Specifications
| Type | Description |
|---|---|
| Part Number | XLH11A2-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Inferred Category | LED |
| Component Type | Other |
| Package Case | DIP6; SMD6 option; package outline dimensions referenced in mm but numeric dimensions not provided in extracted text |
| Package Options | DIP6, SMD6; mechanical data; source page 1 |
| Molding Compound Flammability | UL 94V-0; mechanical data; source page 1 |
| Terminals | Matte tin-plated leads; solderability per MIL-STD-202, Method 208; source page 1 |
| Current Transfer Ratio Feature | ≥20%; IF=10 mA, VCE=10 V; source page 1 |
| Isolation Voltage Feature | 5000 Vrms; between input and output; source page 1 |
| Operating Temperature Feature | -55 to +100 °C; operating range; source page 1 |
| Part Number Package | DIP6; part number XLH11A2; source page 2 |
| Part Number Shipping Quantity | 65 pcs/tube; part number XLH11A2, DIP6; source page 2 |
| Part Number Marking Code | XLH11A2; part number XLH11A2; source page 2 |
| SMD Part Number Package | SMD6; part number XLH11A2S; source page 2 |
| SMD Part Number Shipping Quantity | 1000 pcs/tape & reel; part number XLH11A2S, SMD6; source page 2 |
| SMD Marking Code | XLH11A2; part number XLH11A2S; source page 2 |
| Year Marking Code | A=2024, B=2025, C=2026; marking information; source page 2 |
| Forward Current | 60 mA max; TA=25°C unless otherwise specified; source page 2 |
| Forward Peak Current | 1 A max; pulse width ≤1 µs, duty ratio 0.001; source page 2 |
| Reverse Voltage | 6 V max; input, TA=25°C unless otherwise specified; source page 2 |
| Input Power Dissipation | 100 mW max; TA=25°C unless otherwise specified; source page 2 |
| Collector Power Dissipation | 300 mW max; output, TA=25°C unless otherwise specified; source page 2 |
| Collector Current | 100 mA max; output, TA=25°C unless otherwise specified; source page 2 |
| Collector-Base Voltage | 70 V max; output, TA=25°C unless otherwise specified; source page 2 |
| Collector-Emitter Voltage | 30 V max; output, TA=25°C unless otherwise specified; source page 2 |
| Emitter-Collector Voltage | 7 V max; output, TA=25°C unless otherwise specified; source page 2 |
| Total Power Dissipation | 350 mW max; TA=25°C unless otherwise specified; source page 3 |
| Isolation Voltage | 5000 Vrms; 40 to 60% RH, AC for 1 minute; pins 1,2,3 shorted and pins 4,5,6 shorted; source page 3 |
| Operating Temperature | -55 to +100 °C; thermal characteristics; source page 3 |
| Storage Temperature Range | -55 to +125 °C; thermal characteristics; source page 3 |
| Soldering Temperature | 260 °C max; for 10 seconds; source page 3 |
| Forward Voltage | 1.2 V typ, 1.5 V max; IF=10 mA, TA=25°C unless otherwise specified; source page 3 |
| Reverse Current | 10 µA max; VR=3 V, TA=25°C unless otherwise specified; source page 3 |
| Input Capacitance | 50 pF typ; V=0 V, f=1 kHz; source page 3 |
| Collector Dark Current | 50 nA max; VCE=10 V; source page 3 |
| Collector-Base Breakdown Voltage | 70 V min; IB=0.1 mA, IF=0; source page 3 |
| Collector-Emitter Breakdown Voltage | 30 V min; IC=0.1 mA, IF=0; source page 3 |
| Emitter-Collector Breakdown Voltage | 7 V min; IE=0.01 mA, IF=0; source page 3 |
| Current Transfer Ratio | 20% min; IF=10 mA, VCE=10 V; source page 3 |
| Collector-Emitter Saturation Voltage | 0.5 V max; IF=50 mA, IC=2 mA; source page 3 |
| Isolation Resistance | 5×10^10 Ω min, 10^11 Ω typ; DC 500 V, 40 to 60% RH; source page 3 |
| Isolation Capacitance | 1 pF typ, 2.5 pF max; V=0 V, f=1 MHz; source page 3 |
| Response Time Rise | 3 µs typ, 10 µs max; VCE=10 V, IC=2 mA, RL=100 Ω; source page 3 |
| Response Time Fall | 3 µs typ, 10 µs max; VCE=10 V, IC=2 mA, RL=100 Ω; source page 3 |
| Reflow Preheat Temperature | 150 to 200 °C; reflow soldering profile; source page 7 |
| Reflow Preheat Time | 60 to 120 s; reflow soldering profile; source page 7 |
| Reflow Ramp-Up Rate | 3 °C/s max; TL to TP; source page 7 |
| Reflow Liquidus Temperature | 217 °C; reflow soldering profile; source page 7 |
| Reflow Time Above Liquidus | 60 to 150 s; above TL; source page 7 |
| Reflow Peak Temperature | 260 °C; reflow soldering profile; source page 7 |
| Reflow Peak Time | 30 s max; time during which Tc is between TP-5 and TP; source page 7 |
| Reflow Ramp-Down Rate | 6 °C/s max; TP to TL; source page 7 |
| Reflow Cycle Limit | No more than 3 times; recommended temperatures and times; source page 7 |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; wave soldering profile feature, as printed; source page 7 |
