Specifications
| Type | Description |
|---|---|
| Part Number | XL860-VG1.0 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Inferred Category | LED |
| Component Type | Other |
| Package Case | DIP8, SMD8; package outline dimensions referenced in mm but numeric dimensions not provided in extracted text |
| Contact Form | Normally open, single pole single throw; condition: Feature description; source page: 1 |
| Control Voltage | 600 VAC or DC; condition: Feature description; source page: 1 |
| Isolation Voltage | 5000 Vrms; condition: Between input and output; source page: 1 |
| Operating Temperature | -40 to +85 °C; condition: Feature description; source page: 1 |
| Package Options | DIP8, SMD8; condition: Mechanical data / ordering information; source page: 1 |
| Molding Compound Flammability | UL 94V-0; condition: Mechanical data; source page: 1 |
| Terminal Finish | Matte tin-plated leads; condition: Solderability per MIL-STD-202, Method 208; source page: 1 |
| DIP8 Shipping Quantity | 45 pcs/tube; condition: Part number XL860; source page: 2 |
| SMD8 Shipping Quantity | 1000 pcs/tape and reel; condition: Part number XL860A; source page: 2 |
| Marking Code | XL860; condition: For XL860 and XL860A; source page: 2 |
| Input Forward Current | Max 50 mA; condition: Maximum ratings, TA=25°C unless otherwise specified; source page: 2 |
| Input Peak Forward Current | Max 1 A; condition: Pulse width <=1 us, duty ratio 0.001; source page: 2 |
| Input Reverse Voltage | Max 5 V; condition: Maximum ratings, TA=25°C unless otherwise specified; source page: 2 |
| Input Power Dissipation | Max 75 mW; condition: Maximum ratings, TA=25°C unless otherwise specified; source page: 2 |
| Output Load Voltage | Max 600 V; condition: Peak AC, maximum ratings, TA=25°C unless otherwise specified; source page: 2 |
| Continuous Load Current | Max 0.04 A; condition: Peak AC, maximum ratings, TA=25°C unless otherwise specified; source page: 2 |
| Peak Load Current | Max 0.15 A; condition: 100 ms, 1 shot, VL=DC; source page: 2 |
| Output Power Dissipation | Max 800 mW; condition: Maximum ratings, TA=25°C unless otherwise specified; source page: 2 |
| Isolation Voltage | 5000 Vrms; condition: 40 to 60% RH, AC for 1 minute; source page: 3 |
| Operating Temperature Range | -40 to +85 °C; condition: Thermal characteristics; source page: 3 |
| Storage Temperature Range | -40 to +100 °C; condition: Thermal characteristics; source page: 3 |
| LED Turn-On Current | Typ 0.4 mA, Max 3 mA; condition: IL=0.04 A, TA=25°C unless otherwise specified; source page: 3 |
| LED Turn-Off Current | Min 0 mA, Typ 0.3 mA; condition: IL=0.04 A, TA=25°C unless otherwise specified; source page: 3 |
| LED Dropout Voltage | Min 1 V, Typ 1.3 V, Max 1.4 V; condition: IF=5 mA, TA=25°C unless otherwise specified; source page: 3 |
| On Resistance | Typ 36 ohm, Max 120 ohm; condition: IF=5 mA, IL=0.04 A, within 1 s on time; source page: 3 |
| Off-State Leakage Current | Max 1000 nA; condition: IF=0 mA, VL=600 V; source page: 3 |
| Turn-On Time | Min 20 us, Typ 120 us, Max 2000 us; condition: IF=5 mA, IL=0.04 A; source page: 3 |
| Turn-Off Time | Min 10 us, Typ 350 us, Max 1000 us; condition: IF=5 mA, IL=0.04 A; source page: 3 |
| I/O Capacitance | Min 0.8 pF, Max 1.5 pF; condition: f=1 MHz, VB=0; source page: 3 |
| Initial I/O Isolation Resistance | Min 1000 Mohm; condition: 500 VDC; source page: 3 |
| Recommended LED Forward Current | 5 to 10 mA; condition: Application note; source page: 3 |
| Reflow Preheat Temperature | Min 150 °C, Max 200 °C; condition: Reflow soldering profile, Ts; source page: 7 |
| Reflow Preheat Time | Min 60 s, Max 120 s; condition: Reflow soldering profile, ts; source page: 7 |
| Reflow Ramp-Up Rate | Max 3 °C/s; condition: TL to TP; source page: 7 |
| Reflow Liquidus Temperature | 217 °C; condition: TL; source page: 7 |
| Reflow Time Above Liquidus | Min 60 s, Max 150 s; condition: tL above TL; source page: 7 |
| Reflow Peak Temperature | 260 °C; condition: Tp; source page: 7 |
| Reflow Peak Dwell Time | Max 30 s; condition: Time between TP-5 and TP; source page: 7 |
| Reflow Ramp-Down Rate | Max 6 °C/s; condition: TP to TL; source page: 7 |
| Reflow Cycle Limit | No more than 3 times; condition: Recommended reflow soldering; source page: 7 |
| Wave Soldering Average Ramp-Up Rate | Approximately 200 °C/s; condition: Wave soldering profile feature; source page: 7 |
