Specifications
| Type | Description |
|---|---|
| Part Number | XL601 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SOP6-P for XL601P; SOP6-W also listed for series; package dimensions referenced in mm but not numerically present in provided text |
| Component Type | Other |
| Inferred Category | LED |
| Data Rate | 10 MBit/s; condition: feature statement; source page: 1 |
| Isolation Voltage | 5000 Vrms; condition: feature statement / input-output isolation; source page: 1 |
| Operating Temperature Range | -40 to +85 °C; condition: feature statement; source page: 1 |
| Package Type | SOP6-P; condition: part number XL601P ordering information; source page: 2 |
| Shipping Quantity | 1000 pcs/Tape & Reel; condition: part number XL601P; source page: 2 |
| Marking Code | XL601; condition: part number XL601P; source page: 2 |
| Forward Current | 50 mA max; condition: maximum rating, TA=25°C unless otherwise specified; source page: 2 |
| Input Reverse Voltage | 5 V max; condition: maximum rating, TA=25°C unless otherwise specified; source page: 2 |
| Power Dissipation | 100 mW max; condition: maximum rating, TA=25°C unless otherwise specified; source page: 2 |
| Collector Output Power Dissipation | 85 mW max; condition: maximum rating, TA=25°C unless otherwise specified; source page: 2 |
| Output Current | 50 mA max; condition: maximum rating, TA=25°C unless otherwise specified; source page: 2 |
| Output Supply Voltage | 7 V max; condition: maximum rating, TA=25°C unless otherwise specified; source page: 2 |
| Output Voltage | 7 V max; condition: maximum rating, TA=25°C unless otherwise specified; source page: 2 |
| Isolation Voltage | 5000 Vrms; condition: 40 to 60% RH, AC for 1 minute; source page: 3 |
| Operating Temperature | -40 to +85 °C; condition: thermal characteristic; source page: 3 |
| Storage Temperature Range | -55 to +125 °C; condition: thermal characteristic; source page: 3 |
| Soldering Temperature | 260 °C; condition: for 10 seconds; source page: 3 |
| Forward Voltage | 1.33 V typ, 1.8 V max; condition: IF=10 mA, TA=25°C unless otherwise specified; source page: 3 |
| Reverse Breakdown Voltage | 5 V min, 20 V typ, 45 V max; condition: IR=10 µA, TA=25°C unless otherwise specified; source page: 3 |
| Input Capacitance | 70 pF typ; condition: VR=0 V, f=1 kHz, TA=25°C unless otherwise specified; source page: 3 |
| Diode Temperature Coefficient | -1.9 mV/°C typ; condition: IF=10 mA, TA=25°C unless otherwise specified; source page: 3 |
| High Level Supply Current | 6.0 mA typ, 9 mA max; condition: VCC=5.5 V, IF=0 mA, TA=25°C unless otherwise specified; source page: 3 |
| Low Level Supply Current | 7.5 mA typ, 10 mA max; condition: VCC=5.5 V, IF=10 mA, TA=25°C unless otherwise specified; source page: 3 |
| High Level Output Current | 2.1 µA typ, 30 µA max; condition: VCC=5.5 V, VO=5.5 V, IF=250 µA, TA=25°C unless otherwise specified; source page: 3 |
| Low Level Output Voltage | 0.4 V typ, 0.6 V max; condition: VCC=5.5 V, IF=5 mA, ICL=13 mA, TA=25°C unless otherwise specified; source page: 3 |
| Input Threshold Current | 2.4 mA typ, 5 mA max; condition: VCC=5.5 V, VO=0.6 V, IOL=13 mA, TA=25°C unless otherwise specified; source page: 3 |
| Isolation Resistance | 1×10^12 Ω typ; condition: VIO=500 Vdc, 40 to 60% RH, TA=25°C unless otherwise specified; source page: 3 |
| Floating Capacitance | 0.6 pF typ; condition: f=1 MHz, TA=25°C unless otherwise specified; source page: 3 |
| Propagation Delay Time to Output HIGH Level | 41 ns typ, 100 ns max; condition: TA=-40 to +85°C, VCC=5 V, IF=7.5 mA unless otherwise specified; source page: 4 |
| Propagation Delay Time to Output LOW Level | 50 ns typ, 100 ns max; condition: CL=15 pF; TA=-40 to +85°C, VCC=5 V, IF=7.5 mA unless otherwise specified; source page: 4 |
| Pulse Width Distortion | 9 ns typ, 35 ns max; condition: |TPHL-TPLH|, CL=15 pF, RL=350 Ω, TA=25°C; source page: 4 |
| Output Rise Time | 40 ns typ; condition: 10-90%, CL=15 pF, RL=350 Ω, TA=25°C; source page: 4 |
| Output Fall Time | 10 ns typ; condition: 90-10%, CL=15 pF, RL=350 Ω, TA=25°C; source page: 4 |
| Propagation Delay Skew | 40 ns max; condition: CL=15 pF, RL=350 Ω, TA=25°C; source page: 4 |
| Common Mode Transient Immunity at Logic High | 5000 V/µs min; condition: XL601, |CMH|, TA=25°C, IF=0 mA, |VCM|=50 V peak, VOH=2.0 V, RL=350 Ω; source page: 4 |
| Common Mode Transient Immunity at Logic Low | 5000 V/µs min; condition: XL601, |CML|, IF=7.5 mA, VOL=0.8 V, RL=350 Ω, TA=25°C, |VCM|=50 V peak; source page: 4 |
