Specifications
| Type | Description |
|---|---|
| Part Number | XL847S-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Component Type | Other |
| Package/Case | SMD-16; series also offered in DIP-16; package outline dimensions referenced in mm but numeric dimensions not visible in provided text |
| Current Transfer Ratio | 50-600 %; IF=5 mA, VCE=5 V |
| Isolation Voltage | 5000 Vrms; maximum rating; AC for 1 minute, 40-60% RH |
| Collector-Emitter Breakdown Voltage | >=80 V; feature summary |
| Operating Temperature | -55 to +100 °C; maximum ratings table |
| Operating Temperature Feature Summary | -55 to +110 °C |
| Package | SMD-16; part number XL847S ordering information |
| Shipping Quantity | 20 pcs/tube; part number XL847S ordering information |
| Marking Code | XL847; part number XL847S ordering information |
| Forward Current | 50 mA; maximum rating, TA=25°C unless otherwise specified |
| Peak Forward Current | 1 A; pulse width <=1 us, duty ratio 0.001 |
| Reverse Voltage | 6 V; maximum rating, input, TA=25°C unless otherwise specified |
| Input Power Dissipation | 70 mW; maximum rating, TA=25°C unless otherwise specified |
| Collector Power Dissipation | 150 mW; maximum rating, output, TA=25°C unless otherwise specified |
| Collector Current Rating | 50 mA; maximum rating, output, TA=25°C unless otherwise specified |
| Collector-Emitter Voltage | 80 V; maximum rating, output, TA=25°C unless otherwise specified |
| Emitter-Collector Voltage | 7 V; maximum rating, output, TA=25°C unless otherwise specified |
| Total Power Dissipation | 200 mW; thermal characteristics maximum rating |
| Storage Temperature Range | -55 to +125 °C; thermal characteristics |
| Soldering Temperature | 260 °C; for 10 seconds |
| Forward Voltage | typ 1.2 V, max 1.4 V; IF=20 mA |
| Peak Forward Voltage | max 3.0 V; IFM=0.5 A |
| Reverse Current | max 10 uA; VR=4 V |
| Input Capacitance | typ 30 pF, max 250 pF; VR=0 V, f=1 kHz |
| Collector-Emitter Dark Current | max 100 nA; VCE=20 V, IF=0 |
| Collector-Emitter Breakdown Voltage Test | min 80 V; IC=0.1 mA, IF=0 |
| Emitter-Collector Breakdown Voltage | min 7 V; IE=10 uA, IF=0 |
| Collector Current Electrical | min 2.5 mA, max 30 mA; IF=5 mA, VCE=5 V |
| Collector-Emitter Saturation Voltage | typ 0.1 V, max 0.2 V; IF=20 mA, IC=1 mA |
| Isolation Resistance | min 1x10^12 ohm; VIO=500 Vdc, 40-60% RH |
| Isolation Current | max 2 uA; DC 6000 V, 40-60% RH |
| Floating Capacitance | typ 0.6 pF, max 1.0 pF; VIO=0, f=1 MHz |
| Cut-off Frequency | typ 80 kHz; VCE=5 V, IC=2 mA, RL=100 ohm, -3 dB |
| Turn-On Time | typ 4 us, max 18 us; VCE=2 V, RL=100 ohm, IC=2 mA |
| Turn-Off Time | typ 3 us, max 18 us; VCE=2 V, RL=100 ohm, IC=2 mA |
| Reflow Preheat Temperature | 150-200 °C; Ts |
| Reflow Preheat Time | 60-120 s; ts |
| Reflow Ramp-Up Rate | max 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; TL |
| Reflow Time Above Liquidus | 60-150 s; tL |
| Reflow Peak Temperature | 260 °C; Tp |
| Reflow Peak Time | 30 s; Tc between TP-5 and TP |
| Reflow Ramp-Down Rate | max 6 °C/s; TP to TL |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; wave soldering profile feature |
| Wave Soldering Preheat Heating Rate | typ 1-2 °C/s, max 4 °C/s; during preheat |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp |
| Wave Soldering Peak Time | 10 s; time within peak temperature, tp |
| Wave Soldering Ramp-Down Rate | max 5 °C/s |
| Hand Soldering Iron Temperature | 360 °C +5 °C; within 3 s; for rework or sample testing |
| Tube Quantity | 20 pcs/tube; DIP-16L/SMD-16L tube packing |
| Box Quantity | 500 pcs/box; 25 tubes/box |
| Carton Quantity | 6000 pcs/carton; 12 boxes/carton |
| Antistatic Bag Specification | 190*670 mm; packing table |
| Box Specification | 520*105*50 mm; packing table |
| Carton Specification | 545*372*235 mm; packing table |
| Molding Compound Flammability | UL 94V-0; mechanical data |
| Terminal Plating | matte tin-plated leads; solderability per MIL-STD-202, Method 208 |
| Datasheet Status | request_only |
Product Overview
Isolation characteristics include 5000 Vrms isolation voltage for 1 minute at 40-60% RH, minimum 1x10^12 ohm isolation resistance at VIO=500 Vdc, maximum 2 uA isolation current at DC 6000 V, and typical 0.6 pF floating capacitance. Assembly data covers 260 °C reflow peak temperature, 260 °C wave soldering peak temperature, and 360 °C +5 °C hand-soldering iron temperature within 3 seconds for rework or sample testing.
Key Features
- Phototransistor optocoupler product type
- SMD-16 package for XL847S ordering option
- 50-600% current transfer ratio at IF=5 mA
- 5000 Vrms isolation voltage for one minute
- Minimum 80 V collector-emitter breakdown voltage
- Typical 80 kHz cut-off frequency
- Typical 4 us turn-on time
- Typical 3 us turn-off time
- UL 94V-0 molding compound flammability
- Matte tin-plated leads per MIL-STD-202 Method 208
Typical Applications
- Isolated signal transfer
- Phototransistor output coupling
- Input-to-output electrical isolation
- Low-frequency switching interfaces
- SMD optocoupler assemblies
- Tube-packed production builds
Procurement Notes
When requesting a quote for XL847S-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is XL847S-G?
XL847S-G is identified as a XINGLIGHT phototransistor optocoupler in the LED category. The ordering information lists the XL847S package as SMD-16, with marking code XL847 and 20 pcs/tube shipping quantity.
What isolation rating is specified for XL847S-G?
The datasheet facts specify 5000 Vrms isolation voltage as a maximum rating, tested with AC for 1 minute at 40-60% relative humidity. Isolation resistance is listed as minimum 1x10^12 ohm at VIO=500 Vdc.
What current transfer ratio does XL847S-G provide?
The current transfer ratio is specified as 50-600% under IF=5 mA and VCE=5 V. The related collector current electrical specification is minimum 2.5 mA and maximum 30 mA at the same IF and VCE conditions.
What soldering profiles are documented for this part?
The extracted data includes reflow, wave, and hand-soldering conditions. Reflow peak temperature is 260 °C, wave soldering peak temperature is 260 °C for 10 seconds, and hand soldering uses 360 °C +5 °C within 3 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.