Specifications
| Type | Description |
|---|---|
| Part Number | XL852S-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Inferred Category | LED |
| Component Type | Other |
| Package Case | SMD4; package outline dimensions referenced in mm but numeric dimensions not provided in extracted text |
| Current Transfer Ratio | Min 1000 %; IF=1 mA, VCE=2 V; source page 1 |
| Isolation Voltage | 5000 Vrms; between input and output; source page 1 |
| Operating Temperature | -55 to +110 °C; operating range; source page 1 |
| Package Options | DIP4, DIP4-M, SMD4; mechanical data; source page 1 |
| Molding Compound Flammability | UL 94V-0; case molding compound; source page 1 |
| Terminal Finish | Matte tin-plated leads; solderability per MIL-STD-202, Method 208; source page 1 |
| Part Number Package | XL852S = SMD4; ordering information; source page 2 |
| Shipping Quantity | 2000 pcs/tape and reel; XL852S SMD4; source page 2 |
| Marking Code | XL852; XL852S SMD4; source page 2 |
| Forward Current | Max 60 mA; TA=25°C unless otherwise specified; source page 3 |
| Peak Forward Current | Max 1 A; pulse width <=1 us, duty ratio 0.001; source page 3 |
| Reverse Voltage | Max 6 V; input, TA=25°C unless otherwise specified; source page 3 |
| Input Power Dissipation | Max 100 mW; TA=25°C unless otherwise specified; source page 3 |
| Collector Power Dissipation | Max 150 mW; output, TA=25°C unless otherwise specified; source page 3 |
| Collector Current | Max 150 mA; output, TA=25°C unless otherwise specified; source page 3 |
| Collector-Emitter Voltage | Max 350 V; output, TA=25°C unless otherwise specified; source page 3 |
| Emitter-Collector Voltage | Max 0.1 V; output, TA=25°C unless otherwise specified; source page 3 |
| Total Power Dissipation | Max 250 mW; TA=25°C unless otherwise specified; source page 3 |
| Isolation Voltage | 5000 Vrms; 40 to 60% RH, AC for 1 minute; source page 3 |
| Storage Temperature Range | -55 to +125 °C; TA=25°C unless otherwise specified; source page 3 |
| Soldering Temperature | Max 260 °C; for 10 seconds; source page 3 |
| Forward Voltage | Typ 1.2 V, Max 1.4 V; IF=10 mA, TA=25°C; source page 4 |
| Input Reverse Current | Max 10 uA; VR=4 V, TA=25°C; source page 4 |
| Input Capacitance | Typ 50 pF; VR=0 V, f=1 kHz, TA=25°C; source page 4 |
| Collector-Emitter Dark Current | Max 100 nA; VCE=200 V, TA=25°C; source page 4 |
| Collector-Emitter Breakdown Voltage | Min 350 V; IC=0.1 mA, IF=0, TA=25°C; source page 4 |
| Emitter-Collector Breakdown Voltage | Min 0.1 V; IE=10 uA, IF=0, TA=25°C; source page 4 |
| Current Transfer Ratio | Min 1000 %; IF=1 mA, VCE=2 V, TA=25°C; source page 4 |
| Collector-Emitter Saturation Voltage | Typ 1.2 V, Max 1.5 V; IF=20 mA, IC=100 mA, TA=25°C; source page 4 |
| Isolation Resistance | Min 5×10^10 Ω, Typ 1×10^11 Ω; VIO=500 Vdc, 40 to 60% RH, TA=25°C; source page 4 |
| Floating Capacitance | Typ 0.6 pF; VIO=0, f=1 MHz, TA=25°C; source page 4 |
| Cut-off Frequency | Typ 7 kHz; VCE=2 V, IC=2 mA, RL=100 Ω, -3 dB, TA=25°C; source page 4 |
| Turn-On Time | Typ 80 us, Max 250 us; VCE=2 V, RL=100 Ω, TA=25°C; source page 4 |
| Turn-Off Time | Typ 10 us, Max 100 us; IC=20 mA, TA=25°C; source page 4 |
| Reflow Preheat Temperature | Min 150 °C, Max 200 °C; reflow soldering profile; source page 8 |
| Reflow Preheat Time | Min 60 s, Max 120 s; reflow soldering profile; source page 8 |
| Reflow Ramp-Up Rate | Max 3 °C/s; TL to TP; source page 8 |
| Reflow Liquidus Temperature | 217 °C; reflow soldering profile; source page 8 |
| Reflow Time Above Liquidus | Min 60 s, Max 150 s; time above TL; source page 8 |
| Reflow Peak Temperature | 260 °C; reflow soldering profile; source page 8 |
| Reflow Peak Time | Max 30 s; Tc between TP-5 and TP; source page 8 |
| Reflow Ramp-Down Rate | Max 6 °C/s; TP to TL; source page 8 |
| Maximum Reflow Cycles | No more than 3 times; recommended reflow soldering; source page 8 |
| Wave Soldering Average Ramp-Up Rate | Approximately 200 °C/s; wave soldering profile feature; source page 8 |
| Wave Soldering Preheat Heating Rate | Typical 1 to 2 °C/s, Max 4 °C/s; during preheat; source page 8 |
| Wave Soldering Final Preheat Temperature | Approximately 130 °C; Ts; source page 8 |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts; source page 8 |
