Specifications
| Type | Description |
|---|---|
| Part Number | XLH11A3 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | DIP6 or SMD6; package outline dimensions referenced in mm but numeric dimensions not provided in extracted text |
| Current Transfer Ratio | >=20% at IF=10mA, VCE=10V |
| Isolation Voltage | 5000 Vrms between input and output |
| Operating Temperature | -55 to +100 °C |
| Case | DIP6, SMD6 |
| Molding Compound Flammability Rating | UL 94V-0 |
| DIP6 Shipping Quantity | 65 pcs/Tube for part number XLH11A3 |
| SMD6 Shipping Quantity | 1000 pcs/Tape & Reel for part number XLH11A3S |
| Forward Current | 60 mA maximum rating, TA=25°C unless otherwise specified |
| Forward Peak Current | 1 A, pulse width <=1 us, duty ratio 0.001 |
| Reverse Voltage | 6 V maximum rating, input |
| Input Power Dissipation | 100 mW maximum rating |
| Collector Power Dissipation | 300 mW maximum rating |
| Collector Current | 100 mA maximum rating |
| Collector-Base Voltage | 70 V maximum rating |
| Collector-Emitter Voltage | 30 V maximum rating |
| Emitter-Collector Voltage | 7 V maximum rating |
| Total Power Dissipation | 350 mW thermal characteristic |
| Isolation Voltage Test Condition | 5000 Vrms, 40 to 60% RH, AC for 1 minute; pins 1,2,3 shorted and pins 4,5,6 shorted together |
| Storage Temperature Range | -55 to +125 °C |
| Soldering Temperature | 260 °C for 10 seconds |
| Forward Voltage | Typ 1.2 V, Max 1.5 V at IF=10mA, TA=25°C |
| Reverse Current | Max 10 uA at VR=3V, TA=25°C |
| Input Capacitance | Typ 50 pF at V=0V, f=1kHz, TA=25°C |
| Collector Dark Current | Max 50 nA at VCE=10V, TA=25°C |
| Collector-Base Breakdown Voltage | Min 70 V at IB=0.1mA, IF=0, TA=25°C |
| Collector-Emitter Breakdown Voltage | Min 30 V at IC=0.1mA, IF=0, TA=25°C |
| Emitter-Collector Breakdown Voltage | Min 7 V at IE=0.01mA, IF=0, TA=25°C |
| Current Transfer Ratio Electrical | Min 20% at IF=10mA, VCE=10V, TA=25°C |
| Collector-Emitter Saturation Voltage | Typ 0.5 V at IF=50mA, IC=2mA, TA=25°C |
| Isolation Resistance | Min 5*10^10 ohm, Typ 10^11 ohm at DC500V, 40 to 60% RH, TA=25°C |
| Isolation Capacitance | Typ 1 pF, Max 2.5 pF at V=0, f=1MHz, TA=25°C |
| Response Time Rise | Typ 3 us, Max 10 us at VCE=10V, IC=2mA, RL=100 ohm, TA=25°C |
| Response Time Fall | Typ 3 us, Max 10 us at VCE=10V, IC=2mA, RL=100 ohm, TA=25°C |
| Reflow Preheat Temperature | 150 to 200 °C, reflow soldering profile |
| Reflow Preheat Time | 60 to 120 s, reflow soldering profile |
| Reflow Ramp-Up Rate | Max 3 °C/s, TL to TP |
| Reflow Liquidus Temperature | 217 °C, reflow soldering profile |
| Reflow Time Above Liquidus | 60 to 150 s above TL |
| Reflow Peak Temperature | 260 °C, reflow soldering profile |
| Reflow Peak Time | Max 30 s, time during which Tc is between TP-5 and TP |
| Reflow Ramp-Down Rate | Max 6 °C/s, TP to TL |
| Recommended Maximum Reflow Count | No more than 3 times at recommended reflow temperatures and times |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s, wave soldering profile |
| Wave Soldering Heating Rate During Preheat | Typical 1 to 2 °C/s, Max 4 °C/s, wave soldering profile |
| Wave Soldering Final Preheat Temperature | ~130 °C, Ts |
| Wave Soldering Preheat Time | >60 s, 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C, Tp |
| Wave Soldering Peak Time | 10 s, time within peak temperature |
| Wave Soldering Ramp-Down Rate | Max 5 °C/s, wave soldering profile |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s; for product rework or sample testing |
| Datasheet Status | request_only |
Product Overview
XLH11A3 is a XINGLIGHT phototransistor optocoupler in the LED category. The extracted datasheet facts identify DIP6 and SMD6 case options, with package outline dimensions referenced in millimeters but no numeric outline dimensions included in the extracted text. The molding compound flammability rating is UL 94V-0.
Electrical isolation is specified at 5000 Vrms between input and output, including a one-minute AC isolation condition at 40 to 60% RH with input pins 1, 2, and 3 shorted and output pins 4, 5, and 6 shorted. Isolation resistance is specified at a minimum of 5*10^10 ohm and typical 10^11 ohm at DC500V, while isolation capacitance is typical 1 pF and maximum 2.5 pF.
Input-side ratings include 60 mA forward current, 1 A forward peak current for pulse width <=1 us at duty ratio 0.001, 6 V reverse voltage, and 100 mW input power dissipation. Output-side facts include 300 mW collector power dissipation, 100 mA collector current, 70 V collector-base voltage, 30 V collector-emitter voltage, and 7 V emitter-collector voltage.
Assembly data includes 260 °C soldering for 10 seconds, reflow peak temperature of 260 °C, and no more than three recommended reflow cycles. DIP6 shipping quantity is 65 pcs per tube for XLH11A3, while SMD6 shipping quantity is 1000 pcs per tape and reel for XLH11A3S.
Key Features
- Phototransistor optocoupler structure in DIP6 or SMD6 cases
- 5000 Vrms input-to-output isolation rating
- Minimum 20% current transfer ratio at IF=10mA
- -55 to +100 °C operating temperature range
- UL 94V-0 molding compound flammability rating
- 60 mA maximum forward current rating
- 1 A forward peak current under pulse condition
- 30 V collector-emitter maximum voltage rating
- Typical 3 us rise and fall response times
- 260 °C peak reflow soldering profile
- No more than three recommended reflow cycles
- DIP6 tube and SMD6 tape-and-reel shipping formats
Typical Applications
- Isolated signal coupling
- Input-to-output circuit isolation
- Phototransistor output interfaces
- Low-capacitance isolation paths
- DIP6 through-hole assemblies
- SMD6 reflow assemblies
Procurement Notes
When requesting a quote for XLH11A3, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What product type is the XLH11A3?
XLH11A3 is identified in the extracted datasheet facts as a XINGLIGHT phototransistor optocoupler in the LED category. The case options listed are DIP6 and SMD6.
What isolation rating is specified for XLH11A3?
The datasheet facts specify 5000 Vrms isolation voltage between input and output. A detailed condition states AC for 1 minute at 40 to 60% RH with input pins shorted together and output pins shorted together.
What current transfer ratio does XLH11A3 provide?
The current transfer ratio is specified as at least 20%. The electrical condition is IF=10mA and VCE=10V, with the page 3 specification adding TA=25°C.
What soldering limits are listed for XLH11A3?
The soldering temperature is specified as 260 °C for 10 seconds. The reflow profile also lists a 260 °C peak temperature, maximum 30 seconds near peak, and no more than three recommended reflow cycles.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.