Specifications
| Type | Description |
|---|---|
| Part Number | XL4N25-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | DIP6 / SMD6 |
| Component Type | Other |
| Current Transfer Ratio | >=20 %; IF=10 mA, VCE=10 V |
| Isolation Voltage | 5000 Vrms; input to output |
| Operating Temperature | -55 to +100 °C; operating range |
| Case | DIP6, SMD6; mechanical data |
| Molding Compound Flammability | UL 94V-0; mechanical data |
| Terminal Finish | Matte tin-plated leads; solderability per MIL-STD-202 Method 208 |
| DIP6 Shipping Quantity | 65 pcs/tube; part number XL4N25, package DIP6 |
| SMD6 Shipping Quantity | 1000 pcs/tape and reel; part number XL4N25S, package SMD6 |
| Forward Current | 60 mA; maximum rating, TA=25°C |
| Forward Peak Current | 1 A; pulse width <=1 us, duty ratio 0.001, TA=25°C |
| Reverse Voltage | 6 V; maximum rating, input, TA=25°C |
| Input Power Dissipation | 100 mW; maximum rating, TA=25°C |
| Collector Power Dissipation | 300 mW; maximum rating, TA=25°C |
| Collector Current | 100 mA; maximum rating, TA=25°C |
| Collector-Base Voltage | 70 V; maximum rating, TA=25°C |
| Collector-Emitter Voltage | 30 V; maximum rating, TA=25°C |
| Emitter-Collector Voltage | 7 V; maximum rating, TA=25°C |
| Total Power Dissipation | 350 mW; thermal characteristic, TA=25°C |
| Isolation Voltage | 5000 Vrms; 40 to 60% RH, AC for 1 minute; pins 1,2,3 shorted and pins 4,5,6 shorted together |
| Operating Temperature | -55 to +100 °C; thermal characteristic |
| Storage Temperature Range | -55 to +125 °C; thermal characteristic |
| Soldering Temperature | 260 °C; for 10 seconds |
| Forward Voltage | typ 1.2 V, max 1.5 V; IF=10 mA, TA=25°C |
| Reverse Current | max 10 uA; VR=3 V, TA=25°C |
| Input Capacitance | typ 50 pF; V=0 V, f=1 kHz, TA=25°C |
| Collector Dark Current | max 50 nA; VCE=10 V, TA=25°C |
| Collector-Base Breakdown Voltage | min 70 V; IB=0.1 mA, IF=0, TA=25°C |
| Collector-Emitter Breakdown Voltage | min 30 V; IC=0.1 mA, IF=0, TA=25°C |
| Emitter-Collector Breakdown Voltage | min 7 V; IE=0.01 mA, IF=0, TA=25°C |
| Current Transfer Ratio | min 20 %; IF=10 mA, VCE=10 V, TA=25°C |
| Collector-Emitter Saturation Voltage | typ 0.5 V; IF=50 mA, IC=2 mA, TA=25°C |
| Isolation Resistance | min 5*10^10 ohm, typ 10^11 ohm; DC 500 V, 40 to 60% RH, TA=25°C |
| Isolation Capacitance | typ 1 pF, max 2.5 pF; V=0 V, f=1 MHz, TA=25°C |
| Response Time Rise | typ 3 us, max 10 us; VCE=10 V, IC=2 mA, RL=100 ohm, TA=25°C |
| Response Time Fall | typ 3 us, max 10 us; VCE=10 V, IC=2 mA, RL=100 ohm, TA=25°C |
| Reflow Preheat Temperature | 150 to 200 °C; reflow soldering profile |
| Reflow Preheat Time | 60 to 120 s; reflow soldering profile |
| Reflow Ramp-Up Rate | max 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; reflow soldering profile |
| Reflow Time Above Liquidus | 60 to 150 s; above TL=217°C |
| Reflow Peak Temperature | 260 °C; reflow soldering profile |
| Reflow Peak Time | max 30 s; time during which TC is between TP-5 and TP |
| Reflow Ramp-Down Rate | max 6 °C/s; TP to TL |
| Reflow Cycles | no more than 3 times; recommended reflow soldering |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; wave soldering profile |
| Wave Soldering Heating Rate During Preheat | typ 1 to 2 °C/s, max 4 °C/s; wave soldering profile |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp |
| Wave Soldering Peak Time | 10 s; time within peak temperature |