| Wave Soldering Heating Rate During Preheat | 1 to 2 °C/s typical, 4 °C/s max; wave soldering profile feature; source page 7 |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts; source page 7 |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts; source page 7 |
| Wave Soldering Peak Temperature | 260 °C; Tp; source page 7 |
| Wave Soldering Peak Time | 10 s; time within peak temperature tp; source page 7 |
| Wave Soldering Ramp-Down Rate | 5 °C/s max; wave soldering profile feature; source page 7 |
| Hand Soldering Iron Temperature | 360 °C +5 °C; within 3 s; for rework or sample testing only; source page 7 |
| DIP6 Packing Form | Tube, 500 mm; straight insert type material tube; source page 8 |
| DIP6 Quantity Per Tube | 65 pcs/tube; packing table; source page 8 |
| DIP6 Quantity Per Box | 3250 pcs/box; 50 tubes/box; source page 8 |
| DIP6 Quantity Per Carton | 32500 pcs/carton; 10 boxes/carton; source page 8 |
| DIP6 Antistatic Bag Specification | 190×670 mm; packing table; source page 8 |
| DIP6 Box Specification | 520×105×50 mm; packing table; source page 8 |
| DIP6 Carton Specification | 545×372×235 mm; packing table; source page 8 |
| SMD6 Packing Form | Reel, φ330 mm; packing table; source page 8 |
| SMD6 Quantity Per Reel | 1000 pcs/reel; packing table; source page 8 |
| SMD6 Quantity Per Box | 2000 pcs/box; 2 reels/box; source page 8 |
| SMD6 Quantity Per Carton | 20000 pcs/carton; 10 boxes/carton; source page 8 |
| SMD6 Antistatic Bag Specification | 380×420 mm; packing table; source page 8 |
| SMD6 Box Specification | 350×340×60 mm; packing table; source page 8 |
| SMD6 Carton Specification | 365×330×370 mm; packing table; source page 8 |
| SMD6 Guard Band Speed | 200 mm/min; packing note; source page 8 |
| Document Validity | Valid until Dec 31, 2026; attention section; source page 9 |
| Datasheet Status | request_only |
Product Overview
XLH11A2-G is documented by XINGLIGHT as a phototransistor optocoupler in the LED category. The mechanical data lists DIP6 and SMD6 package options, UL 94V-0 molding compound flammability, and matte tin-plated leads with solderability per MIL-STD-202, Method 208. The extracted package outline text references dimensions in millimeters, but no numeric package dimensions are included in the extracted facts.
Electrical data centers on input-to-output isolation and transistor output behavior. The device has 5000 Vrms isolation voltage under the stated shorted-pin AC test condition, 20% minimum current transfer ratio at IF=10 mA and VCE=10 V, 50 nA maximum collector dark current at VCE=10 V, and 0.5 V maximum collector-emitter saturation voltage at IF=50 mA and IC=2 mA.
Thermal and assembly facts include -55 to +100 °C operating temperature, -55 to +125 °C storage temperature, 260 °C maximum soldering temperature for 10 seconds, and specified reflow, wave soldering, and hand soldering profiles. Packing data covers DIP6 tube shipment and SMD6 reel shipment.
Key Features
- Phototransistor optocoupler with DIP6 and SMD6 options
- 5000 Vrms isolation voltage between input and output
- 20% minimum CTR at IF=10 mA, VCE=10 V
- -55 to +100 °C operating temperature range
- 60 mA maximum input forward current
- 30 V minimum collector-emitter breakdown voltage
- 3 µs typical rise and fall response times
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads per solderability condition
- Reflow peak temperature specified at 260 °C
Typical Applications
- Isolated signal coupling
- Input-to-output electrical isolation
- Phototransistor output interfaces
- DIP6 through-hole assemblies
- SMD6 tape-and-reel assemblies
- Board-level switching signal transfer
- Low-capacitance isolation paths
Procurement Notes
When requesting a quote for XLH11A2-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package options are listed for XLH11A2-G?
The extracted datasheet facts list DIP6 and SMD6 package options. The part number XLH11A2 is tied to DIP6 with 65 pcs per tube, while XLH11A2S is tied to SMD6 with 1000 pcs per tape and reel.
What isolation rating is specified for this optocoupler?
The datasheet facts specify 5000 Vrms isolation voltage. The detailed test condition is AC for 1 minute at 40 to 60% RH, with pins 1,2,3 shorted and pins 4,5,6 shorted.
What current transfer ratio does the datasheet provide?
The current transfer ratio is specified as 20% minimum at IF=10 mA and VCE=10 V. This same condition is also listed as a feature with a value of at least 20%.
What soldering profiles are included in the extracted facts?
The facts include reflow, wave soldering, and hand soldering information. Reflow includes 150 to 200 °C preheat, 217 °C liquidus, 260 °C peak, and no more than three cycles.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.