Specifications
| Type | Description |
|---|---|
| Part Number | XL827S-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package Case | DIP8, DIP8-M, SMD8 |
| Current Transfer Ratio | 50-600 %; IF=5 mA, VCE=5 V |
| Isolation Voltage | 5000 Vrms; input to output |
| Collector-Emitter Breakdown Voltage | >=80 V; BVCEO |
| Operating Temperature | -55 to +110 °C; operating range |
| Molding Compound Flammability Rating | UL 94V-0; case material |
| DIP8 Shipping Quantity | 45 pcs/tube; XL827X package |
| DIP8-M Shipping Quantity | 45 pcs/tube; XL827MX package |
| SMD8 Shipping Quantity | 1000 pcs/tape and reel; XL827SX package |
| Forward Current | 50 mA; maximum rating, Ta=25°C |
| Input Peak Forward Current | 1 A; pulse width <=1 us, duty ratio 0.001, Ta=25°C |
| Reverse Voltage | 6 V; maximum rating, Ta=25°C |
| Input Power Dissipation | 70 mW; maximum rating, Ta=25°C |
| Collector Power Dissipation | 150 mW; maximum rating, Ta=25°C |
| Collector Current | 50 mA; maximum rating, Ta=25°C |
| Collector-Emitter Voltage | 80 V; maximum rating, output, Ta=25°C |
| Emitter-Collector Voltage | 7 V; maximum rating, output, Ta=25°C |
| Total Power Dissipation | 200 mW; thermal characteristic, Ta=25°C |
| Isolation Voltage | 5000 Vrms; 40-60% RH, AC for 1 minute |
| Rated Impulse Isolation Voltage | 6000 V; VIOTM |
| Rated Repetitive Peak Isolation Voltage | 630 V; VIORM |
| Thermal Resistance Junction-to-Air | 430 °C/W; RθJA |
| Thermal Resistance Junction-to-Case | 350 °C/W; RθJC |
| Thermal Resistance Junction-to-Lead | 368 °C/W; RθJL |
| Storage Temperature Range | -55 to +125 °C; TSTG |
| Soldering Temperature | 260 °C; 10 seconds |
| Forward Voltage | typ 1.2 V, max 1.4 V; IF=20 mA, Ta=25°C |
| Peak Forward Voltage | max 3.0 V; IFM=0.5 A, Ta=25°C |
| Input Reverse Current | max 10 uA; VR=4 V, Ta=25°C |
| Input Capacitance | typ 30 pF, max 250 pF; VR=0 V, f=1 kHz, Ta=25°C |
| Collector-Emitter Dark Current | max 100 nA; VCE=20 V, IF=0, Ta=25°C |
| Collector-Emitter Breakdown Voltage | min 80 V; IC=0.1 mA, IF=0, Ta=25°C |
| Emitter-Collector Breakdown Voltage | min 7 V; IE=10 uA, IF=0, Ta=25°C |
| Collector Current | min 2.5 mA, max 30 mA; IF=5 mA, VCE=5 V, Ta=25°C |
| Current Transfer Ratio | min 50 %, max 600 %; IF=5 mA, VCE=5 V, Ta=25°C |
| Collector-Emitter Saturation Voltage | typ 0.1 V, max 0.2 V; IF=20 mA, IC=1 mA, Ta=25°C |
| Isolation Resistance | min 1×10^12 ohm; VIO=500 Vdc, 40-60% RH, Ta=25°C |
| Isolation Current | max 2 uA; DC 6000 V, 40-60% RH, Ta=25°C |
| Floating Capacitance | typ 0.6 pF, max 1.0 pF; VIO=0, f=1 MHz, Ta=25°C |
| Cut-off Frequency | typ 80 kHz; VCE=5 V, IC=2 mA, RL=100 ohm, -3 dB, Ta=25°C |
| Turn On Time | typ 4 us, max 18 us; VCE=2 V, IC=2 mA, RL=100 ohm, Ta=25°C |
| Turn Off Time | typ 3 us, max 18 us; VCE=2 V, IC=2 mA, RL=100 ohm, Ta=25°C |
| CTR Rank A | 80-160 %; IF=5 mA, VCE=5 V |
| CTR Rank B | 130-260 %; IF=5 mA, VCE=5 V |
| CTR Rank C | 200-400 %; IF=5 mA, VCE=5 V |
| CTR Rank D | 300-600 %; IF=5 mA, VCE=5 V |
| CTR No Mark | 50-600 %; IF=5 mA, VCE=5 V |
| Reflow Preheat Temperature | 150-200 °C; Ts |
| Reflow Preheat Time | 60-120 s; ts |
| Reflow Ramp-up Rate | 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; TL |
| Reflow Time Above Liquidus | 60-150 s; tL |
| Reflow Peak Temperature | 260 °C; Tp |
| Reflow Time Within 5°C of Peak | 30 s; Tc between TP-5 and TP |
| Reflow Ramp-down Rate | 6 °C/s; TP to TL |
| Reflow Cycle Limit | no more than 3 times; recommended profile |
| Wave Soldering Average Ramp-up Rate | ~200 °C/s; profile feature |
