Specifications
| Type | Description |
|---|---|
| Part Number | XLH11A1-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package Case | DIP6, SMD6; package outline dimensions referenced in mm but numeric dimensions not provided in extracted text |
| Current Transfer Ratio | >=20 %; IF=10 mA, VCE=10 V |
| Isolation Voltage | 5000 Vrms; input-output isolation |
| Operating Temperature | -55 to +100 °C; operating range |
| Package Options | DIP6, SMD6; case type |
| Molding Compound Flammability Rating | UL 94V-0; mechanical data |
| Forward Current | 60 mA; maximum rating, TA=25°C unless otherwise specified |
| Forward Peak Current | 1 A; pulse width <=1 us, duty ratio 0.001 |
| Reverse Voltage | 6 V; maximum rating, input |
| Input Power Dissipation | 100 mW; maximum rating, input |
| Collector Power Dissipation | 300 mW; maximum rating, output |
| Collector Current | 100 mA; maximum rating, output |
| Collector-Base Voltage | 70 V; maximum rating, output |
| Collector-Emitter Voltage | 30 V; maximum rating, output |
| Emitter-Collector Voltage | 7 V; maximum rating, output |
| Total Power Dissipation | 350 mW; thermal characteristics |
| Isolation Voltage | 5000 Vrms; 40 to 60% RH, AC for 1 minute; pins 1,2,3 shorted and pins 4,5,6 shorted together |
| Operating Temperature | -55 to +100 °C; thermal characteristics |
| Storage Temperature Range | -55 to +125 °C; thermal characteristics |
| Soldering Temperature | 260 °C; for 10 seconds |
| Forward Voltage | typ 1.2 V, max 1.5 V; IF=10 mA, TA=25°C |
| Reverse Current | max 10 uA; VR=3 V, TA=25°C |
| Input Capacitance | typ 50 pF; V=0 V, f=1 kHz, TA=25°C |
| Collector Dark Current | max 50 nA; VCE=10 V, TA=25°C |
| Collector-Base Breakdown Voltage | min 70 V; IB=0.1 mA, IF=0, TA=25°C |
| Collector-Emitter Breakdown Voltage | min 30 V; IC=0.1 mA, IF=0, TA=25°C |
| Emitter-Collector Breakdown Voltage | min 7 V; IE=0.01 mA, IF=0, TA=25°C |
| Current Transfer Ratio | min 20 %; IF=10 mA, VCE=10 V, TA=25°C |
| Collector-Emitter Saturation Voltage | typ 0.5 V; IF=50 mA, IC=2 mA, TA=25°C |
| Isolation Resistance | min 5*10^10 ohm, typ 10^11 ohm; DC 500 V, 40 to 60% RH, TA=25°C |
| Isolation Capacitance | typ 1 pF, max 2.5 pF; V=0 V, f=1 MHz, TA=25°C |
| Response Time Rise | typ 3 us, max 10 us; VCE=10 V, IC=2 mA, RL=100 ohm, TA=25°C |
| Response Time Fall | typ 3 us, max 10 us; VCE=10 V, IC=2 mA, RL=100 ohm, TA=25°C |
| Reflow Preheat Temperature | 150 to 200 °C; reflow soldering profile |
| Reflow Preheat Time | 60 to 120 s; reflow soldering profile |
| Reflow Ramp-Up Rate | max 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; reflow soldering profile |
| Reflow Time Above Liquidus | 60 to 150 s; time above TL |
| Reflow Peak Temperature | 260 °C; reflow soldering profile |
| Reflow Peak Dwell Time | max 30 s; time during which Tc is between TP-5 and TP |
| Reflow Ramp-Down Rate | max 6 °C/s; TP to TL |
| Reflow Cycle Limit | No more than 3 times; recommended reflow soldering |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; wave soldering profile |
| Wave Soldering Heating Rate During Preheat | typ 1 to 2 °C/s, max 4 °C/s; wave soldering profile |
| Wave Soldering Final Preheat Temperature | ~130 °C; wave soldering profile |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; wave soldering profile |
| Wave Soldering Time Within Peak Temperature | 10 s; wave soldering profile |
| Wave Soldering Ramp-Down Rate | max 5 °C/s; wave soldering profile |
| Hand Soldering Iron Temperature | 360 °C +5°C; within 3 s; product rework or sample testing only |
| DIP6 Shipping Quantity | 65 pcs/tube; XLH11A1 DIP6 ordering information |
| SMD6 Shipping Quantity | 1000 pcs/tape and reel; XLH11A1S SMD6 ordering information |
| DIP6 Carton Quantity | 32500 pcs/carton; packing summary |
| SMD6 Carton Quantity | 20000 pcs/carton; packing summary |
| Datasheet Status | request_only |
Product Overview
XLH11A1-G is a XINGLIGHT phototransistor optocoupler in the LED category. The extracted datasheet identifies DIP6 and SMD6 case options, with package outline dimensions referenced in millimeters but without numeric dimensions in the extracted text. The mechanical data lists a UL 94V-0 molding compound flammability rating.
