Specifications
| Type | Description |
|---|---|
| Part Number | XL816(X)-F |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package Case | DIP4, DIP4-M, SMD4 |
| Component Type | Other |
| Current Transfer Ratio | 200-600 % |
| Isolation Voltage | 5000 Vrms |
| Collector-Emitter Breakdown Voltage | >=80 V |
| Operating Temperature | -55 to +100 °C |
| Case Material Flammability | UL 94V-0 |
| Package Option | XL816X: DIP4 |
| Package Option | XL816MX: DIP4-M |
| Package Option | XL816SX: SMD4 |
| Forward Current | 50 mA |
| Input Peak Forward Current | 1 A |
| Reverse Voltage | 6 V |
| Input Power Dissipation | 70 mW |
| Collector Power Dissipation | 150 mW |
| Output Collector Current | 50 mA |
| Collector-Emitter Voltage | 80 V |
| Emitter-Collector Voltage | 7 V |
| Total Power Dissipation | 200 mW |
| Isolation Voltage | 5000 Vrms |
| Rated Impulse Isolation Voltage | 6000 V |
| Rated Repetitive Peak Isolation Voltage | 630 V |
| Thermal Resistance Junction-to-Air | 430 °C/W |
| Thermal Resistance Junction-to-Case | 350 °C/W |
| Thermal Resistance Junction-to-Lead | 368 °C/W |
| Operating Temperature | -55 to +110 °C |
| Storage Temperature Range | -55 to +125 °C |
| Soldering Temperature | 260 °C |
| Forward Voltage | typ 1.2 V, max 1.4 V |
| Peak Forward Voltage | max 3.0 V |
| Input Reverse Current | max 10 uA |
| Input Capacitance | typ 30 pF, max 250 pF |
| Collector-Emitter Dark Current | max 100 nA |
| Collector-Emitter Breakdown Voltage | min 80 V |
| Emitter-Collector Breakdown Voltage | min 7 V |
| Collector Current | min 2.5 mA, max 30 mA |
| Current Transfer Ratio | min 200 %, max 600 % |
| Collector-Emitter Saturation Voltage | typ 0.1 V, max 0.2 V |
| Isolation Resistance | min 1x10^12 ohm |
| Isolation Current | max 2 uA |
| Floating Capacitance | typ 0.6 pF, max 1.0 pF |
| Cut-off Frequency | typ 80 kHz |
| Turn On Time | typ 4 us, max 18 us |
| Turn Off Time | typ 3 us, max 18 us |
| CTR Rank C | 200-400 % |
| CTR Rank D | 300-600 % |
| Reflow Preheat Temperature | 150-200 °C |
| Reflow Preheat Time | 60-120 s |
| Reflow Ramp-up Rate | 3 °C/s |
| Reflow Liquidus Temperature | 217 °C |
| Reflow Time Above Liquidus | 60-150 s |
| Reflow Peak Temperature | 260 °C |
| Reflow Time Within 5°C of Peak | 30 s |
| Reflow Ramp-down Rate | 6 °C/s |
| Reflow Cycle Limit | No more than 3 times |
| Wave Solder Average Ramp-up Rate | ~200 °C/s |
| Wave Solder Heating Rate During Preheat | typ 1-2 °C/s, max 4 °C/s |
| Wave Solder Final Preheat Temperature | ~130 °C |
| Wave Solder Preheat Time | >60 s |
| Wave Solder Peak Temperature | 260 °C |
| Wave Solder Time Within Peak Temperature | 10 s |
| Wave Solder Ramp-down Rate | max 5 °C/s |
| Hand Soldering Iron Temperature | 360 °C +5 °C |
| DIP4 Packing | 100 pcs/tube, 5000 pcs/box, 50000 pcs/carton |
| DIP4-M Packing | 100 pcs/tube, 5000 pcs/box, 50000 pcs/carton |
| SMD4 Packing | 2000 pcs/reel, 4000 pcs/box, 40000 pcs/carton |
| Datasheet Status | request_only |
Product Overview
The XINGLIGHT XL816(X)-F is a phototransistor optocoupler in the LED category, offered with DIP4, DIP4-M, and SMD4 package cases. The package options include XL816X in DIP4, XL816MX in DIP4-M, and XL816SX in SMD4, with marking code XL816X and packing formats defined for tube or tape-and-reel handling.
Electrical data includes a current transfer ratio of 200% to 600% at IF=5 mA and VCE=5 V, with CTR Rank C covering 200% to 400% and CTR Rank D covering 300% to 600%. Isolation ratings include 5000 Vrms, 6000 V rated impulse isolation voltage, and 630 V rated repetitive peak isolation voltage. Output-side ratings include 80 V collector-emitter voltage and 7 V emitter-collector voltage.
Assembly data covers reflow peak temperature of 260 °C, wave solder peak temperature of 260 °C, and hand soldering iron temperature of 360 °C +5 °C within 3 seconds. Typical use cases are optically isolated signal transfer, controller input isolation, low-power interface isolation, and isolated switching feedback circuits.
Key Features
- Phototransistor optocoupler in DIP4, DIP4-M, and SMD4 packages
- Current transfer ratio of 200% to 600%
- 5000 Vrms input-to-output isolation voltage
- Minimum 80 V collector-emitter breakdown voltage
- Forward current maximum rating of 50 mA
- Output collector current maximum rating of 50 mA
- Typical cut-off frequency of 80 kHz
- Turn-on time typical 4 us, maximum 18 us
- Turn-off time typical 3 us, maximum 18 us
- UL 94V-0 molding compound flammability rating
Typical Applications
- Optically isolated signal transfer
- Controller input isolation
- Isolated switching feedback
- Low-power interface isolation
- Noise-separated control circuits
- Phototransistor output coupling
- Board-level isolation channels
Procurement Notes
When requesting a quote for XL816(X)-F, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is the XL816(X)-F?
XL816(X)-F is a XINGLIGHT phototransistor optocoupler in the LED category. The extracted datasheet facts list DIP4, DIP4-M, and SMD4 package cases, with package-specific ordering options and packing formats.
What current transfer ratio does XL816(X)-F specify?
The datasheet specifies a current transfer ratio of 200% to 600% at IF=5 mA and VCE=5 V. Rank C is listed as 200% to 400%, while Rank D is listed as 300% to 600%.
What isolation voltage is listed for XL816(X)-F?
The extracted facts list 5000 Vrms isolation voltage from input to output. Another isolation entry specifies 5000 Vrms under 40-60% RH with AC applied for 1 minute.
Which packages are available for XL816(X)-F?
The package cases are DIP4, DIP4-M, and SMD4. XL816X is listed as DIP4 with 100 pcs per tube, XL816MX as DIP4-M with 100 pcs per tube, and XL816SX as SMD4 with 2000 pcs per tape and reel.
What soldering conditions are specified for this device?
The facts include reflow peak temperature of 260 °C, wave solder peak temperature of 260 °C, and hand soldering iron temperature of 360 °C +5 °C within 3 seconds for product rework or sample testing.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 2, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.