Specifications
| Type | Description |
|---|---|
| Part Number | XL827-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Component Type | Other |
| Package / Case | DIP8, DIP8-M, SMD8; package outline dimensions shown in mm but numeric dimensions not provided in extracted text |
| Current Transfer Ratio | 50-600 %; IF=5 mA, VCE=5 V |
| Isolation Voltage | 5000 Vrms; between input and output |
| Collector-Emitter Breakdown Voltage | >=80 V; BVCEO |
| Operating Temperature | -55 to +110 °C; TOPR |
| Case Options | DIP8, DIP8-M, SMD8; mechanical data |
| Molding Compound Flammability | UL 94V-0; case molding compound |
| Terminal Finish | matte tin-plated leads; solderability per MIL-STD-202 Method 208 |
| DIP8 Shipping Quantity | 45 pcs/tube; part number XL827X |
| DIP8-M Shipping Quantity | 45 pcs/tube; part number XL827MX |
| SMD8 Shipping Quantity | 1000 pcs/tape and reel; part number XL827SX |
| Forward Current | 50 mA; TA=25°C unless otherwise specified |
| Input Peak Forward Current | 1 A; pulse width <=1 us, duty ratio 0.001 |
| Reverse Voltage | 6 V; TA=25°C unless otherwise specified |
| Input Power Dissipation | 70 mW; TA=25°C unless otherwise specified |
| Collector Power Dissipation | 150 mW; TA=25°C unless otherwise specified |
| Collector Current | 50 mA; TA=25°C unless otherwise specified |
| Collector-Emitter Voltage | 80 V; maximum rating, VCEO |
| Emitter-Collector Voltage | 7 V; maximum rating, VECO |
| Total Power Dissipation | 200 mW; TA=25°C unless otherwise specified |
| Isolation Voltage | 5000 Vrms; 40 to 60% RH, AC for 1 minute |
| Rated Impulse Isolation Voltage | 6000 V; VIOTM |
| Rated Repetitive Peak Isolation Voltage | 630 V; VIORM |
| Thermal Resistance Junction-to-Air | 430 °C/W; RθJA |
| Thermal Resistance Junction-to-Case | 350 °C/W; RθJC |
| Thermal Resistance Junction-to-Lead | 368 °C/W; RθJL |
| Storage Temperature Range | -55 to +125 °C; TSTG |
| Soldering Temperature | 260 °C; 10 seconds |
| Forward Voltage | typ 1.2 V, max 1.4 V; IF=20 mA, TA=25°C |
| Peak Forward Voltage | max 3.0 V; IFM=0.5 A, TA=25°C |
| Input Reverse Current | max 10 uA; VR=4 V, TA=25°C |
| Input Capacitance | typ 30 pF, max 250 pF; VR=0 V, f=1 kHz |
| Collector-Emitter Dark Current | max 100 nA; VCE=20 V, IF=0 |
| Collector-Emitter Breakdown Voltage | min 80 V; IC=0.1 mA, IF=0 |
| Emitter-Collector Breakdown Voltage | min 7 V; IE=10 uA, IF=0 |
| Collector Current | min 2.5 mA, max 30 mA; IF=5 mA, VCE=5 V |
| Current Transfer Ratio | min 50 %, max 600 %; IF=5 mA, VCE=5 V |
| Collector-Emitter Saturation Voltage | typ 0.1 V, max 0.2 V; IF=20 mA, IC=1 mA |
| Isolation Resistance | min 1×10^12 ohm; VIO=500 Vdc, 40-60% RH |
| Isolation Current | max 2 uA; DC 6000 V, 40-60% RH |
| Floating Capacitance | typ 0.6 pF, max 1.0 pF; VIO=0, f=1 MHz |
| Cut-off Frequency | typ 80 kHz; VCE=5 V, IC=2 mA, RL=100 ohm, -3 dB |
| Turn-On Time | typ 4 us, max 18 us; VCE=2 V, RL=100 ohm, IC=2 mA |
| Turn-Off Time | typ 3 us, max 18 us; VCE=2 V, RL=100 ohm, IC=2 mA |
| CTR Rank A | 80-160 %; IF=5 mA, VCE=5 V |
| CTR Rank B | 130-260 %; IF=5 mA, VCE=5 V |
| CTR Rank C | 200-400 %; IF=5 mA, VCE=5 V |
| CTR Rank D | 300-600 %; IF=5 mA, VCE=5 V |
| CTR No Mark Rank | 50-600 %; IF=5 mA, VCE=5 V |
| Reflow Preheat Temperature | 150-200 °C; Ts |
| Reflow Preheat Time | 60-120 s; ts |
| Reflow Ramp-Up Rate | 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; TL |
| Reflow Time Above Liquidus | 60-150 s; tL |
| Reflow Peak Temperature | 260 °C; Tp |
| Reflow Time Near Peak | 30 s; Tc between TP-5 and TP |
