Specifications
| Type | Description |
|---|---|
| Part Number | XL4N25S-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package Case | SMD6; package outline dimensions referenced in mm but numeric dimensions not provided in extracted text |
| Package type | SMD6; condition: Part number XL4N25S-G; ordering code S denotes SMD6 |
| Shipping quantity | 1000 pcs/Tape & Reel; condition: XL4N25S SMD6 ordering information |
| Marking code | XL4N25; condition: XL4N25S SMD6 ordering information |
| Current Transfer Ratio | min 20 %; condition: IF=10 mA, VCE=10 V |
| Isolation Voltage | 5000 Vrms; condition: Between input and output |
| Operating Temperature | -55 to +100 °C; condition: General feature |
| Case material flammability rating | UL 94V-0; condition: Molding compound |
| Forward Current | 60 mA; condition: Maximum rating, TA=25°C unless otherwise specified |
| Forward Peak Current | 1 A; condition: Pulse width <=1 us, duty ratio 0.001; TA=25°C unless otherwise specified |
| Reverse Voltage | 6 V; condition: Input maximum rating, TA=25°C unless otherwise specified |
| Input Power Dissipation | 100 mW; condition: Maximum rating, TA=25°C unless otherwise specified |
| Collector Power Dissipation | 300 mW; condition: Output maximum rating, TA=25°C unless otherwise specified |
| Collector Current | 100 mA; condition: Output maximum rating, TA=25°C unless otherwise specified |
| Collector-Base Voltage | 70 V; condition: VCBO maximum rating, TA=25°C unless otherwise specified |
| Collector-Emitter Voltage | 30 V; condition: VCEO maximum rating, TA=25°C unless otherwise specified |
| Emitter-Collector Voltage | 7 V; condition: VECO maximum rating, TA=25°C unless otherwise specified |
| Total Power Dissipation | 350 mW; condition: Thermal characteristic, TA=25°C unless otherwise specified |
| Isolation Voltage | 5000 Vrms; condition: 40 to 60% RH, AC for 1 minute; pins 1,2,3 shorted and pins 4,5,6 shorted together |
| Operating Temperature | -55 to +100 °C; condition: Thermal characteristic |
| Storage Temperature Range | -55 to +125 °C; condition: Thermal characteristic |
| Soldering Temperature | 260 °C; condition: For 10 seconds |
| Forward Voltage | typ 1.2 V, max 1.5 V; condition: IF=10 mA, TA=25°C unless otherwise specified |
| Reverse Current | max 10 uA; condition: VR=3 V, TA=25°C unless otherwise specified |
| Input Capacitance | typ 50 pF; condition: V=0 V, f=1 kHz, TA=25°C unless otherwise specified |
| Collector Dark Current | max 50 nA; condition: VCE=10 V, TA=25°C unless otherwise specified |
| Collector-Base Breakdown Voltage | min 70 V; condition: IB=0.1 mA, IF=0, TA=25°C unless otherwise specified |
| Collector-Emitter Breakdown Voltage | min 30 V; condition: IC=0.1 mA, IF=0, TA=25°C unless otherwise specified |
| Emitter-Collector Breakdown Voltage | min 7 V; condition: IE=0.01 mA, IF=0, TA=25°C unless otherwise specified |
| Current Transfer Ratio | min 20 %; condition: IF=10 mA, VCE=10 V, TA=25°C unless otherwise specified |
| Collector-Emitter Saturation Voltage | typ 0.5 V; condition: IF=50 mA, IC=2 mA, TA=25°C unless otherwise specified |
| Isolation Resistance | min 5*10^10 ohm, typ 10^11 ohm; condition: DC 500 V, 40 to 60% RH, TA=25°C unless otherwise specified |
| Isolation Capacitance | typ 1 pF, max 2.5 pF; condition: V=0 V, f=1 MHz, TA=25°C unless otherwise specified |
| Response Time Rise | typ 3 us, max 10 us; condition: VCE=10 V, IC=2 mA, RL=100 ohm, TA=25°C unless otherwise specified |
| Response Time Fall | typ 3 us, max 10 us; condition: VCE=10 V, IC=2 mA, RL=100 ohm, TA=25°C unless otherwise specified |
| Reflow Preheat Temperature | min 150 °C, max 200 °C; condition: Reflow soldering profile |
| Reflow Preheat Time | min 60 s, max 120 s; condition: Reflow soldering profile |
| Reflow Ramp-up Rate | max 3 °C/s; condition: TL to TP |
| Reflow Liquidus Temperature | 217 °C; condition: Reflow soldering profile |
| Reflow Time Above Liquidus | min 60 s, max 150 s; condition: Above TL |
| Reflow Peak Temperature | 260 °C; condition: Reflow soldering profile |
| Reflow Time Near Peak | max 30 s; condition: Time during which Tc is between TP-5 and TP |
| Reflow Ramp-down Rate | max 6 °C/s; condition: TP to TL |
| Wave Soldering Peak Temperature | 260 °C; condition: Wave soldering profile |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s; condition: For product rework or sample testing |
| SMD6 reel packing quantity | 1000 pcs/reel, 2000 pcs/box, 20000 pcs/carton; condition: SMD6 reel packing, phi 330 mm reel |
| Datasheet Status | request_only |
Product Overview
The XL4N25S-G is a XINGLIGHT phototransistor optocoupler listed under the LED category. It uses an SMD6 package, with ordering information identifying the SMD6 option, XL4N25 marking code, and 1000 pcs/Tape & Reel shipping quantity.
Electrical parameters include 5000 Vrms isolation between input and output and a minimum 20% current transfer ratio at IF=10 mA and VCE=10 V. Input-side limits include 60 mA forward current, 1 A forward peak current, 6 V reverse voltage, and 100 mW input power dissipation. Output-side ratings include 100 mA collector current, 300 mW collector power dissipation, 70 V VCBO, 30 V VCEO, and 7 V VECO.
For assembly, the extracted soldering data lists 260 °C soldering for 10 seconds, a 260 °C reflow peak, 217 °C liquidus temperature, and 260 °C wave soldering peak. These facts support use in isolated signal interfaces that require an SMD6 optocoupler with defined CTR, isolation, temperature, and soldering limits.
Key Features
- SMD6 package with XL4N25 marking code
- 5000 Vrms isolation between input and output
- Minimum 20% CTR at IF=10 mA
- -55 to +100 °C operating temperature range
- 60 mA maximum forward current rating
- 100 mA maximum collector current rating
- Typical 1.2 V forward voltage at 10 mA
- Typical 3 us rise and fall response times
- UL 94V-0 molding compound flammability rating
- 1000 pcs per tape and reel shipping quantity
Typical Applications
- Isolated signal coupling
- Input-to-output electrical isolation
- SMD optocoupler assemblies
- Phototransistor output interfaces
- Reflow soldered circuit boards
- Wave soldered circuit boards
Procurement Notes
When requesting a quote for XL4N25S-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package is used by the XL4N25S-G?
The XL4N25S-G uses an SMD6 package. The extracted ordering information states that the S ordering code denotes SMD6, and the package outline dimensions are referenced in millimeters without numeric dimensions in the extracted text.
What isolation rating is specified for XL4N25S-G?
The extracted datasheet facts specify 5000 Vrms isolation voltage between input and output. A detailed condition also lists AC for 1 minute at 40 to 60% RH with input pins and output pins shorted together.
What current transfer ratio does XL4N25S-G provide?
The current transfer ratio is specified as minimum 20%. The stated test condition is IF=10 mA and VCE=10 V, with the electrical-characteristic entry also noting TA=25°C unless otherwise specified.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 2, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.