Specifications
| Type | Description |
|---|---|
| Part Number | XL4N35S-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Current Transfer Ratio | ≥100%; IF=10mA, VCE=10V |
| Isolation Voltage | 5000 Vrms; between input and output |
| Operating Temperature | -55 to +100 °C; feature specification |
| Package Type | SMD6; part number XL4N35S uses S package option |
| Shipping Quantity | 1000 pcs/Tape & Reel; XL4N35S SMD6 ordering information |
| Marking Code | XL4N35; XL4N35S SMD6 ordering information |
| Forward Current | 60 mA; maximum rating, TA=25°C unless otherwise specified |
| Forward Peak Current | 1 A; pulse width ≤1 µs, duty ratio 0.001 |
| Reverse Voltage | 6 V; input maximum rating, TA=25°C unless otherwise specified |
| Input Power Dissipation | 100 mW; maximum rating, TA=25°C unless otherwise specified |
| Collector Power Dissipation | 300 mW; output maximum rating, TA=25°C unless otherwise specified |
| Collector Current | 100 mA; output maximum rating, TA=25°C unless otherwise specified |
| Collector-Base Voltage | 70 V; output maximum rating, TA=25°C unless otherwise specified |
| Collector-Emitter Voltage | 30 V; output maximum rating, TA=25°C unless otherwise specified |
| Emitter-Collector Voltage | 7 V; output maximum rating, TA=25°C unless otherwise specified |
| Total Power Dissipation | 350 mW; thermal characteristic, TA=25°C unless otherwise specified |
| Isolation Voltage Test | 5000 Vrms; 40 to 60% RH, AC for 1 minute; pins 1,2,3 shorted and pins 4,5,6 shorted |
| Operating Temperature Thermal | -55 to +100 °C; thermal characteristic |
| Storage Temperature Range | -55 to +125 °C; thermal characteristic |
| Soldering Temperature | 260 °C; for 10 seconds |
| Forward Voltage | typ 1.2 V, max 1.5 V; IF=10mA, TA=25°C unless otherwise specified |
| Reverse Current | max 10 µA; VR=3V, TA=25°C unless otherwise specified |
| Input Capacitance | typ 50 pF; V=0V, f=1kHz, TA=25°C unless otherwise specified |
| Collector Dark Current | max 50 nA; VCE=10V, TA=25°C unless otherwise specified |
| Collector-Base Breakdown Voltage | min 70 V; IB=0.1mA, IF=0, TA=25°C unless otherwise specified |
| Collector-Emitter Breakdown Voltage | min 30 V; IC=0.1mA, IF=0, TA=25°C unless otherwise specified |
| Emitter-Collector Breakdown Voltage | min 7 V; IE=0.01mA, IF=0, TA=25°C unless otherwise specified |
| Current Transfer Ratio Electrical | min 100%; IF=10mA, VCE=10V, TA=25°C unless otherwise specified |
| Collector-Emitter Saturation Voltage | typ 0.3 V; IF=50mA, IC=2mA, TA=25°C unless otherwise specified |
| Isolation Resistance | min 5×10^10 Ω, typ 10^11 Ω; DC500V, 40 to 60% RH, TA=25°C unless otherwise specified |
| Isolation Capacitance | typ 1 pF, max 2.5 pF; V=0, f=1MHz, TA=25°C unless otherwise specified |
| Response Time Rise | typ 3 µs, max 10 µs; VCE=10V, IC=2mA, RL=100Ω, TA=25°C unless otherwise specified |
| Response Time Fall | typ 3 µs, max 10 µs; VCE=10V, IC=2mA, RL=100Ω, TA=25°C unless otherwise specified |
| Reflow Preheat Temperature | min 150 °C, max 200 °C; reflow soldering profile |
| Reflow Preheat Time | min 60 s, max 120 s; reflow soldering profile |
| Reflow Ramp-Up Rate | max 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; reflow soldering profile |
| Reflow Time Above Liquidus | min 60 s, max 150 s; above TL |
| Reflow Peak Temperature | 260 °C; reflow soldering profile |
| Reflow Peak Time | max 30 s; Tc between TP-5 and TP |
| Reflow Ramp-Down Rate | max 6 °C/s; TP to TL |
| Reflow Cycle Limit | no more than 3 times; recommended reflow soldering profile |
| Wave Soldering Average Ramp-Up Rate | about 200 °C/s; wave soldering profile |
