Specifications
| Type | Description |
|---|---|
| Part Number | XL6N138-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | DIP8, DIP8-M, SMD8; package outline dimensions referenced in mm but numeric dimensions not readable in provided text |
| Product Series | XL6N138, XL6N139; requested part XL6N138-G belongs to XL6N138 series |
| Package Options | DIP8, DIP8-M, SMD8 |
| Molding Compound Flammability | UL 94V-0 |
| Typical Current Transfer Ratio | 2000 % |
| Isolation Voltage | 5000 Vrms |
| Operating Temperature Range | -40 to +85 °C |
| Low Input Current Requirement | 0.5 mA |
| Typical TTL Compatible Low Output Voltage | 0.1 V |
| Maximum Output Current | 60 mA |
| Ordering Code Package | XL6N13X = DIP8; 45 pcs/tube, marking code XL6N13X; X denotes 8 or 9 |
| Ordering Code Package | XL6N13XM = DIP8-M; 45 pcs/tube, marking code XL6N13X; X denotes 8 or 9 |
| Ordering Code Package | XL6N13XS = SMD8; 1000 pcs/tape and reel, marking code XL6N13X; X denotes 8 or 9 |
| Average Forward Input Current | 20 mA max, TA=25°C unless otherwise specified |
| Peak Forward Input Current | 40 mA max; 50% duty cycle, 1 ms pulse width |
| Peak Transient Input Current | 1.0 A max; pulse width <1 us, 300 pps |
| Input Reverse Voltage | 5 V max |
| Input Power Dissipation | 35 mW max |
| Output Power Dissipation | 100 mW max |
| Output Current | 60 mA max |
| Supply Voltage and Output Voltage | 7 V max for 6N138; minimum noted as -0.5 V |
| Emitter-Base Reverse Voltage | 0.5 V max, pin 5 to pin 7 |
| Isolation Voltage | 5000 Vrms; RH <50%, t=1 min, TA=25°C |
| Total Power Dissipation | 135 mW |
| Storage Temperature Range | -55 to +125 °C |
| Recommended Power Supply Voltage | 4.5 to 18 V |
| Recommended Forward Input Current On | 0.5 to 12.0 mA |
| Recommended Forward Input Voltage Off | 0 to 0.8 V |
| Forward Voltage | 1.40 V typ, 1.75 V max; IF=1.6 mA |
| Forward Voltage | 1.25 V min, 1.40 V typ, 1.70 V max; TA=25°C, IF=1.6 mA |
| Input Reverse Breakdown Voltage | 5 V min; IR=10 uA, TA=25°C |
| Input Capacitance | 60 pF typ; VR=0 V, f=1 MHz |
| Diode Forward Voltage Temperature Coefficient | -1.8 mV/°C typ; IF=1.6 mA |
| High Level Supply Current | 0.05 uA typ, 10 uA max; 6N138, VCC=18 V, IF=0 mA, VO=open |
| Low Level Supply Current | 0.6 mA typ, 1.5 mA max; 6N138, VCC=18 V, IF=1.6 mA, VO=open |
| High Level Output Current | 0.01 uA typ, 100 uA max; 6N138, VO=VCC=18 V, IF=0 mA |
| Low Level Output Voltage | 0.06 V typ; 6N138, IF=1.6 mA, IO=4.8 mA, VCC=4.5 V |
| Current Transfer Ratio | 300 % min, 2000 % typ; 6N138, IF=1.6 mA, VCC=4.5 V, VO=0.4 V |
| Isolation Resistance | 1×10^12 ohm; VIO=500 Vdc, 40 to 60% RH |
| Floating Capacitance | 0.6 pF typ; f=1 MHz |
| Propagation Delay Time to Output High Level | 15 us max; 6N138, IF=1.6 mA, RL=2.2 kohm, TA=0°C to 70°C, VCC=5 V |
| Propagation Delay Time to Output High Level | 1.4 us typ, 10 us max; 6N138, IF=1.6 mA, RL=2.2 kohm, TA=25°C, VCC=5 V |
| Propagation Delay Time to Output Low Level | 50 us max; 6N138, IF=1.6 mA, RL=2.2 kohm, TA=0°C to 70°C, VCC=5 V |
| Propagation Delay Time to Output Low Level | 8 us typ, 35 us max; 6N138, IF=1.6 mA, RL=2.2 kohm, TA=25°C, VCC=5 V |
| Common Mode Transient Immunity at Output High Level | 1000 V/us min, 10000 V/us typ; IF=0 mA, RL=2.2 kohm, TA=25°C, |VCM|=10 Vp-p |
| Common Mode Transient Immunity at Output Low Level | 1000 V/us min, 10000 V/us typ; IF=1.6 mA, RL=2.2 kohm, TA=25°C, |VCM|=10 Vp-p |
| Reflow Preheat Temperature | 150 to 200 °C |
| Reflow Preheat Time | 60 to 120 s |
