Specifications
| Type | Description |
|---|---|
| Part Number | XLM303X |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Component Type | Power_IC |
| Package / Case | SOP4 |
| Inferred Category | LED |
| Peak Breakdown Voltage | 250 V; XLM303X variant |
| Isolation Voltage | 3750 Vrms; between input and output |
| Operating Temperature | -55 to +100 °C; feature summary |
| Case | SOP4; mechanical data |
| Molding Compound Flammability Rating | UL 94V-0; mechanical data |
| Terminal Finish | Matte tin-plated leads; solderability per MIL-STD-202 Method 208 |
| Shipping Quantity | 3000 pcs/tape & reel; SOP4 package |
| Forward Current | 60 mA; maximum rating, Ta=25°C unless otherwise specified |
| Reverse Voltage | 6 V; maximum rating, input, Ta=25°C unless otherwise specified |
| Input Power Dissipation | 100 mW; maximum rating, Ta=25°C unless otherwise specified |
| Input Power Dissipation Derating Factor | 3.8 mW/°C; above Ta=85°C |
| Output Power Dissipation | 300 mW; maximum rating, Ta=25°C unless otherwise specified |
| Output Power Dissipation Derating Factor | 7.6 mW/°C; above Ta=85°C |
| Off-State Output Terminal Voltage | 250 V; VDRM, XLM303X |
| Peak Repetitive Surge Current | 1 A; ITSM, pulse width=100 µs, 120 pps |
| Turn-On Current RMS | 100 mA; IT(RMS), maximum rating |
| Total Power Dissipation | 330 mW; PTOT, thermal characteristic |
| Isolation Voltage | 3750 Vrms; VISO, 40-60% RH, AC for 1 minute; pins 1,2 & 3 shorted and pins 4,5 & 6 shorted together |
| Operating Temperature | -55 to +110 °C; TOPR, thermal characteristic |
| Storage Temperature Range | -55 to +125 °C; TSTG |
| Soldering Temperature | 260 °C; TSOL, for 10 seconds |
| Forward Voltage | Typ 1.23 V, Max 1.5 V; VF, IF=20 mA, Ta=25°C unless otherwise specified |
| Reverse Leakage Current | Max 10 µA; IR, VR=6 V |
| Peak Blocking Current | Max 100 nA; IDRM, XLM303X/XLM304X, VDRM=rated VDRM, IF=0 mA |
| Peak Blocking Current | Max 500 nA; IDRM, XLM306X/XLM308X, VDRM=rated VDRM, IF=0 mA |
| Peak On-State Voltage | Max 3 V; VTM, ITM=100 mA, IF=rated IFT |
| Critical Rate of Rise of Off-State Voltage | Min 1000 V/µs; dv/dt, XLM303X/XLM304X, VPEAK=rated VDRM, IF=0 mA |
| Critical Rate of Rise of Off-State Voltage | Min 600 V/µs; dv/dt, XLM306X/XLM308X, VPEAK=rated VDRM, IF=0 mA |
| Inhibition Voltage | Max 20 V; VInh, MT1-MT2 voltage above which device will not trigger, IF=rated IFT |
| Leakage in Inhibited State Off-State | Max 500 µA; IDRM2, IF=rated IFT, VDRM=rated VDRM |
| LED Trigger Current | Max 15 mA; IFT, XLM3031/XLM3041/XLM3061/XLM3081, main terminal voltage=3 V |
| LED Trigger Current | Max 10 mA; IFT, XLM3032/XLM3042/XLM3062/XLM3082, main terminal voltage=3 V |
| LED Trigger Current | Max 5 mA; IFT, XLM3033/XLM3043/XLM3063/XLM3083, main terminal voltage=3 V |
| LED Trigger Current | Max 3 mA; IFT, XLM3034/XLM3044/XLM3064/XLM3084, main terminal voltage=3 V |
| Holding Current | Typ 250 µA; IH |
| Reflow Preheat Temperature | 150 to 200 °C; Ts, reflow soldering profile |
| Reflow Preheat Time | 60 to 120 s; ts, reflow soldering profile |
| Reflow Ramp-Up Rate | Max 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; TL |
| Reflow Time Above Liquidus | 60 to 150 s; tL, above TL |
| Reflow Peak Temperature | 260 °C; Tp |
| Reflow Peak Dwell Time | 30 s; tp, time during which Tc is between TP-5 and TP |
| Reflow Ramp-Down Rate | Max 6 °C/s; TP to TL |
| Reflow Soldering Cycles | No more than 3 times; recommended temperatures and times |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; wave soldering profile |
| Wave Soldering Heating Rate During Preheat | Typical 1 to 2 °C/s, Max 4 °C/s; wave soldering profile |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp |
| Wave Soldering Peak Time | 10 s; tp, time within peak temperature |
| Wave Soldering Ramp-Down Rate | Max 5 °C/s; wave soldering profile |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s; for product rework or sample testing |
| Packing Quantity Per Reel | 3000 pcs/reel; SOP4 reel, diameter 330 mm |
| Packing Quantity Per Box | 6000 pcs; 2 reels/box |
| Packing Quantity Per Carton | 60000 pcs; 10 boxes/carton |
| Antistatic Bag Specification | 380*420 mm; SOP4 packing |
| Box Specification | 350*340*60 mm; SOP4 packing |
| Carton Specification | 365*330*370 mm; SOP4 packing |
| Datasheet Status | request_only |
Product Overview
The XLM303X is a XINGLIGHT zero cross triac driver in the LED category. It uses an SOP4 package and is specified for isolated input-to-output operation, with 3750 Vrms isolation voltage listed both in the feature summary and in the absolute maximum ratings test condition.
Key Features
- Zero cross triac driver in SOP4 case
- 250 V peak breakdown voltage for XLM303X variant
- 3750 Vrms isolation between input and output
- -55 to +110 °C thermal operating temperature range
- 60 mA maximum forward current rating
- 100 mA RMS turn-on current maximum rating
- 1 A peak repetitive surge current rating
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads per MIL-STD-202 Method 208
- 3000 pcs per SOP4 tape and reel
Typical Applications
- Isolated triac triggering
- AC load switching interfaces
- Zero-cross switching circuits
- Controller-to-triac isolation
- SOP4 optotriac driver layouts
- Reflow or wave soldered assemblies
- Product rework or sample testing
Procurement Notes
When requesting a quote for XLM303X, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package is used for the XLM303X?
The XLM303X is specified in an SOP4 case. The packing data also identifies SOP4 reel packing with 3000 pcs per reel and a 330 mm reel diameter.
What isolation rating is listed for this device?
The datasheet facts list 3750 Vrms isolation voltage between input and output. The absolute maximum rating condition specifies VISO tested at 40-60% RH with AC applied for 1 minute.
What are the main output-side ratings?
For XLM303X, the extracted ratings include 250 V off-state output terminal voltage, 1 A peak repetitive surge current, 100 mA RMS turn-on current, and 300 mW output power dissipation.
Which soldering profiles are provided?
The facts include reflow, wave, and hand soldering data. Reflow peak temperature is 260 °C, wave soldering peak temperature is 260 °C, and hand soldering is listed as 360 °C +5 °C within 3 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.