XL824 Phototransistor Optocoupler

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL824 Phototransistor Optocoupler

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL824
Manufacturer
XINGLIGHT
Package
DIP8, DIP8-M, SMD8
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL824 from XINGLIGHT is a LED-category phototransistor optocoupler offered in DIP8, DIP8-M, and SMD8 package options. The device provides 5000 Vrms isolation voltage for 1 minute, 20-300% current transfer ratio at IF=±1 mA and VCE=5 V, and an 80 V collector-emitter voltage rating. Key electrical limits include ±60 mA forward current, 50 mA collector current, and 200 mW total power dissipation. It supports -55 to +100 °C operation by maximum ratings, with a -55 to +125 °C storage range. The isolation, CTR ranking, switching-time, and package data support use in isolated signal interfaces, control inputs, feedback paths, and board-level electrical isolation.

Specifications

TypeDescription
Part NumberXL824
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Package / CaseDIP8, DIP8-M, SMD8
Current Transfer Ratio20-300 %; IF=±1 mA, VCE=5 V
Isolation Voltage5000 Vrms; 40-60% RH, AC for 1 minute
Collector-Emitter Breakdown Voltage>=80 V; IC=0.1 mA, IF=0
Operating Temperature-55 to +100 °C; maximum ratings
Operating Temperature Feature-55 to +110 °C; feature list
Forward Current±60 mA; TA=25°C unless otherwise specified
Input Power Dissipation100 mW; TA=25°C unless otherwise specified
Input Power Dissipation Derating Factor2.9 mW/°C; above TA=100°C
Thermal Resistance Junction-Ambient325 °C/W; TA=25°C unless otherwise specified
Thermal Resistance Junction-Case200 °C/W; TA=25°C unless otherwise specified
Output Power Dissipation150 mW; TA=25°C unless otherwise specified
Collector Current50 mA; TA=25°C unless otherwise specified
Collector-Emitter Voltage80 V; TA=25°C unless otherwise specified
Emitter-Collector Voltage7 V; TA=25°C unless otherwise specified
Total Power Dissipation200 mW; TA=25°C unless otherwise specified
Storage Temperature Range-55 to +125 °C; maximum ratings
Soldering Temperature260 °C; for 10 seconds
Forward Voltagetyp 1.2 V, max 1.4 V; IF=±20 mA, TA=25°C
Input Terminal Capacitancetyp 30 pF, max 250 pF; V=0, f=1 kHz
Collector-Emitter Dark Currentmax 100 nA; VCE=20 V, IF=0
Emitter-Collector Breakdown Voltagemin 7 V; IE=10 µA, IF=0
Collector-Emitter Saturation Voltagetyp 0.1 V, max 0.2 V; IF=±20 mA, IC=1 mA
Isolation Resistancemin 5x10^10 Ω, typ 1x10^11 Ω; DC 500 V, 40-60% R.H.
Floating Capacitancetyp 0.6 pF, max 1.0 pF; V=0, f=1 MHz
Cut-off Frequencytyp 80 kHz; VCE=5 V, IC=2 mA, RL=100 Ω, -3 dB
Rise Timemax 18 µs; VCE=2 V, RL=100 Ω, IC=2 mA
Fall Timemax 18 µs; VCE=2 V, RL=100 Ω, IC=2 mA
CTR Rank A50-150 %; IF=±1 mA, VCE=5 V
CTR Rank B100-300 %; IF=±1 mA, VCE=5 V
CTR No Mark Rank20-300 %; IF=±1 mA, VCE=5 V
Molding Compound FlammabilityUL 94V-0; mechanical data
Terminal Platingmatte tin-plated leads; solderability per MIL-STD-202, Method 208
DIP8 Shipping Quantity45 pcs/tube; part number XL824X
DIP8-M Shipping Quantity45 pcs/tube; part number XL824MX
SMD8 Shipping Quantity1000 pcs/tape and reel; part number XL824SX
Reflow Preheat Temperature150-200 °C; Ts
Reflow Preheat Time60-120 s; ts
Reflow Ramp-up Rate3 °C/s; TL to TP
Reflow Liquidus Temperature217 °C; TL
Reflow Time Above Liquidus60-150 s; tL, above TL
Reflow Peak Temperature260 °C; Tp
Reflow Peak Time30 s; Tc between TP-5 and TP
Reflow Ramp-down Rate6 °C/s; TP to TL
Hand Soldering Iron Temperature360 °C +5 °C; within 3 s; product rework or sample testing
Datasheet Statusrequest_only

