XLH11A4-G Phototransistor Optocoupler LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XLH11A4-G Phototransistor Optocoupler LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XLH11A4-G
Manufacturer
XINGLIGHT
Package
DIP6; SMD6 also available; package outline dimensions referenced in mm but numeric dimensions not provided in extracted text
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XLH11A4-G from XINGLIGHT is an LED-category phototransistor optocoupler supplied as the XLH11A4 DIP6 package, with SMD6 also available for related marking use. The device is specified with 5000 Vrms input-output isolation, a minimum 20% current transfer ratio at IF=10 mA and VCE=10 V, and an operating temperature range of -55 to +100 °C. Key electrical limits include 60 mA forward current, 100 mA collector current, 30 V collector-emitter voltage, and 350 mW total power dissipation. It fits isolated signal-transfer applications requiring DIP6 assembly, defined soldering profiles, and phototransistor output behavior.

Specifications

TypeDescription
Part NumberXLH11A4-G
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
PackageDIP6; condition: Part number XLH11A4
Shipping Quantity65 pcs/tube; condition: XLH11A4 DIP6
Marking CodeXLH11A4; condition: XLH11A4 DIP6 and XLH11A4S SMD6
Current Transfer Ratiomin 20 %; condition: IF=10 mA, VCE=10 V
Isolation Voltage5000 Vrms; condition: input-output isolation
Operating Temperature-55 to +100 °C; condition: general operating range
Molding Compound FlammabilityUL 94V-0; condition: mechanical data
Forward Current60 mA; condition: maximum rating, TA=25°C
Forward Peak Current1 A; condition: pulse width <=1 us, duty ratio 0.001, TA=25°C
Reverse Voltage6 V; condition: maximum rating, TA=25°C
Input Power Dissipation100 mW; condition: maximum rating, TA=25°C
Collector Power Dissipation300 mW; condition: maximum rating, TA=25°C
Collector Current100 mA; condition: maximum rating, TA=25°C
Collector-Base Voltage70 V; condition: maximum rating, TA=25°C
Collector-Emitter Voltage30 V; condition: maximum rating, TA=25°C
Emitter-Collector Voltage7 V; condition: maximum rating, TA=25°C
Total Power Dissipation350 mW; condition: thermal characteristic
Isolation Voltage Test5000 Vrms; condition: 40 to 60% RH, AC for 1 minute; pins 1,2,3 shorted and pins 4,5,6 shorted
Storage Temperature Range-55 to +125 °C; condition: thermal characteristic
Soldering Temperature260 °C; condition: for 10 seconds
Forward Voltagetyp 1.2 V, max 1.5 V; condition: IF=10 mA, TA=25°C
Reverse Currentmax 10 uA; condition: VR=3 V, TA=25°C
Input Capacitancetyp 50 pF; condition: V=0 V, f=1 kHz, TA=25°C
Collector Dark Currentmax 50 nA; condition: VCE=10 V, TA=25°C
Collector-Base Breakdown Voltagemin 70 V; condition: IB=0.1 mA, IF=0, TA=25°C
Collector-Emitter Breakdown Voltagemin 30 V; condition: IC=0.1 mA, IF=0, TA=25°C
Emitter-Collector Breakdown Voltagemin 7 V; condition: IE=0.01 mA, IF=0, TA=25°C
Collector-Emitter Saturation Voltagetyp 0.5 V; condition: IF=50 mA, IC=2 mA, TA=25°C
Isolation Resistancemin 5*10^10 ohm, typ 10^11 ohm; condition: DC 500 V, 40 to 60% RH, TA=25°C
Isolation Capacitancetyp 1 pF, max 2.5 pF; condition: V=0 V, f=1 MHz, TA=25°C
Response Time Risetyp 3 us, max 10 us; condition: VCE=10 V, IC=2 mA, RL=100 ohm, TA=25°C
Response Time Falltyp 3 us, max 10 us; condition: VCE=10 V, IC=2 mA, RL=100 ohm, TA=25°C
Reflow Preheat Temperature150 to 200 °C; condition: reflow soldering profile
Reflow Preheat Time60 to 120 s; condition: reflow soldering profile
Reflow Ramp-Up Ratemax 3 °C/s; condition: TL to TP
Reflow Liquidus Temperature217 °C; condition: reflow soldering profile
Reflow Time Above Liquidus60 to 150 s; condition: above TL
Reflow Peak Temperature260 °C; condition: reflow soldering profile
Reflow Peak Timemax 30 s; condition: TC between TP-5 and TP
Reflow Ramp-Down Ratemax 6 °C/s; condition: TP to TL
Wave Soldering Peak Temperature260 °C; condition: wave soldering profile
Hand Soldering Temperature360 °C +5 °C; condition: within 3 s; for rework or sample testing
Datasheet Statusrequest_only

