| Diode Temperature Coefficient | typ -1.6 mV/°C; IF=16 mA, Ta=25°C |
| High Level Supply Current at 25°C | max 1 uA; VCC=15 V, IF=0 mA, VO=open, Ta=25°C |
| High Level Supply Current 0 to 70°C | max 2 uA; VCC=15 V, IF=0 mA, VO=open, Ta=0 to 70°C |
| Low Level Supply Current | typ 50 uA, max 200 uA; VCC=15 V, IF=16 mA, VO=open, Ta=25°C |
| High Level Output Current at 5.5 V | typ 0.001 uA, max 0.5 uA; VCC=5.5 V, VO=5.5 V, IF=0 mA, Ta=25°C |
| High Level Output Current at 15 V | typ 0.005 uA, max 1 uA; VCC=15 V, VO=15 V, IF=0 mA, Ta=25°C |
| High Level Output Current 0 to 70°C | max 50 uA; VCC=15 V, VO=15 V, IF=0 mA, Ta=0 to 70°C |
| Low Level Output Voltage | typ 0.1 V, max 0.4 V; VCC=4.5 V, IF=16 mA, IO=3 mA, Ta=25°C |
| Current Transfer Ratio | min 19%, typ 24%, max 50%; VCC=4.5 V, VO=0.4 V, IF=16 mA, Ta=25°C |
| Isolation Voltage Electrical | min 5000 VRMS; RH <50%, Ta=25°C, input-output leakage current <=50 uA |
| Isolation Resistance | typ 1×10^12 ohm; VIO=500 V, Ta=25°C |
| Floating Capacitance | typ 0.6 pF; f=1 MHz, Ta=25°C |
| Propagation Delay Time to Output High Level | typ 600 ns, max 800 ns; Ta=-40 to +85°C, VCC=5 V, IF=16 mA, RL=1.9 kohm |
| Propagation Delay Time to Output Low Level | typ 200 ns, max 800 ns; Ta=-40 to +85°C, VCC=5 V, IF=16 mA, RL=1.9 kohm |
| Common Mode Transient Immunity at Output High Level | min 1000 V/us; RL=1.9 kohm, Ta=25°C, IF=0 mA, |VCM|=10 V peak, CL=15 pF |
| Common Mode Transient Immunity at Output Low Level | min 1000 V/us; RL=1.9 kohm, Ta=25°C, IF=16 mA, |VCM|=10 V peak, CL=15 pF |
| Reflow Preheat Temperature | 150 to 200 °C; reflow soldering profile |
| Reflow Preheat Time | 60 to 120 s; reflow soldering profile |
| Reflow Ramp-Up Rate | 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; reflow soldering profile |
| Reflow Time Above Liquidus | 60 to 150 s; temperature above TL |
| Reflow Peak Temperature | 260 °C; reflow soldering profile |
| Reflow Peak Dwell Time | 30 s; time between TP-5°C and TP |
| Reflow Ramp-Down Rate | 6 °C/s; TP to TL |
| Maximum Reflow Cycles | No more than 3 times; recommended reflow soldering condition |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; wave soldering profile |
| Wave Soldering Preheat Heating Rate | typ 1 to 2 °C/s, max 4 °C/s; heating rate during preheat |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp |
| Wave Soldering Peak Time | 10 s; time within peak temperature |
| Wave Soldering Ramp-Down Rate | max 5 °C/s; wave soldering profile |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s; for product rework or sample testing only |
| DIP8 Packing Quantity | 45 pcs/tube, 2250 pcs/box, 22500 pcs/carton; tube 500 mm, 50 tubes/box, 10 boxes/carton |
| DIP8-M Packing Quantity | 45 pcs/tube, 2250 pcs/box, 22500 pcs/carton; tube 500 mm, 50 tubes/box, 10 boxes/carton |
| SMD8 Packing Quantity | 1000 pcs/reel, 2000 pcs/box, 20000 pcs/carton; reel diameter 330 mm, 2 reels/box, 10 boxes/carton |
| Document Validity | Valid until Dec 31, 2026; attention note |
| Datasheet Status | request_only |
Product Overview
XL4502-G is a XINGLIGHT high speed optocoupler listed under the LED category. The datasheet describes a 1 MBit/s device with open-collector output and 5000 Vrms isolation between input and output, supporting isolated digital signal transfer where optical isolation and defined output behavior are required.
Package options are DIP8, DIP8-M, and SMD8. The package outline dimensions are referenced in millimeters, although numeric dimensions are not provided in the extracted text. Mechanical facts include UL 94V-0 molding compound flammability and matte tin-plated leads with solderability per MIL-STD-202, Method 208.
Operating limits include -40 to +100 °C operating temperature, -55 to +125 °C storage temperature, 260 °C soldering for up to 10 seconds, and supply voltage from -0.5 to 30 V. Assembly information covers reflow, wave soldering, and hand-soldering conditions, including a 260 °C reflow peak and no more than three reflow cycles.
Key Features
- 1 MBit/s high speed optocoupler data rate
- Open-collector output for isolated signal switching
- 5000 Vrms input-to-output isolation rating
- -40 to +100 °C operating temperature range
- DIP8, DIP8-M, and SMD8 package options
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads per MIL-STD-202 Method 208
- Typical 0.6 pF floating capacitance at 1 MHz
- Minimum 1000 V/us common-mode transient immunity
- Reflow peak temperature specified at 260 °C
Typical Applications
- Isolated digital signal interfaces
- Open-collector logic isolation
- Controller input-output isolation
- Industrial signal transfer
- Low-capacitance isolation channels
- High speed optocoupler replacement designs
Procurement Notes
When requesting a quote for XL4502-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is XL4502-G?
XL4502-G is identified in the datasheet facts as a XINGLIGHT high speed optocoupler in the LED category. It has a 1 MBit/s data rate, open-collector output, and package options including DIP8, DIP8-M, and SMD8.
What isolation rating is specified for XL4502-G?
The extracted datasheet facts list 5000 Vrms isolation between input and output as a feature. Electrical characteristics also specify minimum 5000 VRMS under RH <50%, Ta=25°C, with input-output leakage current <=50 uA.
Which packages and packing quantities are listed?
Package options are DIP8, DIP8-M, and SMD8. DIP8 and DIP8-M are listed at 45 pcs/tube, 2250 pcs/box, and 22500 pcs/carton. SMD8 is listed at 1000 pcs/reel, 2000 pcs/box, and 20000 pcs/carton.
What soldering conditions are given in the datasheet facts?
The facts specify 260 °C soldering for up to 10 seconds. Reflow data includes 150 to 200 °C preheat, 217 °C liquidus, 260 °C peak, and no more than three reflow cycles. Wave soldering peak temperature is also 260 °C.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 2, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.