Specifications
| Type | Description |
|---|---|
| Part Number | XLH11L1-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package Case | DIP6 or SMD6; package outline dimensions referenced in mm but numeric dimensions not provided in extracted text |
| Data Rate | 2 MBit/s; Feature specification; source page 1 |
| Isolation Voltage | 5000 Vrms; Feature specification; between input and output; source page 1 |
| Operating Temperature | -55 to +100 °C; Feature specification; source page 1 |
| Package Options | DIP6, SMD6; Mechanical data; source page 1 |
| Molding Compound Flammability Rating | UL 94V-0; Mechanical data; source page 1 |
| Terminals | Matte tin-plated leads; Solderability per MIL-STD-202, Method 208; source page 1 |
| DIP6 Shipping Quantity | 65 pcs/tube; Ordering information for XLH11LX*1 DIP6; source page 2 |
| SMD6 Shipping Quantity | 1000 pcs/tape and reel; Ordering information for XLH11LX*1S SMD6; source page 2 |
| Input Forward Current, Maximum Rating | 60 mA; TA=25°C unless otherwise specified; source page 2 |
| Input Reverse Voltage, Maximum Rating | 6 V; TA=25°C unless otherwise specified; source page 2 |
| Input Power Dissipation, Maximum Rating | 75 mW; TA=25°C unless otherwise specified; source page 2 |
| Output Voltage Allowed Range | 0 to 16 V; VO; TA=25°C unless otherwise specified; source page 2 |
| Supply Voltage Allowed Range | 3 to 16 V; VCC; TA=25°C unless otherwise specified; source page 2 |
| Output Current, Maximum Rating | 50 mA; TA=25°C unless otherwise specified; source page 2 |
| Output Power Dissipation, Maximum Rating | 150 mW; TA=25°C unless otherwise specified; source page 2 |
| Total Power Dissipation | 225 mW; Thermal characteristics; source page 3 |
| Isolation Voltage | 5000 Vrms; 40 to 60% RH, AC for 1 minute; pins 1,2,3 shorted and pins 4,5,6 shorted together; source page 3 |
| Operating Temperature Range | -55 to +100 °C; Thermal characteristics; source page 3 |
| Storage Temperature Range | -55 to +125 °C; Thermal characteristics; source page 3 |
| Soldering Temperature | 260 °C; For 10 seconds; source page 3 |
| Forward Voltage | Typ 1.24 V, Max 1.5 V; IF=10 mA, TA=25°C; source page 3 |
| Input Reverse Current | Max 10 µA; VR=5 V, TA=25°C; source page 3 |
| Input Capacitance | Max 100 pF; VR=0 V, f=1 kHz, TA=25°C; source page 3 |
| Operating Voltage Range | 3 to 15 V; VCC, TA=25°C; source page 3 |
| Supply Current, Off | Min 0.62 mA, Max 1.5 mA; IF=0 mA, VCC=5 V, TA=25°C; source page 3 |
| Output Current, High | Max 100 µA; IF=0 mA, VCC=VO=15 V, TA=25°C; source page 3 |
| Isolation Resistance | Min 10^11 Ω; VI-O=500 VDC, TA=25°C; source page 3 |
| Supply Current, On | Typ 0.67 mA, Max 1.5 mA; IF=10 mA, VCC=5 V, TA=25°C; source page 3 |
| Output Low Voltage | Max 0.4 V; VCC=5 V, IF=IFon(max), RL=270 Ω, TA=25°C; source page 3 |
| Turn-On Threshold Current, XLH11L1 | Max 1.6 mA; VCC=5 V, RL=270 Ω, TA=25°C; source page 3 |
| Turn-On Threshold Current, XLH11L2 | Max 10 mA; VCC=5 V, RL=270 Ω, TA=25°C; source page 3 |
| Turn-On Threshold Current, XLH11L3 | Max 5 mA; VCC=5 V, RL=270 Ω, TA=25°C; source page 3 |
| Turn-Off Threshold Current | Typ 1 mA; VCC=5 V, RL=270 Ω, TA=25°C; source page 3 |
| Hysteresis Ratio | Min 0.5, Max 0.9; IFoff/IFon, VCC=5 V, RL=270 Ω, TA=25°C; source page 3 |
| Turn-On Time | Typ 500 ns; VCC=5 V, IF=IFon, RL=270 Ω, TA=25°C; source page 3 |
