Specifications
| Type | Description |
|---|---|
| Part Number | XL816(X)S-F |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Inferred Category | LED |
| Component Type | Other |
| Package / Case | DIP4, DIP4-M, SMD4; package outline dimensions referenced in mm but numeric dimensions not provided in extracted text |
| Current Transfer Ratio | 200-600 %; IF=5 mA, VCE=5 V |
| Isolation Voltage | 5000 Vrms; input to output |
| Collector-Emitter Breakdown Voltage | >=80 V; BVCEO |
| Operating Temperature | -55 to +100 °C; feature summary |
| Molding Compound Flammability | UL 94V-0; mechanical data |
| Forward Current | 50 mA; maximum rating, TA=25°C |
| Input Peak Forward Current | 1 A; pulse width <=1 us, duty ratio 0.001, TA=25°C |
| Reverse Voltage | 6 V; maximum rating, TA=25°C |
| Input Power Dissipation | 70 mW; maximum rating, TA=25°C |
| Collector Power Dissipation | 150 mW; maximum rating, TA=25°C |
| Output Collector Current | 50 mA; maximum rating, TA=25°C |
| Collector-Emitter Voltage | 80 V; maximum rating, TA=25°C |
| Emitter-Collector Voltage | 7 V; maximum rating, TA=25°C |
| Total Power Dissipation | 200 mW; thermal characteristic, TA=25°C |
| Isolation Voltage | 5000 Vrms; 40-60% RH, AC for 1 minute |
| Rated Impulse Isolation Voltage | 6000 V; thermal characteristics table |
| Rated Repetitive Peak Isolation Voltage | 630 V; thermal characteristics table |
| Thermal Resistance Junction-to-Air | 430 °C/W; thermal characteristics table |
| Thermal Resistance Junction-to-Case | 350 °C/W; thermal characteristics table |
| Thermal Resistance Junction-to-Lead | 368 °C/W; thermal characteristics table |
| Operating Temperature | -55 to +110 °C; thermal characteristics table |
| Storage Temperature Range | -55 to +125 °C; thermal characteristics table |
| Soldering Temperature | 260 °C; for 10 seconds |
| Forward Voltage | typ 1.2 V, max 1.4 V; IF=20 mA, TA=25°C |
| Peak Forward Voltage | max 3.0 V; IFM=0.5 A, TA=25°C |
| Input Reverse Current | max 10 uA; VR=4 V, TA=25°C |
| Input Capacitance | typ 30 pF, max 250 pF; VR=0 V, f=1 kHz, TA=25°C |
| Collector-Emitter Dark Current | max 100 nA; VCE=20 V, IF=0, TA=25°C |
| Collector-Emitter Breakdown Voltage | min 80 V; IC=0.1 mA, IF=0, TA=25°C |
| Emitter-Collector Breakdown Voltage | min 7 V; IE=10 uA, IF=0, TA=25°C |
| Collector Current | min 2.5 mA, max 30 mA; IF=5 mA, VCE=5 V, TA=25°C |
| Current Transfer Ratio | min 200 %, max 600 %; IF=5 mA, VCE=5 V, TA=25°C |
| Collector-Emitter Saturation Voltage | typ 0.1 V, max 0.2 V; IF=20 mA, IC=1 mA, TA=25°C |
| Isolation Resistance | min 1×10^12 ohm; VIO=500 Vdc, 40-60% RH, TA=25°C |
| Isolation Current | max 2 uA; DC 6000 V, 40-60% RH, TA=25°C |
| Floating Capacitance | typ 0.6 pF, max 1.0 pF; VIO=0 V, f=1 MHz, TA=25°C |
| Cut-off Frequency | min 80 kHz; VCE=5 V, IC=2 mA, RL=100 ohm, -3 dB, TA=25°C |
| Turn On Time | typ 4 us, max 18 us; VCE=2 V, RL=100 ohm, IC=2 mA, TA=25°C |
| Turn Off Time | typ 3 us, max 18 us; VCE=2 V, RL=100 ohm, IC=2 mA, TA=25°C |
| CTR Rank C | 200-400 %; IF=5 mA, VCE=5 V |
| CTR Rank D | 300-600 %; IF=5 mA, VCE=5 V |
| Reflow Preheat Temperature | 150-200 °C; reflow soldering profile, Ts |
| Reflow Preheat Time | 60-120 s; reflow soldering profile, ts |
| Reflow Ramp-Up Rate | 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; reflow soldering profile, TL |
| Reflow Time Above Liquidus | 60-150 s; tL, above TL |
| Reflow Peak Temperature | 260 °C; Tp |
| Reflow Peak Time | 30 s; time during which Tc is between TP-5 and TP |
| Reflow Ramp-Down Rate | 6 °C/s; TP to TL |