| Wave Soldering Ramp-Down Rate | max 5 °C/s; wave soldering profile |
| Hand Soldering Iron Temperature | 360 °C +5 °C; within 3 s; for product rework or sample testing |
| DIP6 Packing | 65 pcs/tube, 50 tubes/box, 10 boxes/carton; tube 500 mm, straight insert type material tube |
| DIP6 Packing Totals | 3250 pcs/box, 32500 pcs/carton; DIP6 tube packing |
| SMD6 Packing | 1000 pcs/reel, 2 reels/box, 10 boxes/carton; reel diameter 330 mm |
| SMD6 Packing Totals | 2000 pcs/box, 20000 pcs/carton; SMD6 reel packing |
| Datasheet Status | request_only |
Product Overview
XL4N25-G is a XINGLIGHT phototransistor optocoupler in the LED category, offered with DIP6 and SMD6 mechanical case options. The datasheet identifies a molding compound flammability rating of UL 94V-0 and matte tin-plated leads with solderability per MIL-STD-202 Method 208.
Electrically, the device specifies 5000 Vrms input-to-output isolation and a minimum current transfer ratio of 20% at IF=10 mA and VCE=10 V. Input characteristics include 60 mA maximum forward current, 6 V reverse voltage, 100 mW input power dissipation, 1.2 V typical forward voltage at IF=10 mA, and 50 pF typical input capacitance.
Output-side ratings include 100 mA collector current, 300 mW collector power dissipation, 70 V collector-base voltage, 30 V collector-emitter voltage, and 7 V emitter-collector voltage. The response time rise and fall values are each 3 us typical and 10 us maximum under the stated VCE, IC, and load conditions. Packing and assembly data cover DIP6 tube shipments, SMD6 reel shipments, reflow soldering, wave soldering, and hand soldering.
Key Features
- Phototransistor optocoupler product type
- DIP6 and SMD6 case options
- 5000 Vrms input-to-output isolation voltage
- Minimum 20% current transfer ratio
- -55 to +100 °C operating range
- UL 94V-0 molding compound flammability
- Matte tin-plated leads
- 60 mA maximum forward current
- 100 mA maximum collector current
- 3 us typical rise and fall times
- Reflow peak temperature rated at 260 °C
- DIP6 tube and SMD6 reel packing
Typical Applications
- Input-to-output signal isolation
- Phototransistor output switching
- DIP6 through-hole assemblies
- SMD6 surface-mount assemblies
- Circuits requiring 5000 Vrms isolation
- Designs using 20% minimum CTR
- Temperature-exposed control circuits
- Reflow or wave soldered boards
Procurement Notes
When requesting a quote for XL4N25-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package options are specified for XL4N25-G?
The extracted datasheet facts list DIP6 and SMD6 mechanical case options. DIP6 packing is 65 pcs per tube, while SMD6 packing is 1000 pcs per reel with tape-and-reel shipment.
What isolation rating does the XL4N25-G provide?
The device specifies 5000 Vrms isolation voltage from input to output. One test condition states AC for 1 minute at 40 to 60% RH with input pins shorted together and output pins shorted together.
What current transfer ratio is listed for this optocoupler?
The current transfer ratio is specified as at least 20%. The detailed electrical condition is IF=10 mA, VCE=10 V, and TA=25°C for the minimum 20% value.
What soldering limits are included in the datasheet facts?
The facts list 260 °C soldering temperature for 10 seconds, 260 °C reflow peak temperature, no more than three reflow cycles, 260 °C wave soldering peak temperature, and 360 °C +5 °C hand soldering iron temperature within 3 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.