| Fall Time | Typ 100 ns; VCC=5 V, IF=IFon, RL=270 Ω, TA=25°C; source page 3 |
| Turn-Off Time | Typ 500 ns; VCC=5 V, IF=IFon, RL=270 Ω, TA=25°C; source page 3 |
| Rise Time | Typ 100 ns; VCC=5 V, IF=IFon, RL=270 Ω, TA=25°C; source page 3 |
| Propagation Delay to Output High Level | Typ 41 ns; TA=-40 to +85°C, VCC=5 V, IF=7.5 mA, CL=15 pF, RL=350 Ω; source page 4 |
| Propagation Delay to Output Low Level | Typ 50 ns; TA=-40 to +85°C, VCC=5 V, IF=7.5 mA, CL=15 pF, RL=350 Ω; source page 4 |
| Pulse Width Distortion | Typ 5 ns, Max 35 ns; |TPHL-TPLH|, TA=25°C, VCC=5 V, IF=7.5 mA, CL=15 pF, RL=350 Ω; source page 4 |
| Output Rise Time | Typ 30 ns; 10% to 90%, TA=-40 to +85°C, VCC=5 V, IF=7.5 mA, CL=15 pF, RL=350 Ω; source page 4 |
| Output Fall Time | Typ 10 ns; 90% to 10%, TA=-40 to +85°C, VCC=5 V, IF=7.5 mA, CL=15 pF, RL=350 Ω; source page 4 |
| Enable Propagation Delay to Output High Level | Typ 15 ns; IF=7.5 mA, VEH=3.5 V, RL=350 Ω, CL=15 pF; source page 4 |
| Enable Propagation Delay to Output Low Level | Typ 40 ns; IF=7.5 mA, VEH=3.5 V, RL=350 Ω, CL=15 pF; source page 4 |
| Common Mode Transient Immunity, Output High | Min 5000 V/µs, Typ 10000 V/µs; TA=25°C, IF=0 mA, |VCM|=50 V peak, VOH=2.0 V, RL=350 Ω; source page 4 |
| Common Mode Transient Immunity, Output Low | Min 5000 V/µs, Typ 10000 V/µs; TA=25°C, IF=7.5 mA, VOL=0.8 V, RL=350 Ω; source page 4 |
| Reflow Preheat Temperature | Min 150 °C, Max 200 °C; Reflow soldering profile; source page 8 |
| Reflow Preheat Time | Min 60 s, Max 120 s; Reflow soldering profile; source page 8 |
| Reflow Ramp-Up Rate | Max 3 °C/s; TL to TP; source page 8 |
| Reflow Liquidus Temperature | 217 °C; TL; source page 8 |
| Reflow Time Above Liquidus | Min 60 s, Max 150 s; tL above TL; source page 8 |
| Reflow Peak Temperature | Max 260 °C; TP; source page 8 |
| Reflow Peak Dwell Time | Max 30 s; Time during which TC is between TP-5 and TP; source page 8 |
| Reflow Ramp-Down Rate | Max 6 °C/s; TP to TL; source page 8 |
| Reflow Cycle Limit | No more than 3 times; Recommended reflow soldering; source page 8 |
| Wave Soldering Average Ramp-Up Rate | Approximately 200 °C/s; Wave soldering profile; source page 8 |
| Wave Soldering Heating Rate During Preheat | Typical 1 to 2 °C/s, Max 4 °C/s; Wave soldering profile; source page 8 |
| Wave Soldering Final Preheat Temperature | Approximately 130 °C; TS; source page 8 |
| Wave Soldering Preheat Time | >60 s; 25°C to TS; source page 8 |
| Wave Soldering Peak Temperature | 260 °C; TP; source page 8 |
| Wave Soldering Peak Time | 10 s; tp within peak temperature; source page 8 |
| Wave Soldering Ramp-Down Rate | Max 5 °C/s; Wave soldering profile; source page 8 |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s; For product rework or sample testing; source page 8 |
| DIP6 Packing Quantity Per Tube | 65 pcs/tube; Tube, 500 mm; source page 9 |
| DIP6 Packing Quantity Per Box | 3250 pcs/box; 50 tubes/box; source page 9 |
| DIP6 Packing Quantity Per Carton | 32500 pcs/carton; 10 boxes/carton; source page 9 |
| DIP6 Antistatic Bag Specification | 190 x 670 mm; Packing table; source page 9 |
| DIP6 Box Specification | 520 x 105 x 50 mm; Packing table; source page 9 |
| DIP6 Carton Specification | 545 x 372 x 235 mm; Packing table; source page 9 |
| SMD6 Packing Quantity Per Reel | 1000 pcs/reel; Reel diameter 330 mm; source page 9 |
| SMD6 Packing Quantity Per Box | 2000 pcs/box; 2 reels/box; source page 9 |
