Specifications
| Type | Description |
|---|---|
| Part Number | XL817(X)-F |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package Case | DIP4, DIP4-M, SMD4 |
| Current Transfer Ratio | 50-600 % |
| Isolation Voltage | 5000 Vrms |
| Collector-Emitter Breakdown Voltage | >=80 V |
| Operating Temperature | -55 to +110 °C |
| Molding Compound Flammability | UL 94V-0 |
| Package Option | DIP4 |
| Package Option | DIP4-M |
| Package Option | SMD4 |
| Input Forward Current | 50 mA |
| Input Peak Forward Current | 1 A |
| Input Reverse Voltage | 6 V |
| Input Power Dissipation | 70 mW |
| Collector Power Dissipation | 150 mW |
| Output Collector Current | 50 mA |
| Collector-Emitter Voltage | 80 V |
| Emitter-Collector Voltage | 7 V |
| Total Power Dissipation | 200 mW |
| Isolation Voltage | 5000 Vrms |
| Rated Impulse Isolation Voltage | 6000 V |
| Rated Repetitive Peak Isolation Voltage | 630 V |
| Thermal Resistance Junction-to-Air | 430 °C/W |
| Thermal Resistance Junction-to-Case | 350 °C/W |
| Thermal Resistance Junction-to-Lead | 368 °C/W |
| Storage Temperature Range | -55 to +125 °C |
| Soldering Temperature | 260 °C |
| Forward Voltage | typ 1.2 V, max 1.4 V |
| Peak Forward Voltage | max 3.0 V |
| Input Reverse Current | max 10 uA |
| Input Capacitance | typ 30 pF, max 250 pF |
| Collector-Emitter Dark Current | max 100 nA |
| Collector-Emitter Breakdown Voltage | min 80 V |
| Emitter-Collector Breakdown Voltage | min 7 V |
| Collector Current | min 2.5 mA, max 30 mA |
| Current Transfer Ratio | min 50 %, max 600 % |
| Collector-Emitter Saturation Voltage | typ 0.1 V, max 0.2 V |
| Isolation Resistance | min 1×10^12 ohm |
| Isolation Current | max 2 uA |
| Floating Capacitance | typ 0.6 pF, max 1.0 pF |
| Cut-off Frequency | typ 80 kHz |
| Turn-On Time | typ 4 us, max 18 us |
| Turn-Off Time | typ 3 us, max 18 us |
| CTR Rank A | 80-160 % |
| CTR Rank B | 130-260 % |
| CTR Rank C | 200-400 % |
| CTR Rank D | 300-600 % |
| CTR No Mark | 50-600 % |
| Reflow Preheat Temperature | 150-200 °C |
| Reflow Preheat Time | 60-120 s |
| Reflow Ramp-Up Rate | 3 °C/s |
| Reflow Liquidus Temperature | 217 °C |
| Reflow Time Above Liquidus | 60-150 s |
| Reflow Peak Temperature | 260 °C |
| Reflow Peak Dwell Time | 30 s |
| Reflow Ramp-Down Rate | 6 °C/s |
| Wave Soldering Average Ramp-Up Rate | about 200 °C/s |
| Wave Soldering Heating Rate During Preheat | typ 1-2 °C/s, max 4 °C/s |
| Wave Soldering Final Preheat Temperature | about 130 °C |
| Wave Soldering Preheat Time | >60 s |
| Wave Soldering Peak Temperature | 260 °C |
| Wave Soldering Peak Time | 10 s |
| Wave Soldering Ramp-Down Rate | max 5 °C/s |
| Hand Soldering Iron Temperature | 360±5 °C |
| DIP4 Packing Quantity | 100 pcs/tube, 5000 pcs/box, 50000 pcs/carton |
| DIP4-M Packing Quantity | 100 pcs/tube, 5000 pcs/box, 50000 pcs/carton |
| SMD4 Packing Quantity | 2000 pcs/reel, 4000 pcs/box, 40000 pcs/carton |
| Datasheet Status | request_only |
Product Overview
The XL817(X)-F is a XINGLIGHT phototransistor optocoupler in the LED category. Its optically isolated structure supports input-to-output separation with 5000 Vrms isolation voltage and a rated impulse isolation voltage of 6000 V. Current transfer ratio is specified from 50% to 600% at IF=5 mA and VCE=5 V, with CTR rank options A, B, C, D, and no-mark ranges.
Key Features
- Phototransistor optocoupler with LED input
- 50-600% CTR at IF=5 mA
- 5000 Vrms input-to-output isolation rating
- 80 V collector-emitter voltage rating
- DIP4, DIP4-M, and SMD4 package options
- -55 to +110 °C operating temperature range
- UL 94V-0 molding compound flammability rating
- Typ 80 kHz cut-off frequency
- Typ 4 us turn-on, typ 3 us turn-off
- 260 °C reflow and wave soldering peak
Typical Applications
- Isolated signal transfer
- Input-output interface isolation
- Controller input coupling
- Relay and actuator control interfaces
- Power supply feedback isolation
- Industrial control signal isolation
Procurement Notes
When requesting a quote for XL817(X)-F, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is XL817(X)-F?
XL817(X)-F is a XINGLIGHT phototransistor optocoupler in the LED category. The extracted package options are DIP4, DIP4-M, and SMD4, with ordering and packing details specified for tube and tape-and-reel formats.
What isolation rating does XL817(X)-F provide?
The extracted datasheet facts specify 5000 Vrms isolation voltage, including an AC 1 minute condition at 40-60% RH. It also lists 6000 V rated impulse isolation voltage and 630 V rated repetitive peak isolation voltage.
What CTR range is specified for XL817(X)-F?
Current transfer ratio is specified as 50-600% at IF=5 mA and VCE=5 V. Rank options include A at 80-160%, B at 130-260%, C at 200-400%, D at 300-600%, and no mark at 50-600%.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.