Specifications
| Type | Description |
|---|---|
| Part Number | XL816(X)-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Component Type | Other |
| Package / Case | DIP4, DIP4-M, SMD4; package outline dimensions in mm referenced but numeric dimensions not provided in supplied text |
| Current Transfer Ratio | 200-600 % |
| Isolation Voltage | 5000 Vrms |
| Collector-Emitter Breakdown Voltage | >=80 V |
| Operating Temperature | -55 to +100 °C |
| Molding Compound Flammability Rating | UL 94V-0 |
| Lead Finish | Matte tin-plated leads |
| Solderability Standard | MIL-STD-202, Method 208 |
| Part Number Package | XL816X: DIP4 |
| Part Number Package | XL816MX: DIP4-M |
| Part Number Package | XL816SX: SMD4 |
| CTR Rank Mark C | 200-400 % |
| CTR Rank Mark D | 300-600 % |
| Forward Current | 50 mA |
| Input Peak Forward Current | 1 A |
| Reverse Voltage | 6 V |
| Input Power Dissipation | 70 mW |
| Collector Power Dissipation | 150 mW |
| Output Collector Current | 50 mA |
| Collector-Emitter Voltage | 80 V |
| Emitter-Collector Voltage | 7 V |
| Total Power Dissipation | 200 mW |
| Isolation Voltage | 5000 Vrms |
| Rated Impulse Isolation Voltage | 6000 V |
| Rated Repetitive Peak Isolation Voltage | 630 V |
| Thermal Resistance Junction-to-Air | 430 °C/W |
| Thermal Resistance Junction-to-Case | 350 °C/W |
| Thermal Resistance Junction-to-Lead | 368 °C/W |
| Operating Temperature | -55 to +110 °C |
| Storage Temperature Range | -55 to +125 °C |
| Soldering Temperature | 260 °C |
| Forward Voltage | typ 1.2 V, max 1.4 V |
| Peak Forward Voltage | max 3.0 V |
| Input Reverse Current | max 10 uA |
| Input Capacitance | typ 30 pF, max 250 pF |
| Collector-Emitter Dark Current | max 100 nA |
| Collector-Emitter Breakdown Voltage | min 80 V |
| Emitter-Collector Breakdown Voltage | min 7 V |
| Collector Current | min 2.5 mA, max 30 mA |
| Current Transfer Ratio | min 200 %, max 600 % |
| Collector-Emitter Saturation Voltage | typ 0.1 V, max 0.2 V |
| Isolation Resistance | min 1×10^12 Ω |
| Isolation Current | max 2 uA |
| Floating Capacitance | typ 0.6 pF, max 1.0 pF |
| Cut-off Frequency | typ 80 kHz |
| Turn-On Time | typ 4 us, max 18 us |
| Turn-Off Time | typ 3 us, max 18 us |
| Reflow Preheat Temperature | 150-200 °C |
| Reflow Preheat Time | 60-120 s |
| Reflow Ramp-Up Rate | 3 °C/s |
| Reflow Liquidus Temperature | 217 °C |
| Reflow Time Above Liquidus | 60-150 s |
| Reflow Peak Temperature | 260 °C |
| Reflow Peak Time | 30 s |
| Reflow Ramp-Down Rate | 6 °C/s |
| Reflow Cycles | no more than 3 times |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s |
| Wave Soldering Preheat Heating Rate | typ 1-2 °C/s, max 4 °C/s |
| Wave Soldering Final Preheat Temperature | ~130 °C |
| Wave Soldering Preheat Time | >60 s |
| Wave Soldering Peak Temperature | 260 °C |
| Wave Soldering Peak Time | 10 s |
| Wave Soldering Ramp-Down Rate | max 5 °C/s |
| Hand Soldering Iron Temperature | 360 °C +5 °C |
| DIP4 Packing Quantity | 100 pcs/tube, 5000 pcs/box, 50000 pcs/carton |
| DIP4-M Packing Quantity | 100 pcs/tube, 5000 pcs/box, 50000 pcs/carton |
| SMD4 Packing Quantity | 2000 pcs/reel, 4000 pcs/box, 40000 pcs/carton |
| Datasheet Status | request_only |
Product Overview
The XL816(X)-G is a XINGLIGHT phototransistor optocoupler in the LED category. It combines an input LED with a phototransistor output and is specified with 5000 Vrms isolation between input and output. The datasheet lists a 200-600% current transfer ratio at IF=5 mA and VCE=5 V, with CTR rank C at 200-400% and rank D at 300-600%. Collector-emitter breakdown voltage is specified at a minimum of 80 V.
Package variants include XL816X in DIP4, XL816MX in DIP4-M, and XL816SX in SMD4. Tube packing is listed for DIP4 and DIP4-M, while SMD4 uses tape-and-reel packing. The molding compound is rated UL 94V-0, with matte tin-plated leads and solderability to MIL-STD-202, Method 208.
Electrical and assembly data include 50 mA forward current, 6 V reverse voltage, 80 kHz typical cut-off frequency, 4 us typical turn-on time, and 3 us typical turn-off time. Reflow, wave soldering, and hand soldering limits are specified for assembly planning.
Key Features
- Phototransistor optocoupler with 200-600% CTR
- 5000 Vrms input-to-output isolation rating
- Minimum 80 V collector-emitter breakdown voltage
- DIP4, DIP4-M, and SMD4 package options
- UL 94V-0 rated molding compound
- Matte tin-plated leads with MIL-STD-202 solderability
- Typical 80 kHz cut-off frequency
- Typical 4 us turn-on and 3 us turn-off times
- Reflow peak temperature specified at 260 °C
- Operating temperature range listed to +110 °C
Typical Applications
- Input-output signal isolation
- Isolated digital interface circuits
- Phototransistor output switching
- CTR-ranked optocoupler selection
- DIP4 through-hole assemblies
- SMD4 tape-and-reel assembly
- High-voltage isolation barriers
Procurement Notes
When requesting a quote for XL816(X)-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of component is XL816(X)-G?
XL816(X)-G is a XINGLIGHT phototransistor optocoupler in the LED category. The datasheet lists DIP4, DIP4-M, and SMD4 package options with input-output isolation and phototransistor output characteristics.
What current transfer ratio does XL816(X)-G specify?
The current transfer ratio is specified as 200-600% at IF=5 mA and VCE=5 V. The datasheet also lists CTR rank C at 200-400% and rank D at 300-600% under the same IF and VCE conditions.
What isolation voltage is listed for XL816(X)-G?
The datasheet lists 5000 Vrms isolation voltage between input and output. A separate maximum-rating entry specifies 5000 Vrms at 40-60% relative humidity with AC applied for 1 minute.
Which package and packing options are listed?
XL816X is listed as DIP4 with 100 pcs per tube. XL816MX is DIP4-M with 100 pcs per tube. XL816SX is SMD4 with 2000 pcs per tape-and-reel, and SMD4 packing is also listed as 2000 pcs per reel.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 2, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.