| Wave Soldering Heating Rate During Preheat | Typical 1 to 2 °C/s, Max 4 °C/s; condition: Wave soldering profile feature; source page: 7 |
| Wave Soldering Final Preheat Temperature | Approximately 130 °C; condition: Ts; source page: 7 |
| Wave Soldering Preheat Time | >60 s; condition: 25 °C to Ts; source page: 7 |
| Wave Soldering Peak Temperature | 260 °C; condition: Tp; source page: 7 |
| Wave Soldering Peak Time | 10 s; condition: Time within peak temperature, tp; source page: 7 |
| Wave Soldering Ramp-Down Rate | Max 5 °C/s; condition: Wave soldering profile feature; source page: 7 |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s; condition: Only for product rework or sample testing; source page: 7 |
| DIP8 Packing Quantity Per Tube | 45 pcs/tube; condition: Tube 500 mm; source page: 8 |
| DIP8 Packing Quantity Per Box | 2250 pcs/box; condition: 50 tubes/box; source page: 8 |
| DIP8 Packing Quantity Per Carton | 22500 pcs/carton; condition: 10 boxes/carton; source page: 8 |
| SMD8 Packing Quantity Per Reel | 1000 pcs/reel; condition: Reel diameter 330 mm; source page: 8 |
| SMD8 Packing Quantity Per Box | 2000 pcs/box; condition: 2 reels/box; source page: 8 |
| SMD8 Packing Quantity Per Carton | 20000 pcs/carton; condition: 5 boxes/carton; source page: 8 |
| Document Validity | Valid until Dec 31, 2026; condition: Attention note; source page: 8 |
| Datasheet Status | request_only |
Product Overview
XL860-VG1.0 is a XINGLIGHT photo relay specified as a normally open, single pole single throw device in the LED category. The extracted datasheet facts identify DIP8 and SMD8 package options, with package outline dimensions referenced in millimeters but without numeric dimensions in the extracted text.
The relay is rated for 600 VAC or DC control voltage and 600 V maximum output load voltage. Maximum continuous load current is 0.04 A, with a 0.15 A peak load current for a 100 ms, one-shot condition at VL=DC. Input-side limits include 50 mA maximum forward current, 1 A peak forward current under the stated pulse condition, 5 V maximum reverse voltage, and 75 mW input power dissipation.
Electrical characteristics include 5000 Vrms isolation, 1000 Mohm minimum initial I/O isolation resistance at 500 VDC, 0.8 pF minimum to 1.5 pF maximum I/O capacitance, and 1000 nA maximum off-state leakage at IF=0 mA and VL=600 V. Assembly data covers reflow, wave soldering, and hand soldering limits, including 260 °C peak reflow and wave soldering temperatures.
Key Features
- Normally open SPST photo relay contact form
- 600 VAC or DC control voltage rating
- 5000 Vrms isolation between input and output
- DIP8 and SMD8 package options
- -40 to +85 °C operating temperature range
- 5 to 10 mA recommended LED forward current
- 36 ohm typical on resistance at stated test conditions
- 1000 nA maximum off-state leakage at 600 V
- 260 °C peak reflow soldering temperature
- Matte tin-plated leads with UL 94V-0 molding compound
Typical Applications
- 600 V load switching
- Isolated input-to-output switching
- Low-current LED drive interfaces
- DIP8 tube assembly
- SMD8 tape-and-reel assembly
- Reflow soldered boards
- Wave soldered assemblies
- Sample testing and rework
Procurement Notes
When requesting a quote for XL860-VG1.0, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What contact form does XL860-VG1.0 provide?
XL860-VG1.0 is specified as a normally open, single pole single throw photo relay. The marking code listed for the XL860 and XL860A package variants is XL860.
What isolation rating is specified for this photo relay?
The extracted datasheet facts list 5000 Vrms isolation between input and output. A separate isolation condition also specifies 5000 Vrms at 40 to 60% RH with AC applied for 1 minute.
Which package and packing options are listed?
The device is listed with DIP8 and SMD8 package options. DIP8 packing is 45 pcs per tube, while SMD8 packing is 1000 pcs per reel or tape and reel, with box and carton quantities also specified.
What LED drive current is recommended?
The application note specifies a recommended LED forward current of 5 to 10 mA. Electrical characteristics also list LED turn-on current as 0.4 mA typical and 3 mA maximum under the stated load condition.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.