Specifications
| Type | Description |
|---|---|
| Part Number | XL860-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | DIP8 or SMD8; package outline dimensions referenced in mm but numeric dimensions not present in provided text |
| Contact Form | Normally open, single pole single throw; feature description |
| Control Voltage Capability | 600 VAC or DC; feature description |
| Isolation Voltage - Feature | 5000 Vrms; between input and output |
| Operating Temperature - Feature | -40 to +85 °C; feature description |
| Molding Compound Flammability | UL 94V-0; mechanical data |
| Terminal Finish | Matte tin-plated leads; solderability per MIL-STD-202, Method 208 |
| Forward Current | 50 mA; absolute maximum rating, Ta=25°C unless otherwise specified |
| Peak Forward Current | 1 A; pulse width <=1 us, duty ratio 0.001 |
| Reverse Voltage | 5 V; absolute maximum rating, input, Ta=25°C unless otherwise specified |
| Input Power Dissipation | 75 mW; absolute maximum rating, input, Ta=25°C unless otherwise specified |
| Load Voltage | 600 V; peak AC, output absolute maximum rating, Ta=25°C unless otherwise specified |
| Continuous Load Current | 0.04 A; peak AC, output absolute maximum rating, Ta=25°C unless otherwise specified |
| Peak Load Current | 0.15 A; 100 ms, 1 shot, VL=DC |
| Output Power Dissipation | 800 mW; absolute maximum rating, output, Ta=25°C unless otherwise specified |
| Isolation Voltage - Test Condition | 5000 Vrms; 40 to 60% RH, AC for 1 minute |
| Operating Temperature Range | -40 to +85 °C; thermal characteristics |
| Storage Temperature Range | -40 to +100 °C; thermal characteristics |
| LED Turn-On Current | typ 0.4 mA, max 3 mA; IL=0.04 A, Ta=25°C unless otherwise specified |
| LED Turn-Off Current | min 0 mA, typ 0.3 mA; IL=0.04 A, Ta=25°C unless otherwise specified |
| LED Dropout Voltage | min 1 V, typ 1.3 V, max 1.4 V; IF=5 mA, Ta=25°C unless otherwise specified |
| On Resistance | typ 36 ohm, max 120 ohm; IF=5 mA, IL=0.04 A, within 1 s on time, Ta=25°C unless otherwise specified |
| Off-State Leakage Current | max 1000 nA; IF=0 mA, VL=600 V, Ta=25°C unless otherwise specified |
| Turn-On Time | min 20 us, typ 120 us, max 2000 us; IF=5 mA, IL=0.04 A, Ta=25°C unless otherwise specified |
| Turn-Off Time | min 10 us, typ 350 us, max 1000 us; IF=5 mA, IL=0.04 A, Ta=25°C unless otherwise specified |
| Input/Output Capacitance | typ 0.8 pF, max 1.5 pF; f=1 MHz, VB=0, Ta=25°C unless otherwise specified |
| Initial Input/Output Isolation Resistance | min 1000 Mohm; 500 VDC, Ta=25°C unless otherwise specified |
| Recommended LED Forward Current | 5 to 10 mA; application note |
| Reflow Preheat Temperature | min 150 °C, max 200 °C; reflow soldering profile |
| Reflow Preheat Time | min 60 s, max 120 s; reflow soldering profile |
| Reflow Ramp-Up Rate | max 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; reflow soldering profile |
| Reflow Time Above Liquidus | min 60 s, max 150 s; above TL |
| Reflow Peak Temperature | 260 °C; reflow soldering profile |
| Reflow Peak Time | max 30 s; time between TP-5 and TP |
| Reflow Ramp-Down Rate | max 6 °C/s; TP to TL |
| Reflow Cycle Limit | No more than 3 times; recommended reflow soldering condition |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; wave soldering profile feature as printed |
| Wave Soldering Heating Rate During Preheat | typ 1 to 2 °C/s, max 4 °C/s; wave soldering profile |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts |
| Wave Soldering Preheat Time | >60 s; 25 °C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp |
| Wave Soldering Peak Time | 10 s; within peak temperature tp |
| Wave Soldering Ramp-Down Rate | max 5 °C/s; wave soldering profile |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s; for product rework or sample testing only |
| DIP8 Packing Quantity | 45 pcs/tube, 2250 pcs/box, 22500 pcs/carton; tube packing, 50 tubes/box, 10 boxes/carton |
| SMD8 Packing Quantity | 1000 pcs/reel, 2000 pcs/box, 20000 pcs/carton; reel packing, 2 reels/box, 5 boxes/carton |
| Datasheet Status | request_only |
Product Overview
XL860-G is a XINGLIGHT normally-open photo relay in the LED category. Its contact form is normally open, single pole single throw, and the feature description lists 600 VAC or DC control voltage capability with 5000 Vrms isolation between input and output.
The part is associated with DIP8 or SMD8 packaging. The extracted package note states that package outline dimensions are referenced in millimeters, but numeric dimensions are not present in the provided text. Mechanical data lists UL 94V-0 molding compound flammability and matte tin-plated leads with solderability per MIL-STD-202, Method 208.
Input and output ratings include 50 mA forward current, 5 V reverse voltage, 75 mW input power dissipation, 600 V peak AC load voltage, and 0.04 A continuous load current. At IF=5 mA and IL=0.04 A, the datasheet lists 36 ohm typical on resistance, turn-on time of 120 us typical, and turn-off time of 350 us typical.
Assembly guidance covers reflow, wave soldering, and hand soldering conditions. Packing is listed separately for DIP8 tube packing and SMD8 reel packing.
Key Features
- Normally open, single pole single throw contact form
- 600 VAC or DC control voltage capability
- 5000 Vrms input-to-output isolation rating
- -40 to +85 °C operating temperature range
- 600 V peak AC load voltage rating
- 0.04 A continuous load current rating
- 36 ohm typical on resistance at IF=5 mA
- 1000 nA maximum off-state leakage at 600 V
- DIP8 tube and SMD8 reel packing options
- UL 94V-0 molding compound flammability
Typical Applications
- Isolated load switching
- AC or DC control circuits
- Low-current relay replacement
- SPST normally-open switching
- 600 V load control
- DIP8 through-hole assemblies
- SMD8 surface-mount assemblies
Procurement Notes
When requesting a quote for XL860-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is the XL860-G?
XL860-G is described as a normally-open photo relay from XINGLIGHT. Its contact form is normally open, single pole single throw, and it is listed in the LED category with DIP8 or SMD8 package options.
What isolation rating is specified for XL860-G?
The extracted datasheet facts list 5000 Vrms isolation between input and output. A separate isolation test condition also lists 5000 Vrms at 40 to 60% relative humidity with AC applied for 1 minute.
What LED drive current is recommended?
The application note lists a recommended LED forward current range of 5 to 10 mA. Electrical characteristics are also specified at IF=5 mA for LED dropout voltage, on resistance, turn-on time, and turn-off time.
What package and packing options are listed?
The package information identifies DIP8 or SMD8. DIP8 tube packing is listed as 45 pcs per tube, 2250 pcs per box, and 22500 pcs per carton. SMD8 reel packing is listed as 1000 pcs per reel, 2000 pcs per box, and 20000 pcs per carton.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.