Product Overview

The XLH11A4-G is documented as a XINGLIGHT LED-category phototransistor optocoupler. The extracted ordering data identifies XLH11A4 as the DIP6 package option, with SMD6 also available under XLH11A4S marking. The DIP6 shipping quantity is 65 pcs per tube, and the marking code is XLH11A4 for both DIP6 and SMD6 variants.

Electrical parameters center on isolated optocoupler signal transfer. The device has 5000 Vrms input-output isolation, a minimum current transfer ratio of 20% at IF=10 mA and VCE=10 V, and typical 3 us rise and fall response times under the specified VCE=10 V, IC=2 mA, RL=100 ohm condition. Input-side limits include 60 mA forward current, 6 V reverse voltage, and 100 mW input power dissipation.

Assembly guidance includes a 260 °C soldering temperature for 10 seconds, a 260 °C reflow peak, and a 260 °C wave soldering peak. The stated operating range is -55 to +100 °C, with storage from -55 to +125 °C.

Key Features

  • Phototransistor optocoupler product type for isolated signal transfer
  • DIP6 package specified for XLH11A4 ordering condition
  • SMD6 package also available under XLH11A4S marking condition
  • Minimum 20% CTR at IF=10 mA and VCE=10 V
  • 5000 Vrms input-output isolation voltage rating
  • Operating temperature range from -55 to +100 °C
  • UL 94V-0 molding compound flammability rating
  • Typical 3 us rise and fall response times
  • 260 °C reflow and wave soldering peak temperature
  • 65 pieces per tube for XLH11A4 DIP6 packaging

Typical Applications

  • Isolated signal transfer circuits
  • DIP6 optocoupler PCB assemblies
  • Phototransistor output interface circuits
  • Input-output isolation barriers
  • Rework or sample testing assemblies
  • Wave-soldered board production
  • Reflow-soldered SMD6 related assemblies

Procurement Notes

When requesting a quote for XLH11A4-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package is specified for XLH11A4-G?

The extracted ordering data lists XLH11A4 in a DIP6 package. It also notes that SMD6 is available for the related XLH11A4S condition, with package outline dimensions referenced in millimeters but no extracted numeric dimensions.

What isolation voltage does this optocoupler provide?

The datasheet facts specify 5000 Vrms input-output isolation. A detailed test condition also lists 5000 Vrms AC for 1 minute at 40 to 60% RH, with input-side pins shorted together and output-side pins shorted together.

What current transfer ratio is listed for XLH11A4-G?

The current transfer ratio is specified as a minimum of 20%. The associated test condition is IF=10 mA and VCE=10 V, as extracted from the manufacturer technical datasheet.

What soldering temperatures are documented for this part?

The facts list 260 °C for 10 seconds as the soldering temperature, 260 °C as the reflow peak temperature, and 260 °C as the wave soldering peak temperature. Hand soldering is listed as 360 °C +5 °C within 3 seconds for rework or sample testing.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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