Specifications
| Type | Description |
|---|---|
| Part Number | XLCNY17-4 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Inferred Category | LED |
| Component Type | Other |
| Package Case | DIP6, SMD6; package outline dimensions referenced in mm but numeric dimensions not provided in supplied text |
| Current Transfer Ratio Feature | ≥100%; IF=10 mA, VCE=10 V |
| Isolation Voltage Feature | 5000 Vrms; between input and output |
| Operating Temperature Feature | -55 to +100 °C |
| Case | DIP6, SMD6 |
| Molding Compound Flammability | UL 94V-0 |
| Terminals | matte tin-plated leads; solderability per MIL-STD-202, Method 208 |
| Package Shipping Quantity | 65 pcs/tube; XLCNY17-4 DIP6 |
| Package Shipping Quantity | 1000 pcs/tape and reel; XLCNY17-4S SMD6 |
| Marking Code | XLCNY17-4; DIP6 and SMD6 variants |
| Forward Current | 60 mA maximum rating; TA=25°C unless otherwise specified |
| Forward Peak Current | 1 A maximum rating; pulse width ≤1 µs, duty ratio 0.001 |
| Reverse Voltage | 6 V maximum rating, input |
| Input Power Dissipation | 100 mW maximum rating, input |
| Collector Power Dissipation | 300 mW maximum rating, output |
| Collector Current | 100 mA maximum rating, output |
| Collector-Base Voltage | 70 V maximum rating, output |
| Collector-Emitter Voltage | 30 V maximum rating, output |
| Emitter-Collector Voltage | 7 V maximum rating, output |
| Total Power Dissipation | 350 mW; thermal characteristic, TA=25°C unless otherwise specified |
| Isolation Voltage | 5000 Vrms; 40 to 60% RH, AC for 1 minute; pins 1,2,3 shorted and pins 4,5,6 shorted together |
| Operating Temperature | -55 to +100 °C; thermal characteristic |
| Storage Temperature Range | -55 to +125 °C; thermal characteristic |
| Soldering Temperature | 260 °C for 10 seconds |
| Forward Voltage | Typ 1.2 V, Max 1.5 V; IF=10 mA, TA=25°C |
| Reverse Current | Max 10 µA; VR=3 V, TA=25°C |
| Input Capacitance | Typ 50 pF; V=0 V, f=1 kHz, TA=25°C |
| Collector Dark Current | Max 50 nA; VCE=10 V, TA=25°C |
| Collector-Base Breakdown Voltage | Min 70 V; IB=0.1 mA, IF=0, TA=25°C |
| Collector-Emitter Breakdown Voltage | Min 30 V; IC=0.1 mA, IF=0, TA=25°C |
| Emitter-Collector Breakdown Voltage | Min 7 V; IE=0.01 mA, IF=0, TA=25°C |
| Current Transfer Ratio | Min 100%; IF=10 mA, VCE=10 V, TA=25°C |
| Collector-Emitter Saturation Voltage | Typ 0.3 V; IF=50 mA, IC=2 mA, TA=25°C |
| Isolation Resistance | Min 5×10^10 Ω, Typ 10^11 Ω; DC 500 V, 40 to 60% RH, TA=25°C |
| Isolation Capacitance | Typ 1 pF, Max 2.5 pF; V=0 V, f=1 MHz, TA=25°C |
| Response Time Rise | Typ 3 µs, Max 10 µs; VCE=10 V, IC=2 mA, RL=100 Ω, TA=25°C |
| Response Time Fall | Typ 3 µs, Max 10 µs; VCE=10 V, IC=2 mA, RL=100 Ω, TA=25°C |
| Reflow Preheat Temperature | Min 150 °C, Max 200 °C; reflow soldering profile |
| Reflow Preheat Time | Min 60 s, Max 120 s; reflow soldering profile |
| Reflow Ramp-Up Rate | Max 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; reflow soldering profile |
| Reflow Time Above Liquidus | Min 60 s, Max 150 s; above TL=217 °C |
| Reflow Peak Temperature | 260 °C; reflow soldering profile |
| Reflow Time Near Peak | Max 30 s; time during which Tc is between TP-5 and TP |
| Reflow Ramp-Down Rate | Max 6 °C/s; TP to TL |
| Reflow Cycle Limit | no more than 3 times; recommended reflow soldering temperatures and times |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; wave soldering profile feature |
| Wave Soldering Heating Rate During Preheat | typical 1 to 2 °C/s, maximum 4 °C/s; wave soldering profile feature |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts |
| Wave Soldering Preheat Time | >60 s; 25 °C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp |
| Wave Soldering Time Within Peak Temperature | 10 s; tp |
| Wave Soldering Ramp-Down Rate | Max 5 °C/s; wave soldering profile feature |
| Hand Soldering Iron Temperature | 360 °C ±5 °C within 3 s; for product rework or sample testing |
| DIP6 Tube Quantity | 65 pcs/tube; tube length 500 mm |
| DIP6 Box Quantity | 3250 pcs/box; 50 tubes/box |
| DIP6 Carton Quantity | 32500 pcs/carton; 10 boxes/carton |
| SMD6 Reel Quantity | 1000 pcs/reel; reel diameter 330 mm |
| SMD6 Box Quantity | 2000 pcs/box; 2 reels/box |
| SMD6 Carton Quantity | 20000 pcs/carton; 10 boxes/carton |
| Document Validity | valid until Dec 31, 2026; manufacturer attention note |
| Datasheet Status | request_only |
Product Overview
The XLCNY17-4 is a XINGLIGHT phototransistor optocoupler in the LED category. It is documented for DIP6 and SMD6 case options, with package outline dimensions referenced in millimeters but no numeric outline dimensions included in the supplied extracted text. The marking code is XLCNY17-4 for both DIP6 and SMD6 variants.
Key electrical parameters include 5000 Vrms isolation between input and output, minimum 100% current transfer ratio at IF=10 mA and VCE=10 V, and an operating temperature range of -55 to +100 °C. Input ratings include 60 mA forward current, 1 A forward peak current for pulses up to 1 µs at 0.001 duty ratio, and 6 V reverse voltage.
Output-side ratings include 100 mA collector current, 300 mW collector power dissipation, 70 V collector-base voltage, 30 V collector-emitter voltage, and 7 V emitter-collector voltage. The datasheet also provides reflow, wave, and hand-soldering parameters for assembly planning.
Key Features
- Phototransistor optocoupler with LED input structure
- DIP6 and SMD6 case options listed
- 5000 Vrms input-to-output isolation voltage
- Minimum 100% CTR at IF=10 mA
- -55 to +100 °C operating temperature range
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads with MIL-STD-202 solderability
- Typical 3 µs rise and fall response times
- 260 °C peak reflow and wave soldering profiles
- DIP6 tube and SMD6 reel packing options
Typical Applications
- Input-to-output signal isolation
- Transistor-output interface coupling
- Control circuit galvanic separation
- Low-speed isolated signal transfer
- DIP6 through-hole assemblies
- SMD6 tape-and-reel assemblies
Procurement Notes
When requesting a quote for XLCNY17-4, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is XLCNY17-4?
XLCNY17-4 is identified in the supplied datasheet facts as a XINGLIGHT phototransistor optocoupler in the LED category, with DIP6 and SMD6 case options.
What isolation voltage is specified for XLCNY17-4?
The extracted facts specify 5000 Vrms isolation voltage between input and output. The detailed condition lists AC for 1 minute at 40 to 60% RH with input pins and output pins shorted in groups.
What current transfer ratio is listed for XLCNY17-4?
The current transfer ratio is specified as minimum 100% at IF=10 mA, VCE=10 V, and TA=25°C. A feature line also lists CTR as ≥100% at IF=10 mA and VCE=10 V.
Which package options are documented for this part?
The datasheet facts list DIP6 and SMD6 cases. DIP6 packaging is listed as 65 pcs per tube, while the SMD6 variant XLCNY17-4S is listed as 1000 pcs per tape and reel.
What assembly temperatures are specified in the datasheet facts?
The supplied facts list 260 °C reflow peak temperature, 260 °C wave soldering peak temperature, and 360 °C ±5 °C hand soldering iron temperature within 3 seconds for rework or sample testing.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.