| Reflow Preheat Temperature | 150 to 200 °C; condition: reflow soldering profile, Ts; source page: 8 |
| Reflow Preheat Time | 60 to 120 s; condition: reflow soldering profile, ts; source page: 8 |
| Reflow Ramp-Up Rate | 3 °C/s max; condition: TL to TP; source page: 8 |
| Reflow Liquidus Temperature | 217 °C; condition: reflow soldering profile, TL; source page: 8 |
| Reflow Time Above Liquidus | 60 to 150 s; condition: time above TL, tL; source page: 8 |
| Reflow Peak Temperature | 260 °C; condition: reflow soldering profile, Tp; source page: 8 |
| Reflow Peak Dwell Time | 30 s; condition: time during which Tc is between TP-5 and TP; source page: 8 |
| Reflow Ramp-Down Rate | 6 °C/s max; condition: TP to TL; source page: 8 |
| Reflow Cycle Limit | No more than 3 times; condition: recommended reflow soldering; source page: 8 |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; condition: wave soldering profile feature; source page: 8 |
| Wave Soldering Heating Rate During Preheat | 1 to 2 °C/s typical, 4 °C/s max; condition: wave soldering profile feature; source page: 8 |
| Wave Soldering Final Preheat Temperature | ~130 °C; condition: Ts; source page: 8 |
| Wave Soldering Preheat Time | >60 s; condition: 25°C to Ts; source page: 8 |
| Wave Soldering Peak Temperature | 260 °C; condition: Tp; source page: 8 |
| Wave Soldering Peak Time | 10 s; condition: time within peak temperature, tp; source page: 8 |
| Wave Soldering Ramp-Down Rate | 5 °C/s max; condition: wave soldering profile feature; source page: 8 |
| Hand Soldering Iron Temperature | 360 °C +5°C within 3 s; condition: hand soldering used only for product rework or sample testing; source page: 8 |
| Packing Format | Reel, 1000 pcs/reel; condition: SOP6, reel diameter 330 mm; source page: 9 |
| Box Quantity | 2 reels/box, 2000 pcs/box; condition: SOP6 packing; source page: 9 |
| Carton Quantity | 5 boxes/carton, 10000 pcs/carton; condition: SOP6 packing; source page: 9 |
| Antistatic Bag Specification | 380×420 mm; condition: SOP6 packing; source page: 9 |
| Box Specification | 350×340×60 mm; condition: SOP6 packing; source page: 9 |
| Carton Specification | 365×330×370 mm; condition: SOP6 packing; source page: 9 |
| Guard Band Speed | 200 mm/min; condition: SOP6 packing note; source page: 9 |
| Datasheet Status | request_only |
Product Overview
The XL601 is a XINGLIGHT high speed optocoupler categorized under LED components. It is specified with a 10 MBit/s data rate and 5000 Vrms isolation, supporting isolated digital signal transfer where input-output separation and defined switching timing are required.
Key Features
- 10 MBit/s high speed optocoupler data rate
- 5000 Vrms input-output isolation rating
- -40 to +85 °C operating temperature range
- SOP6-P package for XL601P ordering
- 50 mA maximum forward current rating
- 7 V maximum output supply voltage
- 41 ns typical output HIGH propagation delay
- 50 ns typical output LOW propagation delay
- 5000 V/µs minimum common-mode transient immunity
- 1000 pcs tape-and-reel shipping quantity
Typical Applications
- Isolated digital signal interfaces
- High speed logic isolation
- Input-output isolation circuits
- Common-mode transient environments
- SOP6 surface-mount assemblies
- Reflow soldered PCB production
- Wave soldering production flows
Procurement Notes
When requesting a quote for XL601, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of component is the XL601?
The XL601 is a XINGLIGHT high speed optocoupler categorized as an LED component. The extracted datasheet facts identify a 10 MBit/s data rate and 5000 Vrms input-output isolation.
What package is listed for XL601P ordering?
The ordering information lists SOP6-P for XL601P, with XL601 used as the marking code. The series information also lists SOP6-W, while numerical package dimensions are referenced but not provided in the extracted text.
What operating temperature range is specified?
The XL601 operating temperature range is specified as -40 to +85 °C. The storage temperature range is -55 to +125 °C, and soldering temperature is listed as 260 °C for 10 seconds.
What are the main timing specifications?
At the stated timing conditions, propagation delay to output HIGH is 41 ns typical and 100 ns maximum. Propagation delay to output LOW is 50 ns typical and 100 ns maximum, with 9 ns typical pulse width distortion.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 2, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.