Specifications
| Type | Description |
|---|---|
| Part Number | XLH11A5-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Inferred Category | LED |
| Component Type | Other |
| Package Case | DIP6; SMD6 option; package outline dimensions shown in mm but numeric dimensions not provided in extracted text |
| Current Transfer Ratio | min 20 % |
| Isolation Voltage | 5000 Vrms |
| Operating Temperature | -55 to +100 °C |
| Package Type | DIP6, SMD6 |
| Molding Compound Flammability | UL 94V-0 |
| Terminal Finish | matte tin-plated leads |
| Part Number Package | XLH11A5: DIP6 |
| Part Number Shipping Quantity | 65 pcs/tube |
| Part Number Marking Code | XLH11A5 |
| Alternate Package Part Number | XLH11A5S: SMD6 |
| SMD Shipping Quantity | 1000 pcs/tape and reel |
| Input Forward Current | 60 mA |
| Input Forward Peak Current | 1 A |
| Input Reverse Voltage | 6 V |
| Input Power Dissipation | 100 mW |
| Collector Power Dissipation | 300 mW |
| Collector Current | 100 mA |
| Collector-Base Voltage | 70 V |
| Collector-Emitter Voltage | 30 V |
| Emitter-Collector Voltage | 7 V |
| Total Power Dissipation | 350 mW |
| Isolation Voltage | 5000 Vrms |
| Storage Temperature Range | -55 to +125 °C |
| Soldering Temperature | 260 °C |
| Forward Voltage | typ 1.2 V, max 1.5 V |
| Reverse Current | max 10 uA |
| Input Capacitance | typ 50 pF |
| Collector Dark Current | max 50 nA |
| Collector-Base Breakdown Voltage | min 70 V |
| Collector-Emitter Breakdown Voltage | min 30 V |
| Emitter-Collector Breakdown Voltage | min 7 V |
| Collector-Emitter Saturation Voltage | typ 0.5 V |
| Isolation Resistance | min 5*10^10 ohm, typ 10^11 ohm |
| Isolation Capacitance | typ 1 pF, max 2.5 pF |
| Response Time Rise | typ 3 us, max 10 us |
| Response Time Fall | typ 3 us, max 10 us |
| Reflow Preheat Temperature | min 150 °C, max 200 °C |
| Reflow Preheat Time | min 60 s, max 120 s |
| Reflow Ramp-Up Rate | max 3 °C/s |
| Reflow Liquidus Temperature | 217 °C |
| Reflow Time Above Liquidus | min 60 s, max 150 s |
| Reflow Peak Temperature | 260 °C |
| Reflow Peak Time | max 30 s |
| Reflow Ramp-Down Rate | max 6 °C/s |
| Reflow Cycle Limit | no more than 3 times |
| Wave Soldering Average Ramp-Up Rate | about 200 °C/s |
| Wave Soldering Heating Rate During Preheat | typ 1 to 2 °C/s, max 4 °C/s |
| Wave Soldering Final Preheat Temperature | about 130 °C |
| Wave Soldering Preheat Time | >60 s |
| Wave Soldering Peak Temperature | 260 °C |
| Wave Soldering Peak Time | 10 s |
| Wave Soldering Ramp-Down Rate | max 5 °C/s |
| Hand Soldering Iron Temperature | 360 °C +5 °C |
| DIP6 Tube Quantity | 65 pcs/tube |
| DIP6 Box Quantity | 3250 pcs/box |
| DIP6 Carton Quantity | 32500 pcs/carton |
| SMD6 Reel Quantity | 1000 pcs/reel |
| SMD6 Box Quantity | 2000 pcs/box |
| SMD6 Carton Quantity | 20000 pcs/carton |
| Datasheet Status | request_only |
Product Overview
XLH11A5-G is a XINGLIGHT phototransistor optocoupler in the LED category. The ordering data identifies XLH11A5 as the DIP6 version with XLH11A5 marking, while XLH11A5S is the SMD6 alternate package. The package information also notes DIP6 and SMD6 case options, with outline dimensions shown in millimeters but no numeric dimensions in the extracted text.
Core optocoupler parameters include 5000 Vrms isolation voltage, minimum 20% current transfer ratio at IF=10 mA and VCE=10 V, and typical 3 us rise and fall response times under the stated VCE, IC, and load conditions. Input-side values include 60 mA maximum forward current, 6 V reverse voltage, and 100 mW input power dissipation.
Assembly data covers matte tin-plated leads, UL 94V-0 molding compound flammability, 260 °C soldering for 10 seconds, defined reflow and wave soldering profiles, and hand soldering at 360 °C +5 °C within 3 seconds for rework or sample testing only.
Key Features
- Phototransistor optocoupler output structure
- 5000 Vrms input-to-output isolation rating
- Minimum 20% CTR at IF=10 mA
- DIP6 package with SMD6 alternate option
- -55 to +100 °C operating temperature range
- Typical 3 us rise and fall response
- Matte tin-plated leads per MIL-STD-202 Method 208
- UL 94V-0 molding compound flammability
- 260 °C soldering temperature for 10 seconds
- Reflow profile permits peak temperature of 260 °C
Typical Applications
- Isolated signal transfer
- Input-to-output circuit separation
- Control interface isolation
- Phototransistor output sensing
- DIP6 optocoupler assemblies
- SMD6 tape-and-reel assemblies
- Temperature-rated isolation circuits
Procurement Notes
When requesting a quote for XLH11A5-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package is specified for XLH11A5-G?
The extracted ordering information lists XLH11A5 as the DIP6 version with 65 pcs per tube and XLH11A5 marking. The same datasheet facts also identify XLH11A5S as the SMD6 alternate package.
What isolation voltage does this optocoupler provide?
The datasheet facts specify 5000 Vrms isolation voltage. One condition states input to output, and another gives 40 to 60% RH, AC for 1 minute, with pins 1,2,3 shorted and pins 4,5,6 shorted.
What are the response time values?
Rise time and fall time are both specified as typical 3 us and maximum 10 us. The stated test condition is VCE=10 V, IC=2 mA, RL=100 ohm, and TA=25°C.
What soldering profiles are included?
The facts include reflow, wave, and hand soldering information. Reflow peak temperature is 260 °C, wave soldering peak temperature is 260 °C for 10 seconds, and hand soldering is 360 °C +5 °C within 3 seconds for rework or sample testing only.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.