| Reflow Ramp-Down Rate | 6 °C/s; TP to TL |
| Reflow Cycles | no more than 3 times; recommended soldering profile |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; profile feature |
| Wave Soldering Heating Rate During Preheat | typ 1-2 °C/s, max 4 °C/s; preheat |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp |
| Wave Soldering Time Within Peak Temperature | 10 s; tp |
| Wave Soldering Ramp-Down Rate | max 5 °C/s; profile feature |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s; product rework or sample testing only |
| DIP8 Packing Quantity | 45 pcs/tube, 50 tubes/box, 10 boxes/carton; tube 500 mm, straight insert type material tube |
| DIP8-M Packing Quantity | 45 pcs/tube, 50 tubes/box, 10 boxes/carton; tube 500 mm, seagull foot M-foot tube |
| SMD8 Packing Quantity | 1000 pcs/reel, 2 reels/box, 10 boxes/carton; reel diameter 330 mm, guard band 200 mm min |
| Datasheet Status | request_only |
Product Overview
The XL827-G is a XINGLIGHT phototransistor optocoupler in the LED category. It combines an input LED with a phototransistor output and is specified for 5000 Vrms isolation between input and output. Current transfer ratio is listed as 50-600% at IF=5 mA and VCE=5 V, with rank options from A through D and a no-mark 50-600% range.
Electrical limits include 50 mA forward current, 1 A input peak forward current for pulse width up to 1 us at 0.001 duty ratio, 6 V reverse voltage, 50 mA collector current, 80 V collector-emitter voltage, and 7 V emitter-collector voltage. Switching data includes 80 kHz typical cut-off frequency, 4 us typical turn-on time, and 3 us typical turn-off time under the stated load conditions.
Package options are DIP8, DIP8-M, and SMD8, with matte tin-plated leads and UL 94V-0 molding compound. Assembly data includes 260 °C reflow peak temperature, 260 °C wave soldering peak temperature, and hand soldering at 360 °C +5 °C within 3 s for rework or sample testing only.
Key Features
- Phototransistor optocoupler output structure
- 5000 Vrms input-to-output isolation rating
- 50-600% CTR at IF=5 mA
- 80 V collector-emitter voltage rating
- -55 to +110 °C operating temperature
- DIP8, DIP8-M, and SMD8 case options
- UL 94V-0 case molding compound
- Matte tin-plated leads for solderability
- Typical 80 kHz cut-off frequency
- 260 °C reflow peak temperature
Typical Applications
- Isolated signal transfer
- Control input isolation
- Transistor-output interface circuits
- Feedback isolation paths
- Logic-to-output isolation
- SMD8 tape-and-reel assembly
- DIP8 tube-packed assemblies
Procurement Notes
When requesting a quote for XL827-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is the XL827-G?
The XL827-G is listed as a XINGLIGHT phototransistor optocoupler in the LED category. The extracted datasheet facts specify DIP8, DIP8-M, and SMD8 case options with a phototransistor output electrical table.
What isolation rating is specified for XL827-G?
The extracted facts list 5000 Vrms isolation voltage between input and output. The ratings table also states 5000 Vrms under 40 to 60% RH with AC applied for 1 minute.
What CTR range does XL827-G provide?
The current transfer ratio is specified as 50-600% at IF=5 mA and VCE=5 V. Rank options include A at 80-160%, B at 130-260%, C at 200-400%, and D at 300-600%.
Which package and packing options are listed?
The listed case options are DIP8, DIP8-M, and SMD8. DIP8 and DIP8-M are packed 45 pcs per tube, while SMD8 is listed as 1000 pcs per tape and reel or 1000 pcs per reel.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.