| Reflow Ramp-Up Rate | 3 °C/s max |
| Reflow Liquidus Temperature | 217 °C |
| Reflow Time Above Liquidus | 60 to 150 s |
| Reflow Peak Temperature | 260 °C |
| Reflow Peak Dwell Time | 30 s between TP-5 and TP |
| Reflow Ramp-Down Rate | 6 °C/s max |
| Reflow Cycle Limit | No more than 3 times |
| Wave Soldering Peak Temperature | 260 °C |
| Wave Soldering Peak Time | 10 s |
| Hand Soldering Temperature | 360 °C +5°C within 3 s |
| DIP8 Packing Quantity | 45 pcs/tube, 2250 pcs/box, 22500 pcs/carton; 50 tubes/box, 10 boxes/carton |
| DIP8-M Packing Quantity | 45 pcs/tube, 2250 pcs/box, 22500 pcs/carton; 50 tubes/box, 10 boxes/carton |
| SMD8 Packing Quantity | 1000 pcs/reel, 2000 pcs/box, 20000 pcs/carton; 2 reels/box, 10 boxes/carton |
| Document Validity | Valid until Dec 31, 2026 |
| Datasheet Status | request_only |
Product Overview
XL6N138-G is part of XINGLIGHT's XL6N138, XL6N139 family and is identified in the provided datasheet as a Photo Darlington optocoupler. Package options are DIP8, DIP8-M, and SMD8, with package outline dimensions referenced in millimeters but not readable in the provided text. The molding compound flammability rating is UL 94V-0.
Key electrical parameters for the 6N138 include 5000 Vrms isolation, 300% minimum and 2000% typical current transfer ratio at IF=1.6 mA, VCC=4.5 V, VO=0.4 V, and 60 mA maximum output current. Recommended operation lists a 4.5 to 18 V supply range, 0.5 to 12.0 mA forward input current on, and 0 to 0.8 V forward input voltage off.
Assembly data includes reflow, wave soldering, and hand soldering limits. SMD8 ordering is supplied as 1000 pcs per tape and reel, while DIP8 and DIP8-M options are supplied as 45 pcs per tube.
Key Features
- Photo Darlington optocoupler in XL6N138 series
- DIP8, DIP8-M, and SMD8 package options
- UL 94V-0 molding compound flammability rating
- 5000 Vrms isolation voltage rating
- 2000% typical current transfer ratio
- 0.5 mA low input current requirement
- 60 mA maximum output current
- -40 to +85 °C operating temperature range
- 4.5 to 18 V recommended supply range
- 0.1 V typical TTL-compatible low output voltage
- 10000 V/us typical common-mode transient immunity
- 260 °C reflow peak temperature profile
Typical Applications
- TTL-compatible isolated signal interfaces
- Low-input-current optocoupler drive circuits
- High-CTR digital coupling stages
- 5 V optically isolated logic outputs
- Common-mode transient environments
- DIP8 through-hole assemblies
- SMD8 tape-and-reel assemblies
Procurement Notes
When requesting a quote for XL6N138-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is XL6N138-G?
XL6N138-G is identified by the provided XINGLIGHT datasheet as a Photo Darlington optocoupler in the XL6N138 series, under the LED category, with DIP8, DIP8-M, and SMD8 package options.
What isolation rating is specified for XL6N138-G?
The datasheet lists 5000 Vrms isolation voltage. One condition states RH below 50%, test time of 1 minute, and TA=25°C for the isolation voltage rating.
What current transfer ratio does the 6N138 specification list?
For 6N138, current transfer ratio is specified as 300% minimum and 2000% typical at IF=1.6 mA, VCC=4.5 V, and VO=0.4 V.
Which package and packing options are listed?
Package options are DIP8, DIP8-M, and SMD8. DIP8 and DIP8-M are listed as 45 pcs per tube, while SMD8 is listed as 1000 pcs per reel.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 2, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.