| Wave Soldering Heating Rate During Preheat | typ 1 to 2 °C/s, max 4 °C/s; wave soldering profile |
| Wave Soldering Final Preheat Temperature | about 130 °C; Ts, wave soldering profile |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp, wave soldering profile |
| Wave Soldering Peak Time | 10 s; time within peak temperature tp |
| Wave Soldering Ramp-Down Rate | max 5 °C/s; wave soldering profile |
| Hand Soldering Iron Temperature | 360 °C ±5 °C; within 3 s; for product rework or sample testing |
| SMD6 Packing | 1000 pcs/reel, 2000 pcs/box, 20000 pcs/carton |
| Datasheet Status | request_only |
Product Overview
XL4N35S-G is a XINGLIGHT phototransistor optocoupler categorized under LED components. The SMD6 package option is identified for the XL4N35S ordering information, with a marking code of XL4N35 and tape-and-reel shipping quantity of 1000 pieces. The broader package information also lists DIP6, while the package outline dimensions are referenced in millimeters without numeric dimensions in the extracted text.
The device provides 5000 Vrms isolation between input and output and a minimum current transfer ratio of 100% at IF=10 mA and VCE=10 V. Input ratings include 60 mA forward current, 1 A forward peak current under the specified pulse condition, 6 V reverse voltage, and 100 mW input power dissipation. Output ratings include 100 mA collector current, 70 V collector-base voltage, 30 V collector-emitter voltage, and 7 V emitter-collector voltage.
Assembly data covers reflow, wave, and hand soldering limits, including 260 °C peak reflow and wave soldering temperatures and a 360 °C ±5 °C hand-soldering condition within 3 seconds. These facts support use in isolated signal interfaces and circuits requiring input-to-output separation.
Key Features
- Phototransistor optocoupler with SMD6 package option
- Minimum 100% CTR at IF=10mA, VCE=10V
- 5000 Vrms isolation between input and output
- -55 to +100 °C operating temperature range
- 60 mA maximum forward current rating
- 100 mA maximum collector current rating
- 30 V collector-emitter voltage maximum rating
- Typical 3 µs rise and fall response times
- 260 °C peak reflow soldering profile
- SMD6 reel packing: 1000 pcs per reel
Typical Applications
- Optically isolated signal transfer
- Input-to-output circuit isolation
- Isolated switching interfaces
- Phototransistor output coupling
- SMD6 optocoupler assemblies
- Reflow-soldered control boards
- Wave-soldered circuit assemblies
Procurement Notes
When requesting a quote for XL4N35S-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is XL4N35S-G?
XL4N35S-G is a XINGLIGHT phototransistor optocoupler in the LED category. The extracted datasheet facts identify the SMD6 package option for XL4N35S and also list DIP6 within the package information.
What isolation rating is specified for XL4N35S-G?
The datasheet facts specify 5000 Vrms isolation between input and output. A test condition is also listed as AC for 1 minute at 40 to 60% RH, with pins 1,2,3 shorted and pins 4,5,6 shorted.
What current transfer ratio does XL4N35S-G provide?
The current transfer ratio is specified as at least 100% under IF=10 mA and VCE=10 V. The electrical table also lists minimum 100% CTR at TA=25°C unless otherwise specified.
What soldering limits are listed for XL4N35S-G?
The soldering information includes a 260 °C reflow peak temperature, no more than three reflow cycles, 260 °C wave soldering peak temperature for 10 seconds, and 360 °C ±5 °C hand soldering within 3 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 2, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.