Specifications
| Type | Description |
|---|---|
| Part Number | XL4504-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Data Rate | 1 Mbit/s |
| Output Type | Open-collector output |
| Isolation Voltage | 5000 Vrms |
| Operating Temperature | -40 to +100 °C |
| Case Options | DIP8, DIP8-M, SMD8 |
| Molding Compound Flammability | UL 94V-0 |
| Terminal Plating | Matte tin-plated leads |
| Package Shipping Quantity, XL4504*1 DIP8 | 45 pcs/tube |
| Package Shipping Quantity, XL4504*1M DIP8-M | 45 pcs/tube |
| Package Shipping Quantity, XL4504*1S SMD8 | 1000 pcs/tape and reel |
| DC/Average Forward Input Current | 25 mA |
| Peak Forward Input Current | 50 mA |
| Input Reverse Voltage | 5 V |
| Peak Transient Input Current | 1 A |
| Input Power Dissipation | 45 mW |
| Supply Voltage | -0.5 to 30 V |
| Output Current | 8 mA |
| Peak Output Current | 16 mA |
| Output Power Dissipation | 100 mW |
| Output Voltage | -0.5 to 20 V |
| Emitter-Base Reverse Voltage | 5 V |
| Base Current | 5 mA |
| Isolation Voltage, AC 1 Minute | 5000 Vrms |
| Operating Temperature, Thermal Characteristics | -40 to +100 °C |
| Storage Temperature Range | -55 to +125 °C |
| Soldering Temperature | 260 °C for 10 seconds |
| Forward Voltage | Typ 1.45 V, Max 1.7 V |
| Reverse Breakdown Input Voltage | Min 5 V, Typ 20 V |
| Diode Temperature Coefficient | Typ -1.6 mV/°C |
| High Level Supply Current, TA=25°C | Max 1 uA |
| High Level Supply Current, TA=0 to 70°C | Max 2 uA |
| Low Level Supply Current | Typ 50 uA, Max 200 uA |
| High Level Output Current, VCC=5.5 V | Typ 0.001 uA, Max 0.5 uA |
| High Level Output Current, VCC=15 V | Typ 0.005 uA, Max 1 uA |
| High Level Output Current, TA=0 to 70°C | Max 50 uA |
| Low Level Output Voltage | Typ 0.1 V, Max 0.4 V |
| Current Transfer Ratio | Min 19%, Typ 24%, Max 50% |
| Isolation Voltage, RH <50% | Min 5000 VRMS |
| Isolation Resistance | Typ 1×10^12 ohm |
| Floating Capacitance | Typ 0.6 pF |
| Propagation Delay Time to Output High Level | Typ 600 ns, Max 800 ns |
| Propagation Delay Time to Output Low Level | Typ 200 ns, Max 800 ns |
| Common Mode Transient Immunity at Output High Level | Min 1000 V/us |
| Common Mode Transient Immunity at Output Low Level | Min 1000 V/us |
| Reflow Preheat Temperature | Min 150 °C, Max 200 °C |
| Reflow Preheat Time | Min 60 s, Max 120 s |
| Reflow Ramp-Up Rate | Max 3 °C/s |
| Reflow Liquidus Temperature | 217 °C |
| Reflow Time Above Liquidus | Min 60 s, Max 150 s |
| Reflow Peak Temperature | 260 °C |
| Reflow Peak Time | 30 s |
| Reflow Ramp-Down Rate | Max 6 °C/s |
| Reflow Cycles | No more than 3 times |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s |
| Wave Soldering Heating Rate During Preheat | Typical 1 to 2 °C/s, Max 4 °C/s |
| Wave Soldering Final Preheat Temperature | ~130 °C |
| Wave Soldering Preheat Time | >60 s |
| Wave Soldering Peak Temperature | 260 °C |
| Wave Soldering Peak Time | 10 s |
| Wave Soldering Ramp-Down Rate | Max 5 °C/s |
| Hand Soldering Iron Temperature | 360 °C +5 °C |
| DIP8 Packing | 45 pcs/tube, 50 tubes/box, 10 boxes/carton |
| DIP8-M Packing | 45 pcs/tube, 50 tubes/box, 10 boxes/carton |
| SMD8 Packing | 1000 pcs/reel, 2 reels/box, 10 boxes/carton |
| DIP8 Carton Quantity | 22500 pcs/carton |
| DIP8-M Carton Quantity | 22500 pcs/carton |
| SMD8 Carton Quantity | 20000 pcs/carton |
| Datasheet Status | request_only |
Product Overview
The XL4504-G is a XINGLIGHT high speed optocoupler categorized under LED. Its feature specifications identify a 1 Mbit/s data rate, open-collector output, 5000 Vrms isolation voltage, and an operating temperature range of -40 to +100 °C. Electrical characteristics include forward voltage of typ 1.45 V and max 1.7 V at IF=16 mA, current transfer ratio of min 19%, typ 24%, max 50%, and floating capacitance of typ 0.6 pF at 1 MHz.
Package options are DIP8, DIP8-M, and SMD8. Mechanical data lists UL 94V-0 molding compound and matte tin-plated leads with solderability per MIL-STD-202, Method 208. Shipping options include 45 pcs/tube for DIP8 and DIP8-M variants, and 1000 pcs/tape and reel for SMD8.
Assembly data covers reflow, wave soldering, and hand soldering limits, including 260 °C reflow and wave soldering peak temperatures. Based on its isolation, propagation delay, common-mode transient immunity, and open-collector output, the part is suited to isolated digital signal interface applications.
Key Features
- 1 Mbit/s high speed optocoupler data rate
- Open-collector output stage
- 5000 Vrms isolation voltage rating
- -40 to +100 °C operating temperature range
- DIP8, DIP8-M, and SMD8 case options
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads with MIL-STD-202 solderability
- Typical 0.6 pF floating capacitance at 1 MHz
- Maximum 800 ns propagation delay ratings
- Minimum 1000 V/us common mode transient immunity
Typical Applications
- Isolated digital signal interfaces
- Open-collector logic isolation
- Industrial control signal isolation
- Microcontroller I/O isolation
- Communication line isolation
- Noise-sensitive control inputs
- High-speed optocoupler replacement designs
Procurement Notes
When requesting a quote for XL4504-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What product type is the XL4504-G?
The XL4504-G is identified as a XINGLIGHT high speed optocoupler in the LED category. The extracted datasheet facts list a 1 Mbit/s data rate, open-collector output, and 5000 Vrms isolation voltage.
Which package options are listed for XL4504-G?
The listed case options are DIP8, DIP8-M, and SMD8. Package outline dimensions are referenced in millimeters in the provided text, but numeric outline dimensions were not present in the extracted facts.
What are the main isolation and timing specifications?
The part lists 5000 Vrms isolation voltage and typ 1×10^12 ohm isolation resistance. Propagation delay is typ 600 ns, max 800 ns to output high level, and typ 200 ns, max 800 ns to output low level.
What soldering limits are provided for assembly?
The reflow profile lists 260 °C peak temperature, 217 °C liquidus temperature, and no more than three reflow cycles. Wave soldering also lists a 260 °C peak for 10 seconds, while hand soldering is 360 °C +5 °C within 3 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 2, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.