Specifications
| Type | Description |
|---|---|
| Part Number | XL825-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | DIP8, DIP8-M, SMD8; package outline dimensions referenced in mm but numeric dimensions not provided in extracted text |
| Current Transfer Ratio | 600-7500 %; IF=1 mA, VCE=2 V |
| Isolation Voltage | 5000 Vrms; AC for 1 minute, 40-60% RH |
| Operating Temperature | -55 to +100 °C; maximum ratings table |
| Operating Temperature Feature | -55 to +110 °C; feature list |
| Forward Current | 60 mA; Ta=25°C unless otherwise specified |
| Reverse Voltage | 6 V; input maximum rating |
| Peak Forward Current | 1 A; pulse width <=1 us, duty ratio 0.001 |
| Input Power Dissipation | 100 mW; input maximum rating |
| Input Power Dissipation Derating Factor | 5.8 mW/°C; above Ta=100°C |
| Input Thermal Resistance Junction-Ambient | 325 °C/W; input thermal rating |
| Input Thermal Resistance Junction-Case | 200 °C/W; input thermal rating |
| Collector Power Dissipation | 150 mW; output maximum rating |
| Collector Current | 80 mA; output maximum rating |
| Collector-Emitter Voltage | 40 V; output maximum rating |
| Emitter-Collector Voltage | 7 V; output maximum rating |
| Total Power Dissipation | 200 mW; thermal characteristics |
| Storage Temperature Range | -55 to +125 °C; thermal characteristics |
| Soldering Temperature | 260 °C; for 10 seconds |
| Forward Voltage | typ 1.2 V, max 1.4 V; IF=20 mA, Ta=25°C |
| Input Reverse Current | max 10 uA; VR=4 V |
| Terminal Capacitance | typ 30 pF, max 250 pF; VR=0 V, f=1 kHz |
| Collector-Emitter Dark Current | max 1000 nA; VCE=10 V |
| Collector-Emitter Breakdown Voltage | min 40 V; IC=0.1 mA, IF=0 |
| Emitter-Collector Breakdown Voltage | min 7 V; IE=10 uA, IF=0 |
| Collector-Emitter Saturation Voltage | typ 0.8 V, max 1 V; IF=20 mA, IC=5 mA |
| Isolation Resistance | min 5×10^10 ohm; VIO=500 Vdc, 40-60% RH |
| Isolation Capacitance | typ 0.6 pF, max 1.0 pF; VIO=0, f=1 MHz |
| Cut-off Frequency | typ 6 kHz; VCE=5 V, IC=2 mA, RL=100 ohm, -3 dB |
| Turn-on Time | typ 60 us, max 300 us; VCE=2 V, RL=100 ohm |
| Turn-off Time | typ 53 us, max 250 us; IC=10 mA |
| Reflow Preheat Temperature | 150-200 °C; reflow soldering profile |
| Reflow Preheat Time | 60-120 s; reflow soldering profile |
| Reflow Ramp-up Rate | 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; reflow soldering profile |
| Reflow Time Above Liquidus | 60-150 s; above TL |
| Reflow Peak Temperature | 260 °C; reflow soldering profile |
| Reflow Peak Dwell Time | 30 s; Tc between TP-5 and TP |
| Reflow Ramp-down Rate | 6 °C/s; TP to TL |
| Wave Soldering Average Ramp-up Rate | ~200 °C/s; wave soldering profile |
| Wave Soldering Heating Rate During Preheat | typ 1-2 °C/s, max 4 °C/s; wave soldering preheat |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp |
| Wave Soldering Peak Time | 10 s; within peak temperature |
| Wave Soldering Ramp-down Rate | max 5 °C/s; wave soldering profile |
| Hand Soldering Iron Temperature | 360 °C +5 °C; within 3 s; for product rework or sample testing |
| XL825 Package Shipping Quantity | 45 pcs/tube; DIP8 package |
| XL825M Package Shipping Quantity | 45 pcs/tube; DIP8-M package |
| XL825S Package Shipping Quantity | 1000 pcs/tape and reel; SMD8 package |
| DIP8 Packing Quantity | 45 pcs/tube, 2250 pcs/box, 22500 pcs/carton; tube packing, 50 tubes/box, 10 boxes/carton |
| DIP8-M Packing Quantity | 45 pcs/tube, 2250 pcs/box, 22500 pcs/carton; tube packing, 50 tubes/box, 10 boxes/carton |
| SMD8 Packing Quantity | 1000 pcs/reel, 2000 pcs/box, 10000 pcs/carton; reel packing, 2 reels/box, 5 boxes/carton |
| Molding Compound Flammability Rating | UL 94V-0; mechanical data |
| Datasheet Status | request_only |
Product Overview
The XL825-G is a XINGLIGHT photo Darlington optocoupler in the LED category. It combines an optical input path with a Darlington output stage and is specified for high current transfer ratio operation, with CTR listed at 600-7500% under IF=1 mA and VCE=2 V conditions.
Isolation and output ratings define the device boundary for separated circuits. The datasheet specifies 5000 Vrms isolation voltage for 1 minute at 40-60% RH, minimum 5×10^10 ohm isolation resistance at VIO=500 Vdc, and typical 0.6 pF isolation capacitance. Output ratings include 40 V collector-emitter voltage, 7 V emitter-collector voltage, and 80 mA collector current.
Package references include DIP8, DIP8-M, and SMD8, with tube packing for DIP variants and tape-and-reel packing for SMD8. Assembly data includes 260 °C reflow and wave soldering peak temperatures, plus a 360 °C +5 °C hand-soldering iron condition within 3 seconds for rework or sample testing.
Key Features
- Photo Darlington optocoupler device structure
- 600-7500% CTR at IF=1 mA, VCE=2 V
- 5000 Vrms isolation voltage for one minute
- 40 V minimum collector-emitter breakdown voltage
- Typical 0.6 pF isolation capacitance
- Typical 6 kHz cut-off frequency
- DIP8, DIP8-M, and SMD8 package references
- UL 94V-0 molding compound flammability rating
- 260 °C reflow and wave soldering peak temperature
- SMD8 supplied as 1000 pcs tape and reel
Typical Applications
- Isolated signal transfer
- Logic-to-output isolation
- Low-frequency switching interfaces
- Galvanic isolation circuits
- Darlington optocoupler replacement designs
- DIP8 or SMD8 assemblies
Procurement Notes
When requesting a quote for XL825-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is the XL825-G?
The XL825-G is a XINGLIGHT photo Darlington optocoupler in the LED category. The extracted package references include DIP8, DIP8-M, and SMD8, with package outline dimensions referenced in millimeters but no numeric dimensions provided.
What isolation rating is specified for XL825-G?
The datasheet facts specify 5000 Vrms isolation voltage under AC test conditions for 1 minute at 40-60% relative humidity. Isolation resistance is listed as minimum 5×10^10 ohm at VIO=500 Vdc.
What current transfer ratio does XL825-G provide?
The extracted electrical specification lists a current transfer ratio range of 600-7500% measured at IF=1 mA and VCE=2 V. This parameter is tied to the photo Darlington optocoupler output behavior.
What assembly temperature limits are given?
Assembly data includes 260 °C reflow peak temperature, 260 °C wave soldering peak temperature, and 260 °C soldering temperature for 10 seconds. Hand soldering is specified at 360 °C +5 °C within 3 seconds for rework or sample testing.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.