Specifications
| Type | Description |
|---|---|
| Part Number | XLCNY17-2 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Component Type | LED |
| Package Case | DIP6, SMD6; package outline dimensions referenced in mm but numeric dimensions not provided in extracted text |
| Current Transfer Ratio | ≥20%; IF=10 mA, VCE=10 V |
| Isolation Voltage | 5000 Vrms; between input and output |
| Operating Temperature | -55 to +100 °C |
| Package Options | DIP6, SMD6; case/package type |
| Molding Compound Flammability | UL 94V-0; mechanical data |
| Terminal Finish | matte tin-plated leads; solderability per MIL-STD-202 Method 208 |
| DIP6 Shipping Quantity | 65 pcs/tube; part number XLCNY17-2 |
| SMD6 Shipping Quantity | 1000 pcs/tape and reel; part number XLCNY17-2S |
| Forward Current | 60 mA; maximum rating, TA=25°C unless otherwise specified |
| Forward Peak Current | 1 A; pulse width ≤1 µs, duty ratio 0.001 |
| Reverse Voltage | 6 V; maximum rating, input |
| Input Power Dissipation | 100 mW; maximum rating |
| Collector Power Dissipation | 300 mW; maximum rating |
| Collector Current | 100 mA; maximum rating |
| Collector-Base Voltage | 70 V; maximum rating, output |
| Collector-Emitter Voltage | 30 V; maximum rating, output |
| Emitter-Collector Voltage | 7 V; maximum rating, output |
| Total Power Dissipation | 350 mW; thermal characteristic |
| Isolation Voltage | 5000 Vrms; 40 to 60% RH, AC for 1 minute; pins 1,2,3 shorted and pins 4,5,6 shorted together |
| Operating Temperature | -55 to +100 °C; thermal characteristic |
| Storage Temperature Range | -55 to +125 °C; thermal characteristic |
| Soldering Temperature | 260 °C; for 10 seconds |
| Forward Voltage | typ 1.2 V, max 1.5 V; IF=10 mA, TA=25°C |
| Reverse Current | max 10 µA; VR=3 V, TA=25°C |
| Input Capacitance | typ 50 pF; V=0 V, f=1 kHz, TA=25°C |
| Collector Dark Current | max 50 nA; VCE=10 V, TA=25°C |
| Collector-Base Breakdown Voltage | min 70 V; IB=0.1 mA, IF=0, TA=25°C |
| Collector-Emitter Breakdown Voltage | min 30 V; IC=0.1 mA, IF=0, TA=25°C |
| Emitter-Collector Breakdown Voltage | min 7 V; IE=0.01 mA, IF=0, TA=25°C |
| Current Transfer Ratio | min 20%; IF=10 mA, VCE=10 V, TA=25°C |
| Collector-Emitter Saturation Voltage | typ 0.5 V; IF=50 mA, IC=2 mA, TA=25°C |
| Isolation Resistance | min 5×10^10 Ω, typ 10^11 Ω; DC 500 V, 40 to 60% RH, TA=25°C |
| Isolation Capacitance | typ 1 pF, max 2.5 pF; V=0 V, f=1 MHz, TA=25°C |
| Response Time Rise | typ 3 µs, max 10 µs; VCE=10 V, IC=2 mA, RL=100 Ω, TA=25°C |
| Response Time Fall | typ 3 µs, max 10 µs; VCE=10 V, IC=2 mA, RL=100 Ω, TA=25°C |
| Reflow Preheat Temperature | 150 to 200 °C; reflow soldering profile, Ts |
| Reflow Preheat Time | 60 to 120 s; reflow soldering profile, ts |
| Reflow Ramp-Up Rate | max 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; TL |
| Reflow Time Above Liquidus | 60 to 150 s; time above TL |
| Reflow Peak Temperature | 260 °C; Tp |
| Reflow Peak Dwell Time | max 30 s; time during which Tc is between TP-5 and TP |
| Reflow Ramp-Down Rate | max 6 °C/s; TP to TL |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; wave soldering profile feature |
| Wave Soldering Heating Rate During Preheat | typ 1 to 2 °C/s, max 4 °C/s; wave soldering preheat |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp |
| Wave Soldering Peak Time | 10 s; time within peak temperature, tp |
| Wave Soldering Ramp-Down Rate | max 5 °C/s; wave soldering profile |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s; for product rework or sample testing |
| DIP6 Packing Quantity Per Tube | 65 pcs/tube; tube length 500 mm |
| DIP6 Quantity Per Box | 3250 pcs/box; 50 tubes/box |
| DIP6 Quantity Per Carton | 32500 pcs/carton; 10 boxes/carton |
| SMD6 Packing Quantity Per Reel | 1000 pcs/reel; reel diameter 330 mm |
| SMD6 Quantity Per Box | 2000 pcs/box; 2 reels/box |
| SMD6 Quantity Per Carton | 20000 pcs/carton; 10 boxes/carton |
| Datasheet Status | request_only |
Product Overview
The XLCNY17-2 is a XINGLIGHT phototransistor optocoupler categorized under LED components. It is specified with DIP6 and SMD6 package options, with package outline dimensions referenced in millimeters in the manufacturer datasheet, though numeric outline dimensions are not included in the extracted text.
Key electrical parameters include a minimum current transfer ratio of 20% at IF=10 mA and VCE=10 V, a forward voltage of typ 1.2 V and max 1.5 V at IF=10 mA, and a collector dark current of max 50 nA at VCE=10 V. Output-side ratings include 70 V collector-base voltage, 30 V collector-emitter voltage, and 7 V emitter-collector voltage.
The device is specified for 5000 Vrms isolation between input and output, with isolation resistance of min 5×10^10 Ω and typ 10^11 Ω at DC 500 V. Assembly data covers reflow, wave, and hand soldering profiles, including a 260 °C reflow peak and 260 °C wave soldering peak.
Key Features
- Phototransistor optocoupler with DIP6 and SMD6 package options
- Minimum 20% current transfer ratio at IF=10 mA
- 5000 Vrms isolation voltage between input and output
- Operating temperature range from -55 to +100 °C
- Forward voltage typ 1.2 V, max 1.5 V
- Collector-emitter breakdown voltage minimum 30 V
- Rise and fall response times typ 3 µs
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads for specified solderability
- Reflow and wave soldering profiles specified
Typical Applications
- Input-to-output signal isolation
- Phototransistor optocoupler interfaces
- DIP6 through-hole assemblies
- SMD6 tape-and-reel assemblies
- Isolated collector-output circuits
- Reflow soldered PCB assemblies
- Wave soldered PCB assemblies
Procurement Notes
When requesting a quote for XLCNY17-2, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of component is the XLCNY17-2?
The XLCNY17-2 is a XINGLIGHT phototransistor optocoupler in the LED category. The extracted datasheet facts list DIP6 and SMD6 package options and specify optical isolation and current transfer parameters.
What isolation rating is specified for XLCNY17-2?
The manufacturer datasheet specifies 5000 Vrms isolation voltage between input and output. A detailed condition is also listed as AC for 1 minute at 40 to 60% RH with input pins and output pins shorted separately.
What current transfer ratio does XLCNY17-2 provide?
The extracted electrical characteristics specify a minimum current transfer ratio of 20% at IF=10 mA and VCE=10 V. The page 3 condition also states TA=25°C for this CTR value.
Which package and packing options are listed?
The datasheet facts list DIP6 and SMD6 package options. DIP6 packing is 65 pcs per tube, with 3250 pcs per box and 32500 pcs per carton. SMD6 packing is 1000 pcs per reel, 2000 pcs per box, and 20000 pcs per carton.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.