Product Overview

The XL824 is a XINGLIGHT phototransistor optocoupler in the LED category. It is specified in DIP8, DIP8-M, and SMD8 package cases, with associated ordering and shipping formats including 45 pcs/tube for DIP8 and DIP8-M versions and 1000 pcs/tape and reel for SMD8 versions.

Core isolation and output parameters include 5000 Vrms isolation voltage under 40-60% RH AC testing for 1 minute, isolation resistance of at least 5x10^10 Ω at DC 500 V, and typical floating capacitance of 0.6 pF. Output-side ratings include 80 V collector-emitter voltage, 7 V emitter-collector voltage, 50 mA collector current, and collector-emitter breakdown voltage of at least 80 V.

Electrical transfer data includes 20-300% CTR at IF=±1 mA and VCE=5 V, with rank options A, B, and no-mark. Switching characteristics include 80 kHz typical cut-off frequency and 18 µs maximum rise and fall times. Assembly facts include UL 94V-0 molding compound flammability, matte tin-plated leads, 260 °C reflow peak temperature, and 360 °C +5 °C hand soldering iron temperature within 3 seconds.

Key Features

  • Phototransistor optocoupler in DIP8, DIP8-M, and SMD8 packages
  • 5000 Vrms isolation voltage for one-minute AC test
  • 20-300% CTR at IF=±1 mA and VCE=5 V
  • 80 V collector-emitter voltage rating
  • 50 mA collector current maximum rating
  • Typical 80 kHz cut-off frequency at specified load
  • Maximum 18 µs rise and fall times
  • UL 94V-0 molding compound flammability
  • Matte tin-plated leads with MIL-STD-202 solderability
  • 260 °C peak reflow temperature profile

Typical Applications

  • Isolated signal interfaces
  • Controller input isolation
  • Power supply feedback paths
  • Board-level electrical isolation
  • PLC and industrial I/O coupling
  • Low-frequency switching signal transfer
  • Isolated status detection

Procurement Notes

When requesting a quote for XL824, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What type of component is the XL824?

The XL824 is identified as a XINGLIGHT phototransistor optocoupler in the LED category. The extracted package cases are DIP8, DIP8-M, and SMD8, with CTR, isolation, output transistor, thermal, and assembly parameters specified in the datasheet facts.

What isolation rating is specified for the XL824?

The isolation voltage is specified as 5000 Vrms under 40-60% relative humidity with AC applied for 1 minute. The datasheet facts also list isolation resistance of at least 5x10^10 Ω at DC 500 V and 40-60% R.H.

What current transfer ratio options are listed?

The no-mark CTR range is 20-300% at IF=±1 mA and VCE=5 V. Rank A is listed as 50-150% under the same condition, while Rank B is listed as 100-300% under the same condition.

Which package and shipping formats are available?

The package cases are DIP8, DIP8-M, and SMD8. XL824X in DIP8 ships as 45 pcs/tube, XL824MX in DIP8-M ships as 45 pcs/tube, and XL824SX in SMD8 ships as 1000 pcs/tape and reel.

What soldering and reflow limits are specified?

The soldering temperature is specified as 260 °C for 10 seconds. Reflow data includes 150-200 °C preheat for 60-120 seconds, 217 °C liquidus, 260 °C peak temperature, and 30 seconds near peak.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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