Specifications
| Type | Description |
|---|---|
| Part Number | XL814(X)-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | DIP4, DIP4-M, SMD4; package outline dimensions in mm referenced but numeric dimensions not provided in extracted text |
| Current Transfer Ratio | 20-300 %; IF=±1 mA, VCE=5 V |
| Isolation Voltage | 5000 Vrms; input to output; 40-60% RH, AC for 1 minute |
| Collector-Emitter Breakdown Voltage | ≥80 V; IC=0.1 mA, IF=0 |
| Operating Temperature | -55 to +100 °C; maximum ratings |
| Feature Operating Temperature | -55 to +110 °C; listed in features |
| Forward Current | ±60 mA; Ta=25°C unless otherwise specified |
| Input Power Dissipation | 100 mW; Ta=25°C unless otherwise specified |
| Input Power Dissipation Derating Factor | 2.9 mW/°C; above Ta=100°C |
| Input Thermal Resistance Junction-Ambient | 325 °C/W; Ta=25°C unless otherwise specified |
| Input Thermal Resistance Junction-Case | 200 °C/W; Ta=25°C unless otherwise specified |
| Output Power Dissipation | 150 mW; Ta=25°C unless otherwise specified |
| Output Collector Current | 50 mA; Ta=25°C unless otherwise specified |
| Collector-Emitter Voltage | 80 V; maximum rating |
| Emitter-Collector Voltage | 7 V; maximum rating |
| Total Power Dissipation | 200 mW; Ta=25°C unless otherwise specified |
| Storage Temperature Range | -55 to +125 °C; maximum ratings |
| Soldering Temperature | 260 °C; 10 seconds |
| Forward Voltage | typ 1.2 V, max 1.4 V; IF=±20 mA, Ta=25°C |
| Terminal Capacitance | typ 30 pF, max 250 pF; V=0, f=1 kHz |
| Collector-Emitter Dark Current | max 100 nA; VCE=20 V, IF=0 |
| Collector-Emitter Breakdown Voltage | min 80 V; IC=0.1 mA, IF=0 |
| Emitter-Collector Breakdown Voltage | min 7 V; IE=10 µA, IF=0 |
| Collector-Emitter Saturation Voltage | typ 0.1 V, max 0.2 V; IF=±20 mA, IC=1 mA |
| Isolation Resistance | min 5x10^10 Ω, typ 1x10^11 Ω; DC 500 V, 40-60% RH |
| Floating Capacitance | typ 0.6 pF, max 1.0 pF; V=0, f=1 MHz |
| Cut-off Frequency | typ 80 kHz; VCE=5 V, IC=2 mA, RL=100 Ω, -3 dB |
| Rise Time | max 18 µs; VCE=2 V, RL=100 Ω, IC=2 mA |
| Fall Time | max 18 µs; VCE=2 V, RL=100 Ω, IC=2 mA |
| CTR Rank A | 50-150 %; IF=±1 mA, VCE=5 V |
| CTR Rank B | 100-300 %; IF=±1 mA, VCE=5 V |
| CTR No Mark Rank | 20-300 %; IF=±1 mA, VCE=5 V |
| Molding Compound Flammability Rating | UL 94V-0; mechanical data |
| DIP4 Shipping Quantity | 100 pcs/tube; part number XL814X |
| DIP4-M Shipping Quantity | 100 pcs/tube; part number XL814MX |
| SMD4 Shipping Quantity | 2000 pcs/tape and reel; part number XL814SX |
| Reflow Preheat Temperature | 150-200 °C; reflow soldering profile, Ts |
| Reflow Preheat Time | 60-120 s; reflow soldering profile, ts |
| Reflow Ramp-up Rate | max 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; TL |
| Reflow Time Above Liquidus | 60-150 s; tL above TL |
| Reflow Peak Temperature | 260 °C; Tp |
| Reflow Peak Time | 30 s; time Tc is between TP-5 and TP |
| Reflow Ramp-down Rate | max 6 °C/s; TP to TL |
| Wave Soldering Peak Temperature | 260 °C; Tp |
| Wave Soldering Peak Time | 10 s; tp within peak temperature |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s; product rework or sample testing |
| Datasheet Status | request_only |
Product Overview
The XL814(X)-G is a XINGLIGHT phototransistor optocoupler in the LED category. Extracted package options include DIP4, DIP4-M, and SMD4, with outline dimensions referenced in millimeters but no numeric dimensions available in the extracted text. Mechanical data lists a UL 94V-0 molding compound flammability rating.
Electrical data specifies a 20% to 300% current transfer ratio at IF=±1 mA and VCE=5 V, with rank options of A at 50% to 150%, B at 100% to 300%, and no-mark at 20% to 300%. Isolation voltage is 5000 Vrms input to output for 1 minute at 40% to 60% RH. Output ratings include 80 V collector-emitter voltage, 7 V emitter-collector voltage, and 50 mA collector current.
Assembly data includes SMD4 tape-and-reel shipping at 2000 pieces and DIP4 or DIP4-M tube shipping at 100 pieces. Reflow, wave soldering, and hand soldering conditions are specified, including a 260 °C reflow peak and 260 °C wave soldering peak.
Key Features
- Phototransistor optocoupler with DIP4, DIP4-M, and SMD4 packages
- Current transfer ratio range of 20% to 300%
- 5000 Vrms input-to-output isolation for one minute
- Collector-emitter voltage maximum rating of 80 V
- Output collector current rating of 50 mA
- Forward voltage typically 1.2 V at IF=±20 mA
- Collector-emitter saturation voltage maximum of 0.2 V
- Isolation resistance minimum 5x10^10 Ω at DC 500 V
- Cut-off frequency typically 80 kHz under specified load
- Reflow and wave soldering peak temperature of 260 °C
Typical Applications
- Input-output signal isolation
- Phototransistor optocoupler switching
- Isolated digital interface circuits
- Low-frequency signal coupling
- Controller input isolation
- Board assemblies using DIP4 packages
- SMD4 tape-and-reel assembly
Procurement Notes
When requesting a quote for XL814(X)-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is the XL814(X)-G?
The XL814(X)-G is a XINGLIGHT phototransistor optocoupler in the LED category. Extracted package options include DIP4, DIP4-M, and SMD4, with package outline dimensions referenced but not numerically provided in the extracted text.
What isolation rating is specified for XL814(X)-G?
The extracted datasheet facts specify 5000 Vrms input-to-output isolation voltage, measured at 40% to 60% relative humidity with AC applied for 1 minute. Isolation resistance is listed as minimum 5x10^10 Ω and typical 1x10^11 Ω at DC 500 V.
What current transfer ratio options are listed?
The overall current transfer ratio is listed as 20% to 300% at IF=±1 mA and VCE=5 V. Rank A is 50% to 150%, Rank B is 100% to 300%, and the no-mark rank is 20% to 300%.
What soldering conditions are available for assembly?
The extracted soldering data includes reflow preheat at 150°C to 200°C for 60 to 120 seconds, 260°C reflow peak, and 260°C wave soldering peak for 10 seconds. Hand soldering is listed as 360°C +5°C within 3 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 2, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.