| Wave Soldering Heating Rate During Preheat | 1-2 °C/s typical, 4 °C/s maximum; preheat |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp |
| Wave Soldering Time Within Peak Temperature | 10 s; tp |
| Wave Soldering Ramp-down Rate | 5 °C/s maximum; profile feature |
| Hand Soldering Iron Temperature | 360 °C +5°C within 3 s; product rework or sample testing |
| DIP8 Packing Quantity Per Tube | 45 pcs/tube; tube 500 mm |
| DIP8 Packing Quantity Per Box | 2250 pcs/box; 50 tubes/box |
| DIP8 Packing Quantity Per Carton | 22500 pcs/carton; 10 boxes/carton |
| DIP8-M Packing Quantity Per Tube | 45 pcs/tube; tube 500 mm |
| DIP8-M Packing Quantity Per Box | 2250 pcs/box; 50 tubes/box |
| DIP8-M Packing Quantity Per Carton | 22500 pcs/carton; 10 boxes/carton |
| SMD8 Packing Quantity Per Reel | 1000 pcs/reel; reel diameter 330 mm |
| SMD8 Packing Quantity Per Box | 2000 pcs/box; 2 reels/box |
| SMD8 Packing Quantity Per Carton | 20000 pcs/carton; 10 boxes/carton |
| SMD8 Guard Band | 200 mm minimum; tape and reel packing |
| Document Validity | valid until Dec 31, 2026; datasheet attention note |
| Datasheet Status | request_only |
Product Overview
The optocoupler provides 5000 Vrms isolation and a rated impulse isolation voltage of 6000 V. Current transfer ratio is specified from 50% to 600% at IF=5 mA and VCE=5 V, with rank options A, B, C, D, and no-mark ranges documented under the same test condition.
Input ratings include 50 mA forward current, 1 A peak forward current under pulse conditions, 6 V reverse voltage, and 70 mW input power dissipation. Output ratings include 50 mA collector current, 80 V collector-emitter voltage, 7 V emitter-collector voltage, and 150 mW collector power dissipation.
The part supports operating temperatures from -55 to +110 °C and storage from -55 to +125 °C. Assembly guidance includes 260 °C reflow peak temperature, 260 °C wave soldering peak temperature, and 360 °C +5 °C hand soldering within 3 seconds.
Key Features
- Phototransistor optocoupler in DIP8, DIP8-M, and SMD8 packages
- 50-600% CTR at IF=5 mA and VCE=5 V
- 5000 Vrms input-to-output isolation voltage rating
- 80 V minimum collector-emitter breakdown voltage
- -55 to +110 °C operating temperature range
- UL 94V-0 molding compound flammability rating
- Typ 80 kHz cut-off frequency at specified load
- Typ 4 us turn-on and typ 3 us turn-off
- 260 °C reflow and wave soldering peak temperature
- SMD8 tape-and-reel packing supports 1000 pcs per reel
Typical Applications
- Isolated signal transfer
- Phototransistor output coupling
- Logic-to-transistor interface isolation
- Industrial control input isolation
- Power supply feedback isolation
- PCB assemblies using DIP8 packages
- PCB assemblies using SMD8 tape-and-reel
Procurement Notes
When requesting a quote for XL827S-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of component is XL827S-G?
XL827S-G is listed as a XINGLIGHT phototransistor optocoupler in the LED category. The extracted package cases are DIP8, DIP8-M, and SMD8.
What isolation voltage is specified for XL827S-G?
The datasheet facts specify 5000 Vrms isolation voltage from input to output. Another rating lists 5000 Vrms under 40-60% RH with AC applied for 1 minute.
What CTR range does XL827S-G provide?
The current transfer ratio is specified from 50% to 600% at IF=5 mA and VCE=5 V. Rank options include A, B, C, D, and no-mark ranges.
What package and packing options are documented?
The package cases are DIP8, DIP8-M, and SMD8. DIP8 and DIP8-M use 45 pcs per tube packing, while SMD8 is listed as 1000 pcs per tape-and-reel or reel.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.