| Wave Soldering Peak Temperature | 260 °C; Tp; source page 8 |
| Wave Soldering Time Within Peak Temperature | 10 s; tp; source page 8 |
| Wave Soldering Ramp-Down Rate | Max 5 °C/s; wave soldering profile; source page 8 |
| Hand Soldering Iron Temperature | 360 °C +5 °C; within 3 s, rework or sample testing only; source page 8 |
| SMD4 Reel Quantity | 2000 pcs/reel; packing summary; source page 9 |
| SMD4 Box Quantity | 4000 pcs/box; 2 reels/box; source page 9 |
| SMD4 Carton Quantity | 40000 pcs/carton; 10 boxes/carton; source page 9 |
| SMD4 Reel Size | 330 mm diameter; packing form reel; source page 9 |
| SMD4 Guard Band | 200 mm minimum; SMD4 tape/reel packing; source page 9 |
| SMD4 Antistatic Bag Specification | 380×420 mm; packing specification; source page 9 |
| SMD4 Box Specification | 350×340×60 mm; packing specification; source page 9 |
| SMD4 Carton Specification | 365×330×370 mm; packing specification; source page 9 |
| Document Validity | Valid until Dec 31, 2026; attention section; source page 10 |
| Datasheet Status | request_only |
Product Overview
XL852S-G is documented by XINGLIGHT as a photo Darlington optocoupler in the LED category. The SMD4 version corresponds to the XL852S ordering package and carries the XL852 marking code. Package options listed for the family include DIP4, DIP4-M, and SMD4, while the extracted package note references SMD4 outline dimensions in millimeters without numeric dimensions.
Electrical parameters include 5000 Vrms isolation between input and output, a minimum current transfer ratio of 1000% at IF=1 mA and VCE=2 V, and a 350 V minimum collector-emitter breakdown voltage. Input ratings include 60 mA maximum forward current, 1 A peak forward current under the specified pulse condition, 6 V reverse voltage, and 100 mW input power dissipation.
The SMD4 assembly information includes a 260 °C reflow peak temperature, no more than three recommended reflow cycles, 260 °C wave soldering peak temperature, and a 360 °C +5 °C hand soldering iron condition within 3 seconds for rework or sample testing only. These specifications support isolated signal interface designs using a transistor-output optocoupler format.
Key Features
- Photo Darlington optocoupler product type
- SMD4 ordering package for XL852S
- Minimum 1000% current transfer ratio
- 5000 Vrms input-to-output isolation voltage
- -55 to +110 °C operating temperature
- 350 V collector-emitter voltage rating
- 150 mA maximum collector current
- UL 94V-0 case molding compound
- Matte tin-plated leads per MIL-STD-202 Method 208
- 2000 pieces per SMD4 tape and reel
Typical Applications
- Isolated signal interface channels
- Low-current input sensing circuits
- High-voltage transistor-output isolation
- SMD optocoupler PCB assemblies
- Reflow-assembled isolation modules
- Wave-soldered optocoupler boards
Procurement Notes
When requesting a quote for XL852S-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is XL852S-G?
XL852S-G is documented as a XINGLIGHT photo Darlington optocoupler in the LED category. The extracted ordering information maps the XL852S package option to SMD4, with XL852 used as the marking code.
What isolation voltage is specified for XL852S-G?
The datasheet facts specify 5000 Vrms isolation voltage between input and output. The absolute maximum rating entry also lists 5000 Vrms under 40 to 60% RH with AC applied for 1 minute.
What current transfer ratio does XL852S-G provide?
The extracted electrical characteristics list a minimum current transfer ratio of 1000% at IF=1 mA and VCE=2 V. Page 4 specifies the same minimum at TA=25°C.
What packaging is listed for the SMD4 version?
For XL852S SMD4, the extracted facts list 2000 pieces per tape and reel and 2000 pieces per reel. Packing data also lists 4000 pieces per box and 40000 pieces per carton.
What soldering limits are provided for assembly?
The extracted soldering data includes 260 °C maximum soldering temperature for 10 seconds, a 260 °C reflow peak, no more than three reflow cycles, 260 °C wave soldering peak, and hand soldering at 360 °C +5 °C within 3 seconds for rework or sample testing only.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.