Specifications
| Type | Description |
|---|---|
| Part Number | XLCNY17-3 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package Case | DIP6, SMD6; dimensions not provided in extracted text |
| Current Transfer Ratio | >=100 %; IF=10 mA, VCE=10 V |
| Isolation Voltage | 5000 Vrms; input to output isolation |
| Operating Temperature | -55 to +100 °C; operating range |
| Package Options | DIP6, SMD6; case type |
| Molding Compound Flammability | UL 94V-0; package material rating |
| DIP6 Shipping Quantity | 65 pcs/tube; part number XLCNY17-3 |
| SMD6 Shipping Quantity | 1000 pcs/tape & reel; part number XLCNY17-3S |
| Forward Current | 60 mA; maximum rating, TA=25°C |
| Forward Peak Current | 1 A; pulse width <=1 µs, duty ratio 0.001, TA=25°C |
| Reverse Voltage | 6 V; maximum rating, TA=25°C |
| Input Power Dissipation | 100 mW; maximum rating, TA=25°C |
| Collector Power Dissipation | 300 mW; maximum rating, TA=25°C |
| Collector Current | 100 mA; maximum rating, TA=25°C |
| Collector-Base Voltage | 70 V; maximum rating, TA=25°C |
| Collector-Emitter Voltage | 30 V; maximum rating, TA=25°C |
| Emitter-Collector Voltage | 7 V; maximum rating, TA=25°C |
| Total Power Dissipation | 350 mW; maximum rating, TA=25°C |
| Isolation Voltage | 5000 Vrms; 40 to 60% RH, AC for 1 minute; pins 1,2,3 shorted and pins 4,5,6 shorted together |
| Operating Temperature | -55 to +100 °C; thermal characteristics |
| Storage Temperature Range | -55 to +125 °C; thermal characteristics |
| Soldering Temperature | 260 °C; for 10 seconds |
| Forward Voltage | Typ 1.2 V, Max 1.5 V; IF=10 mA, TA=25°C |
| Reverse Current | Max 10 µA; VR=3 V, TA=25°C |
| Input Capacitance | Typ 50 pF; V=0 V, f=1 kHz, TA=25°C |
| Collector Dark Current | Max 50 nA; VCE=10 V, TA=25°C |
| Collector-Base Breakdown Voltage | Min 70 V; IB=0.1 mA, IF=0, TA=25°C |
| Collector-Emitter Breakdown Voltage | Min 30 V; IC=0.1 mA, IF=0, TA=25°C |
| Emitter-Collector Breakdown Voltage | Min 7 V; IE=0.01 mA, IF=0, TA=25°C |
| Current Transfer Ratio | Min 100 %; IF=10 mA, VCE=10 V, TA=25°C |
| Collector-Emitter Saturation Voltage | Typ 0.3 V; IF=50 mA, IC=2 mA, TA=25°C |
| Isolation Resistance | Min 5*10^10 Ω, Typ 10^11 Ω; DC 500 V, 40 to 60% RH, TA=25°C |
| Isolation Capacitance | Typ 1 pF, Max 2.5 pF; V=0 V, f=1 MHz, TA=25°C |
| Response Time Rise | Typ 3 µs, Max 10 µs; VCE=10 V, IC=2 mA, RL=100 Ω, TA=25°C |
| Response Time Fall | Typ 3 µs, Max 10 µs; VCE=10 V, IC=2 mA, RL=100 Ω, TA=25°C |
| Reflow Preheat Temperature | 150 to 200 °C; reflow soldering profile |
| Reflow Preheat Time | 60 to 120 s; reflow soldering profile |
| Reflow Ramp-Up Rate | Max 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; reflow soldering profile |
| Reflow Time Above Liquidus | 60 to 150 s; above TL |
| Reflow Peak Temperature | 260 °C; reflow soldering profile |
| Reflow Peak Time | Max 30 s; time between TP-5 and TP |
| Reflow Ramp-Down Rate | Max 6 °C/s; TP to TL |
| Reflow Cycle Limit | No more than 3 times; recommended reflow soldering |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; wave soldering profile |
| Wave Soldering Heating Rate During Preheat | Typical 1 to 2 °C/s, Max 4 °C/s; wave soldering profile |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp |
| Wave Soldering Peak Time | 10 s; within peak temperature tp |