| SMD6 Packing Quantity Per Carton | 20000 pcs/carton; 10 boxes/carton; source page 9 |
| SMD6 Guard Band | 200 mm minimum; Tape and reel packing; source page 9 |
| SMD6 Antistatic Bag Specification | 380 x 420 mm; Packing table; source page 9 |
| SMD6 Box Specification | 350 x 340 x 60 mm; Packing table; source page 9 |
| SMD6 Carton Specification | 365 x 330 x 370 mm; Packing table; source page 9 |
| Datasheet Status | request_only |
Product Overview
XLH11L1-G is a XINGLIGHT high speed optocoupler categorized as an LED device. The extracted datasheet facts identify a 2 MBit/s feature data rate and 5000 Vrms isolation between input and output. Package options are DIP6 and SMD6, with referenced package outline dimensions in millimeters but no numeric outline dimensions included in the extracted text.
The input side is rated for 60 mA maximum forward current, 6 V maximum reverse voltage, and 75 mW maximum input power dissipation at TA=25°C unless otherwise specified. The output and supply ratings include a 0 to 16 V output voltage range, 3 to 16 V allowed supply voltage range, 50 mA maximum output current, and 150 mW maximum output power dissipation.
Operating conditions and switching data support isolated digital interface use. The operating temperature range is -55 to +100 °C, storage is -55 to +125 °C, and isolation resistance is at least 10^11 Ω at VI-O=500 VDC. Assembly facts include UL 94V-0 molding compound, matte tin-plated leads, 260 °C soldering for 10 seconds, defined reflow and wave soldering profiles, and DIP6 tube or SMD6 tape-and-reel packing options.
Key Features
- 2 MBit/s feature data rate
- 5000 Vrms input-to-output isolation rating
- -55 to +100 °C operating temperature range
- DIP6 and SMD6 package options
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads per solderability specification
- 3 to 15 V operating VCC range
- Typical 41 ns high-level propagation delay
- Typical 50 ns low-level propagation delay
- Minimum 5000 V/µs common-mode transient immunity
Typical Applications
- Isolated digital signaling
- Controller interface isolation
- Logic output isolation
- Data communication isolation paths
- 5 V optocoupler interface circuits
- DIP6 through-hole assemblies
- SMD6 tape-and-reel assemblies
Procurement Notes
When requesting a quote for XLH11L1-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is XLH11L1-G?
XLH11L1-G is identified by the extracted datasheet facts as a XINGLIGHT high speed optocoupler in the LED category, with DIP6 and SMD6 package options and a 2 MBit/s feature data rate.
What isolation rating is specified for XLH11L1-G?
The extracted facts specify 5000 Vrms isolation between input and output. A separate isolation test condition lists 5000 Vrms AC for 1 minute at 40 to 60% RH, with input pins and output pins shorted in groups.
What operating temperature range does XLH11L1-G support?
The operating temperature range is specified as -55 to +100 °C. The extracted thermal characteristics also list a storage temperature range of -55 to +125 °C and a 260 °C soldering temperature for 10 seconds.
Which package and packing options are listed?
The datasheet facts list DIP6 and SMD6 package options. DIP6 ordering is 65 pcs per tube, while SMD6 ordering is 1000 pcs per tape and reel. Packing tables also list box and carton quantities for both options.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.