| Maximum Reflow Cycles | No more than three times; recommended reflow soldering profile |
| Wave Soldering Peak Temperature | 260 °C; wave soldering profile, Tp |
| Wave Soldering Peak Time | 10 s; time within peak temperature, tp |
| Hand Soldering Iron Temperature | 360 °C +5 °C; within 3 s; for product rework or sample testing |
| DIP4 Shipping Quantity | 100 pcs/tube; XL816X ordering information |
| DIP4-M Shipping Quantity | 100 pcs/tube; XL816MX ordering information |
| SMD4 Shipping Quantity | 2000 pcs/tape and reel; XL816SX ordering information |
| Datasheet Status | request_only |
Product Overview
The XL816(X)S-F is a XINGLIGHT phototransistor optocoupler in the LED category. Its extracted package information references DIP4, DIP4-M, and SMD4 outlines, with package outline dimensions stated as being in millimeters but without numeric dimensions in the extracted text. Ordering data lists 100 pcs/tube for DIP4 and DIP4-M versions, and 2000 pcs/tape and reel for the SMD4 version.
Electrical data includes 5000 Vrms isolation, 6000 V rated impulse isolation voltage, 630 V rated repetitive peak isolation voltage, and a minimum isolation resistance of 1×10^12 ohm at VIO=500 Vdc. The phototransistor output is specified with an 80 V collector-emitter voltage rating, 7 V emitter-collector voltage rating, and 50 mA collector current rating.
The device is suited to optocoupler-style isolated signal transfer using an LED input and phototransistor output. Timing data lists 4 us typical turn-on time and 3 us typical turn-off time under the specified VCE=2 V, RL=100 ohm, IC=2 mA test condition. Soldering guidance includes 260 °C peak reflow, 260 °C wave soldering peak, and hand soldering at 360 °C +5 °C within 3 seconds.
Key Features
- Phototransistor optocoupler with LED input structure
- Current transfer ratio specified from 200% to 600%
- 5000 Vrms input-to-output isolation voltage rating
- Minimum 80 V collector-emitter breakdown voltage
- Operating temperature listed to +110 °C in thermal table
- UL 94V-0 molding compound flammability classification
- Typical 4 us turn-on and 3 us turn-off timing
- Minimum 80 kHz cut-off frequency under specified load
- SMD4 option supplied as 2000 pcs tape and reel
- DIP4 and DIP4-M options supplied as 100 pcs/tube
Typical Applications
- Isolated signal transfer
- LED input to phototransistor output coupling
- DIP4 optocoupler assemblies
- DIP4-M optocoupler assemblies
- SMD4 tape-and-reel assembly
- Circuits requiring 5000 Vrms isolation
- Interfaces requiring 80 V phototransistor output rating
Procurement Notes
When requesting a quote for XL816(X)S-F, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is the XL816(X)S-F?
The XL816(X)S-F is identified in the extracted manufacturer datasheet facts as a XINGLIGHT phototransistor optocoupler in the LED category, with DIP4, DIP4-M, and SMD4 package options.
What current transfer ratio is specified for XL816(X)S-F?
The extracted electrical data specifies a current transfer ratio from 200% to 600% at IF=5 mA and VCE=5 V. Rank C is listed as 200-400%, and Rank D is listed as 300-600%.
What isolation rating is listed for this optocoupler?
The extracted facts list 5000 Vrms isolation voltage. One condition states input to output, and another states 40-60% RH with AC applied for 1 minute.
What soldering limits are provided for XL816(X)S-F?
The extracted soldering data lists 260 °C peak reflow temperature, 260 °C wave soldering peak temperature for 10 seconds, and hand soldering at 360 °C +5 °C within 3 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 2, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.