Specifications
| Type | Description |
|---|---|
| Part Number | XLH11A3-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Inferred Category | LED |
| Component Type | Other |
| Package Case | DIP6; SMD6; package outline dimensions referenced in mm but numeric dimensions not provided in extracted text |
| Current Transfer Ratio | min 20 % |
| Isolation Voltage | 5000 Vrms |
| Operating Temperature | -55 to +100 °C |
| Package Type | DIP6, SMD6 |
| Molding Compound Flammability Rating | UL 94V-0 |
| Terminals | Matte tin-plated leads |
| DIP6 Shipping Quantity | 65 pcs/tube |
| SMD6 Shipping Quantity | 1000 pcs/tape and reel |
| Forward Current | max 60 mA |
| Forward Peak Current | max 1 A |
| Reverse Voltage | max 6 V |
| Input Power Dissipation | max 100 mW |
| Collector Power Dissipation | max 300 mW |
| Collector Current | max 100 mA |
| Collector-Base Voltage | max 70 V |
| Collector-Emitter Voltage | max 30 V |
| Emitter-Collector Voltage | max 7 V |
| Total Power Dissipation | max 350 mW |
| Storage Temperature Range | -55 to +125 °C |
| Soldering Temperature | 260 °C |
| Forward Voltage | typ 1.2 V, max 1.5 V |
| Reverse Current | max 10 uA |
| Input Capacitance | typ 50 pF |
| Collector Dark Current | max 50 nA |
| Collector-Base Breakdown Voltage | min 70 V |
| Collector-Emitter Breakdown Voltage | min 30 V |
| Emitter-Collector Breakdown Voltage | min 7 V |
| Collector-Emitter Saturation Voltage | max 0.5 V |
| Isolation Resistance | min 5*10^10 ohm, typ 10^11 ohm |
| Isolation Capacitance | typ 1 pF, max 2.5 pF |
| Response Time Rise | typ 3 us, max 10 us |
| Response Time Fall | typ 3 us, max 10 us |
| Reflow Preheat Temperature | 150 to 200 °C |
| Reflow Preheat Time | 60 to 120 s |
| Reflow Ramp-Up Rate | max 3 °C/s |
| Reflow Liquidus Temperature | 217 °C |
| Reflow Time Above Liquidus | 60 to 150 s |
| Reflow Peak Temperature | 260 °C |
| Reflow Peak Time | max 30 s |
| Reflow Ramp-Down Rate | max 6 °C/s |
| Maximum Reflow Cycles | max 3 times |
| Wave Soldering Peak Temperature | 260 °C |
| Wave Soldering Peak Time | 10 s |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s |
| DIP6 Packing Quantity | 65 pcs/tube, 3250 pcs/box, 32500 pcs/carton |
| SMD6 Packing Quantity | 1000 pcs/reel, 2000 pcs/box, 20000 pcs/carton |
| Datasheet Status | request_only |
Product Overview
XLH11A3-G is a XINGLIGHT phototransistor optocoupler listed under the LED category. The extracted package information identifies DIP6 and SMD6 case options, with package outline dimensions referenced in millimeters but without numeric dimensions in the extracted text. The molding compound is rated UL 94V-0, and the terminals use matte tin-plated leads with solderability referenced to MIL-STD-202, Method 208.
The device is specified with a minimum 20% current transfer ratio at IF=10 mA and VCE=10 V. Input ratings include 60 mA maximum forward current, 1 A maximum forward peak current under the stated pulse condition, 6 V maximum reverse voltage, and 100 mW maximum input power dissipation. Output ratings include 300 mW collector power dissipation, 100 mA collector current, and breakdown-related collector, base, and emitter voltage limits.
Isolation performance is defined at 5000 Vrms for one minute under the stated humidity and pin-short conditions. Additional isolation data includes minimum 5*10^10 ohm and typical 10^11 ohm resistance at DC 500 V, plus 1 pF typical and 2.5 pF maximum isolation capacitance. Assembly facts include 260 °C soldering for 10 seconds, reflow peak temperature of 260 °C, wave soldering at 260 °C for 10 seconds, and package-specific packing quantities.
Key Features
- Phototransistor optocoupler in DIP6 and SMD6 packages
- Minimum 20% CTR at IF=10 mA, VCE=10 V
- 5000 Vrms input-output isolation for one minute
- -55 to +100 °C operating temperature range
- Forward current rated up to 60 mA maximum
- Collector current rated up to 100 mA maximum
- Typical 3 us rise and fall response times
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads per MIL-STD-202 Method 208
- SMD6 supplied as 1000 pcs tape and reel
Typical Applications
- Input-output signal isolation
- Phototransistor output interfaces
- DIP6 tube-packed assemblies
- SMD6 tape-and-reel assemblies
- Reflow-soldered optocoupler boards
- Wave-soldered DIP assemblies
- Isolated low-current switching circuits
Procurement Notes
When requesting a quote for XLH11A3-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is XLH11A3-G?
XLH11A3-G is a XINGLIGHT phototransistor optocoupler in the LED category. The extracted datasheet facts list DIP6 and SMD6 package options and specify a minimum 20% current transfer ratio at IF=10 mA and VCE=10 V.
What isolation rating is specified for XLH11A3-G?
The input-output isolation voltage is specified as 5000 Vrms. The condition is AC for 1 minute at 40 to 60% relative humidity, with pins 1,2,3 shorted and pins 4,5,6 shorted.
Which package and packing options are available?
The extracted facts list DIP6 and SMD6 case options. DIP6 packing is 65 pcs per tube, 3250 pcs per box, and 32500 pcs per carton. SMD6 packing is 1000 pcs per reel, 2000 pcs per box, and 20000 pcs per carton.
What soldering limits are included in the extracted data?
The facts include 260 °C soldering for 10 seconds, a recommended reflow peak temperature of 260 °C with a maximum of three reflow cycles, wave soldering at 260 °C for 10 seconds, and hand soldering at 360 °C +5 °C within 3 seconds for rework or sample testing.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.