| Wave Soldering Ramp-Down Rate | Max 5 °C/s; wave soldering profile |
| Hand Soldering Iron Temperature | 360 °C +5 °C; within 3 s; for product rework or sample testing |
| DIP6 Packing Quantity Per Tube | 65 pcs/tube; tube packing, 500 mm |
| DIP6 Packing Quantity Per Box | 3250 pcs/box; 50 tubes/box |
| DIP6 Packing Quantity Per Carton | 32500 pcs/carton; 10 boxes/carton |
| SMD6 Packing Quantity Per Reel | 1000 pcs/reel; reel diameter 330 mm |
| SMD6 Packing Quantity Per Box | 2000 pcs/box; 2 reels/box |
| SMD6 Packing Quantity Per Carton | 20000 pcs/carton; 10 boxes/carton |
| Datasheet Status | request_only |
Product Overview
The XLCNY17-3 is a XINGLIGHT phototransistor optocoupler in the LED category. It is specified with DIP6 and SMD6 package options, with dimensions not provided in the extracted text. The package molding compound is rated UL 94V-0, and the input-to-output isolation rating is 5000 Vrms.
Key electrical parameters include a minimum current transfer ratio of 100% at IF=10 mA, VCE=10 V, TA=25°C; typical forward voltage of 1.2 V and maximum 1.5 V at IF=10 mA; maximum reverse current of 10 µA at VR=3 V; and typical input capacitance of 50 pF. Output-side ratings include 100 mA collector current, 70 V collector-base voltage, 30 V collector-emitter voltage, and 7 V emitter-collector voltage.
Thermal and assembly data cover -55 to +100°C operation, -55 to +125°C storage, 260°C soldering for 10 seconds, and detailed reflow and wave soldering limits. Packing options include 65 pcs/tube for DIP6 and 1000 pcs/reel for SMD6.
Key Features
- Phototransistor optocoupler product type
- DIP6 and SMD6 package options
- 5000 Vrms input-to-output isolation rating
- Minimum 100% current transfer ratio
- -55 to +100 °C operating temperature range
- UL 94V-0 molding compound flammability rating
- Typical 3 µs rise and fall times
- 260 °C peak reflow soldering profile
- DIP6 supplied as 65 pcs per tube
- SMD6 supplied as 1000 pcs per reel
Typical Applications
- Input-to-output isolated signal transfer
- Phototransistor optocoupler interfaces
- DIP6 through-hole assemblies
- SMD6 tape-and-reel assemblies
- Circuits requiring 5000 Vrms isolation
- Designs using 100% minimum CTR
- -55 to +100 °C operating environments
Procurement Notes
When requesting a quote for XLCNY17-3, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is the XLCNY17-3?
The XLCNY17-3 is a XINGLIGHT phototransistor optocoupler in the LED category. The extracted package information lists DIP6 and SMD6 options, with package dimensions not provided in the extracted text.
What isolation rating is specified for XLCNY17-3?
The specified input-to-output isolation voltage is 5000 Vrms. One extracted condition states AC for 1 minute at 40 to 60% RH with pins 1,2,3 shorted and pins 4,5,6 shorted together.
What current transfer ratio does XLCNY17-3 provide?
The current transfer ratio is specified as at least 100%. The detailed electrical condition is IF=10 mA, VCE=10 V, and TA=25°C for the minimum 100% CTR value.
What assembly temperature limits are listed?
The extracted soldering data includes 260°C for 10 seconds, a reflow peak temperature of 260°C, and a wave soldering peak temperature of 260°C for 10 seconds. Hand soldering is listed as 360°C +5°C within 3 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.