Specifications
| Type | Description |
|---|---|
| Part Number | XL817（X）S-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Current Transfer Ratio | 50-600 % |
| Isolation Voltage | 5000 Vrms |
| Collector-Emitter Breakdown Voltage | >=80 V |
| Operating Temperature | -55 to +110 °C |
| Package Options | DIP4, DIP4-M, SMD4 |
| Molding Compound Flammability Rating | UL 94V-0 |
| Terminal Finish | matte tin-plated leads |
| Part Number XL817X Package | DIP4 |
| Part Number XL817MX Package | DIP4-M |
| Part Number XL817SX Package | SMD4 |
| CTR Rank Options | A, B, C, D, or none |
| Forward Current | 50 mA |
| Input Peak Forward Current | 1 A |
| Reverse Voltage | 6 V |
| Input Power Dissipation | 70 mW |
| Collector Power Dissipation | 150 mW |
| Output Collector Current | 50 mA |
| Collector-Emitter Voltage | 80 V |
| Emitter-Collector Voltage | 7 V |
| Total Power Dissipation | 200 mW |
| Isolation Voltage | 5000 Vrms |
| Rated Impulse Isolation Voltage | 6000 V |
| Rated Repetitive Peak Isolation Voltage | 630 V |
| Thermal Resistance Junction-to-Air | 430 °C/W |
| Thermal Resistance Junction-to-Case | 350 °C/W |
| Thermal Resistance Junction-to-Lead | 368 °C/W |
| Storage Temperature Range | -55 to +125 °C |
| Soldering Temperature | 260 °C |
| Forward Voltage | typ 1.2 V, max 1.4 V |
| Peak Forward Voltage | max 3.0 V |
| Input Reverse Current | max 10 uA |
| Input Capacitance | typ 30 pF, max 250 pF |
| Collector-Emitter Dark Current | max 100 nA |
| Collector-Emitter Breakdown Voltage | min 80 V |
| Emitter-Collector Breakdown Voltage | min 7 V |
| Collector Current | min 2.5 mA, max 30 mA |
| Collector-Emitter Saturation Voltage | typ 0.1 V, max 0.2 V |
| Isolation Resistance | min 1×10^12 Ω |
| Isolation Current | max 2 uA |
| Floating Capacitance | typ 0.6 pF, max 1.0 pF |
| Cut-off Frequency | typ 80 kHz |
| Turn On Time | typ 4 us, max 18 us |
| Turn Off Time | typ 3 us, max 18 us |
| CTR Rank A | 80-160 % |
| CTR Rank B | 130-260 % |
| CTR Rank C | 200-400 % |
| CTR Rank D | 300-600 % |
| CTR No Mark Rank | 50-600 % |
| Reflow Preheat Temperature | 150-200 °C |
| Reflow Preheat Time | 60-120 s |
| Reflow Ramp-up Rate | max 3 °C/s |
| Reflow Liquidus Temperature | 217 °C |
| Reflow Time Above Liquidus | 60-150 s |
| Reflow Peak Temperature | 260 °C |
| Reflow Peak Time | 30 s |
| Reflow Ramp-down Rate | max 6 °C/s |
| Reflow Cycle Limit | no more than 3 times |
| Wave Solder Average Ramp-up Rate | ~200 °C/s |
| Wave Solder Heating Rate During Preheat | typ 1-2 °C/s, max 4 °C/s |
| Wave Solder Final Preheat Temperature | ~130 °C |
| Wave Solder Preheat Time | >60 s |
| Wave Solder Peak Temperature | 260 °C |
| Wave Solder Time Within Peak Temperature | 10 s |
| Wave Solder Ramp-down Rate | max 5 °C/s |
| Hand Soldering Iron Temperature | 360 °C +5 °C |
| DIP4 Packing Quantity | 100 pcs/tube, 5000 pcs/box, 50000 pcs/carton |
| DIP4-M Packing Quantity | 100 pcs/tube, 5000 pcs/box, 50000 pcs/carton |
| SMD4 Packing Quantity | 2000 pcs/reel, 4000 pcs/box, 40000 pcs/carton |
| Document Validity | valid until Dec 31, 2026 |
| Datasheet Status | request_only |
Product Overview
XL817（X）S-G is a XINGLIGHT phototransistor optocoupler in the LED category. It provides optical coupling between input and output sections, with the datasheet specifying 5000 Vrms isolation between input and output and a minimum isolation resistance of 1×10^12 Ω at VIO=500 Vdc.
Key Features
- Phototransistor optocoupler with 50-600% CTR
- 5000 Vrms input-to-output isolation rating
- 80 V minimum collector-emitter breakdown voltage
- -55 to +110 °C operating temperature range
- DIP4, DIP4-M, and SMD4 package options
- UL 94V-0 rated molding compound
- Matte tin-plated leads for MIL-STD-202 Method 208 solderability
- Typical 80 kHz cut-off frequency
- Typical 4 us turn-on and 3 us turn-off times
- Reflow peak temperature specified at 260 °C
Typical Applications
- Input-to-output signal isolation
- Logic interface isolation
- Controller output isolation
- AC or DC signal coupling
- Isolated feedback circuits
- Board-level phototransistor coupling
- DIP4 or SMD4 assembly designs
Procurement Notes
When requesting a quote for XL817（X）S-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of component is XL817（X）S-G?
XL817（X）S-G is identified in the manufacturer datasheet as a phototransistor optocoupler in the LED category, with DIP4, DIP4-M, and SMD4 package options.
What isolation rating is specified for XL817（X）S-G?
The datasheet specifies 5000 Vrms isolation voltage between input and output. It also lists 6000 V rated impulse isolation voltage and 630 V rated repetitive peak isolation voltage.
What CTR options are available for this optocoupler?
The current transfer ratio range is 50-600% at IF=5 mA and VCE=5 V. Ordering information includes CTR rank options A, B, C, D, or no mark.
Which package formats are listed for XL817 variants?
The datasheet lists DIP4, DIP4-M, and SMD4 package options. XL817X is DIP4, XL817MX is DIP4-M, and XL817SX is SMD4 with tape-and-reel shipping quantity.
What soldering limits are provided in the datasheet?
The datasheet specifies 260 °C soldering temperature for 10 seconds. It also provides reflow, wave soldering, and hand soldering profiles, including a 260 °C reflow peak temperature.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.