Electrical isolation and transfer parameters are central to this device. The input-output isolation voltage is specified as 5000 Vrms, including a 40 to 60% RH, AC for 1 minute condition with input pins shorted together and output pins shorted together. The current transfer ratio is specified as a minimum of 20% at IF=10 mA and VCE=10 V, with TA=25°C noted in the electrical characteristics.
Input and output limits include 60 mA forward current, 6 V reverse voltage, 100 mW input power dissipation, 100 mA collector current, and 300 mW collector power dissipation. The device operates from -55 to +100°C and stores from -55 to +125°C. Assembly guidance includes 260°C reflow peak temperature, 260°C wave soldering peak temperature, and hand soldering at 360°C +5°C within 3 seconds for rework or sample testing only.
Key Features
- Phototransistor optocoupler with DIP6 and SMD6 package options
- 5000 Vrms input-output isolation voltage rating
- Minimum 20% current transfer ratio at specified test conditions
- -55 to +100 °C operating temperature range
- 60 mA maximum forward current input rating
- 100 mA maximum collector current output rating
- Typical 3 us rise and fall response times
- UL 94V-0 molding compound flammability rating
- 260 °C peak reflow and wave soldering profiles
- SMD6 supplied as 1000 pcs tape and reel
Typical Applications
- Signal isolation interfaces
- Input-output electrical isolation
- Phototransistor switching circuits
- DIP6 through-hole assemblies
- SMD6 surface-mount assemblies
- Temperature-exposed control circuits
- Reflow soldered PCB assemblies
- Wave soldered PCB assemblies
Procurement Notes
When requesting a quote for XLH11A1-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is XLH11A1-G?
XLH11A1-G is identified in the extracted datasheet facts as a XINGLIGHT phototransistor optocoupler in the LED category, with DIP6 and SMD6 package options listed for the XLH11A1 family.
What isolation voltage is specified for XLH11A1-G?
The extracted facts specify 5000 Vrms input-output isolation. A detailed condition also lists AC for 1 minute at 40 to 60% RH, with pins 1,2,3 shorted and pins 4,5,6 shorted together.
What current transfer ratio is listed for XLH11A1-G?
The datasheet facts list a current transfer ratio of at least 20%. The electrical characteristics condition is IF=10 mA, VCE=10 V, and TA=25°C.
What package and packing options are extracted?
The extracted package options are DIP6 and SMD6. The DIP6 ordering information lists 65 pcs per tube, while the SMD6 ordering information lists 1000 pcs per tape and reel.
What soldering limits are provided in the extracted data?
The soldering data includes 260°C for 10 seconds, a 260°C reflow peak temperature, a 260°C wave soldering peak temperature, and hand soldering at 360°C +5°C within 3 seconds for rework or sample testing only.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.