Specifications
| Type | Description |
|---|---|
| Part Number | XL4503-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Inferred Category | LED |
| Component Type | Other |
| Package Case | DIP8, DIP8-M, SMD8; package outline dimensions referenced in mm but numeric dimensions not provided in extracted text |
| Data Rate | 1 Mbit/s |
| Output Type | Open-collector output |
| Isolation Voltage | 5000 Vrms |
| Operating Temperature | -40 to +100 °C |
| Package Options | DIP8, DIP8-M, SMD8 |
| Molding Compound Flammability Rating | UL 94V-0 |
| Terminal Finish | Matte tin-plated leads |
| DIP8 Shipping Quantity | 45 pcs/tube |
| DIP8-M Shipping Quantity | 45 pcs/tube |
| SMD8 Shipping Quantity | 1000 pcs/tape and reel |
| DC/Average Forward Input Current | 25 mA |
| Peak Forward Input Current | 50 mA |
| Input Reverse Voltage | 5 V |
| Peak Transient Input Current | 1 A |
| Input Power Dissipation | 45 mW |
| Supply Voltage | -0.5 to 30 V |
| Output Current | 8 mA |
| Peak Output Current | 16 mA |
| Output Power Dissipation | 100 mW |
| Output Voltage | -0.5 to 20 V |
| Emitter-Base Reverse Voltage | 5 V |
| Base Current | 5 mA |
| Isolation Voltage | 5000 Vrms |
| Operating Temperature Range | -40 to +100 °C |
| Storage Temperature Range | -55 to +125 °C |
| Soldering Temperature | 260 °C |
| Forward Voltage | typ 1.45 V, max 1.7 V |
| Reverse Breakdown Input Voltage | min 5 V, typ 20 V |
| Diode Temperature Coefficient | typ -1.6 mV/°C |
| High Level Supply Current | max 1 µA |
| High Level Supply Current | max 2 µA |
| Low Level Supply Current | typ 50 µA, max 200 µA |
| High Level Output Current | typ 0.001 µA, max 0.5 µA |
| High Level Output Current | typ 0.005 µA, max 1 µA |
| High Level Output Current | max 50 µA |
| Low Level Output Voltage | typ 0.1 V, max 0.4 V |
| Current Transfer Ratio | min 19%, typ 24%, max 50% |
| Isolation Voltage | min 5000 VRMS |
| Isolation Resistance | typ 1×10^12 Ω |
| Floating Capacitance | typ 0.6 pF |
| Propagation Delay Time to Output High Level | typ 600 ns, max 800 ns |
| Propagation Delay Time to Output Low Level | typ 200 ns, max 800 ns |
| Common Mode Transient Immunity at Output High Level | min 1000 V/µs |
| Common Mode Transient Immunity at Output Low Level | min 1000 V/µs |
| Reflow Preheat Temperature | 150 to 200 °C |
| Reflow Preheat Time | 60 to 120 s |
| Reflow Ramp-Up Rate | 3 °C/s |
| Reflow Liquidus Temperature | 217 °C |
| Reflow Time Above Liquidus | 60 to 150 s |
| Reflow Peak Temperature | 260 °C |
| Reflow Time Near Peak | 30 s |
| Reflow Ramp-Down Rate | 6 °C/s |
| Reflow Cycle Limit | No more than 3 times |
| Wave Soldering Average Ramp-Up Rate | approximately 200 °C/s |
| Wave Soldering Heating Rate During Preheat | typ 1 to 2 °C/s, max 4 °C/s |
| Wave Soldering Final Preheat Temperature | approximately 130 °C |
| Wave Soldering Preheat Time | >60 s |
| Wave Soldering Peak Temperature | 260 °C |
| Wave Soldering Time Within Peak Temperature | 10 s |
| Wave Soldering Ramp-Down Rate | max 5 °C/s |
| Hand Soldering Iron Temperature | 360 °C +5 °C |
| DIP8 Packing | 45 pcs/tube, 50 tubes/box, 10 boxes/carton |
| DIP8-M Packing | 45 pcs/tube, 50 tubes/box, 10 boxes/carton |
| SMD8 Packing | 1000 pcs/reel, 2 reels/box, 10 boxes/carton |
| DIP8 Tube Carton Quantity | 22500 pcs/carton |
| SMD8 Reel Carton Quantity | 20000 pcs/carton |
| Document Validity | Valid until Dec 31, 2026 |
| Datasheet Status | request_only |
Product Overview
Package options are DIP8, DIP8-M, and SMD8, with package outline dimensions referenced in millimeters but not numerically provided in the extracted text. The molding compound flammability rating is UL 94V-0, and the terminal finish is matte tin-plated leads with solderability referenced to MIL-STD-202 Method 208.
Electrical characteristics include forward voltage of typ 1.45 V and max 1.7 V at IF=16 mA and TA=25°C, current transfer ratio of min 19%, typ 24%, max 50% under the stated test condition, and propagation delays of typ 600 ns to output high and typ 200 ns to output low. Assembly data includes reflow, wave soldering, and hand soldering temperature profiles from the manufacturer datasheet.
Key Features
- 1 Mbit/s feature data rate
- Open-collector output configuration
- 5000 Vrms isolation voltage rating
- -40 to +100 °C operating range
- DIP8, DIP8-M, and SMD8 package options
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads for solderability
- Typical 0.6 pF floating capacitance
- Minimum 1000 V/µs common mode transient immunity
- Reflow peak temperature specified at 260 °C
Typical Applications
- Isolated digital signal transfer
- Open-collector logic isolation
- Controller interface isolation
- High speed optocoupler coupling
- 5000 Vrms isolation barriers
- SMD8 tape-and-reel assembly
- DIP8 tube-packed assembly
Procurement Notes
When requesting a quote for XL4503-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of component is the XL4503-G?
The XL4503-G is identified in the extracted manufacturer datasheet facts as a XINGLIGHT high speed optocoupler in the LED category, with DIP8, DIP8-M, and SMD8 package options.
What isolation voltage is specified for XL4503-G?
The extracted facts list 5000 Vrms isolation as a feature specification and also list minimum 5000 VRMS under RH<50%, TA=25°C, and I-I/O<=50 µA test conditions.
What output configuration does XL4503-G use?
The XL4503-G uses an open-collector output according to the feature specification. Electrical output facts include low level output voltage of typ 0.1 V and max 0.4 V under the stated VCC, IF, IO, and temperature condition.
Which package and packing formats are listed?
The listed package options are DIP8, DIP8-M, and SMD8. DIP8 and DIP8-M packing is 45 pcs per tube, while SMD8 packing is 1000 pcs per reel according to the extracted packing data.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 2, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.