Specifications
| Type | Description |
|---|---|
| Part Number | XLM304X-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SOP4; package outline dimensions shown in datasheet but numeric body dimensions not readable in provided text |
| Peak Breakdown Voltage / Off-State Output Terminal Voltage | 400 V; condition: XLM304X device family |
| Isolation Voltage | 3750 Vrms; condition: between input and output |
| Operating Temperature | -55 to +100 °C; condition: feature summary |
| Package | SOP4; condition: mechanical data / ordering information |
| Molding Compound Flammability Rating | UL 94V-0; condition: mechanical data |
| Lead Finish | Matte tin-plated leads; condition: terminals; solderability per MIL-STD-202 Method 208 |
| Shipping Quantity | 3000 pcs/tape & reel; condition: SOP4 package ordering information |
| Forward Current | 60 mA; condition: maximum rating, input, TA=25°C unless otherwise specified |
| Reverse Voltage | 6 V; condition: maximum rating, input, TA=25°C unless otherwise specified |
| Input Power Dissipation | 100 mW; condition: maximum rating, TA=25°C unless otherwise specified |
| Input Power Dissipation Derating Factor | 3.8 mW/°C; condition: above TA=85°C |
| Output Power Dissipation | 300 mW; condition: maximum rating, TA=25°C unless otherwise specified |
| Output Power Dissipation Derating Factor | 7.6 mW/°C; condition: above TA=85°C |
| Off-State Output Terminal Voltage | 400 V; condition: XLM304X, maximum rating |
| Peak Repetitive Surge Current | 1 A; condition: pw=100 µs, 120 pps |
| Turn-On Current RMS | 100 mA; condition: maximum rating |
| Total Power Dissipation | 330 mW; condition: thermal characteristics |
| Isolation Voltage | 3750 Vrms; condition: 40-60% RH, AC for 1 minute; input/output pins shorted as specified |
| Operating Temperature | -55 to +110 °C; condition: thermal characteristics |
| Storage Temperature Range | -55 to +125 °C; condition: thermal characteristics |
| Soldering Temperature | 260 °C; condition: for 10 seconds |
| Forward Voltage | Typ 1.23 V, Max 1.5 V; condition: IF=20 mA, TA=25°C unless otherwise specified |
| Reverse Leakage Current | Max 10 µA; condition: VR=6 V |
| Peak Blocking Current | Max 100 nA; condition: XLM304X, VDRM=rated VDRM, IF=0 mA |
| Peak On-State Voltage | Max 3 V; condition: ITM=100 mA, IF=rated IFT |
| Critical Rate of Rise of Off-State Voltage | Min 1000 V/µs; condition: XLM304X, VPEAK=rated VDRM, IF=0 mA |
| Inhibition Voltage | Max 20 V; condition: MT1-MT2 voltage above which device will not trigger; IF=rated IFT |
| Leakage in Inhibited-State Off-State | Max 500 µA; condition: IF=rated IFT, VDRM=rated VDRM |
| LED Trigger Current | Max 15 mA; condition: XLM3041, main terminal voltage=3 V |
| LED Trigger Current | Max 10 mA; condition: XLM3042, main terminal voltage=3 V |
| LED Trigger Current | Max 5 mA; condition: XLM3043, main terminal voltage=3 V |
| LED Trigger Current | Max 3 mA; condition: XLM3044, main terminal voltage=3 V |
| Holding Current | Typ 250 µA; condition: electrical characteristics, TA=25°C unless otherwise specified |
| Reflow Preheat Temperature | 150 to 200 °C; condition: reflow soldering profile, Ts |
| Reflow Preheat Time | 60 to 120 s; condition: reflow soldering profile, ts |
| Reflow Ramp-Up Rate | Max 3 °C/s; condition: TL to TP |
| Reflow Liquidus Temperature | 217 °C; condition: TL |
| Reflow Time Above Liquidus | 60 to 150 s; condition: tL above TL |
| Reflow Peak Temperature | 260 °C; condition: Tp |
| Reflow Time Near Peak | Max 30 s; condition: time during which Tc is between TP-5 and TP |
| Reflow Ramp-Down Rate | Max 6 °C/s; condition: TP to TL |
| Recommended Reflow Cycles | No more than 3 times; condition: reflow soldering note |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; condition: wave soldering profile |
| Wave Soldering Heating Rate During Preheat | Typical 1 to 2 °C/s, maximum 4 °C/s; condition: wave soldering profile |
| Wave Soldering Final Preheat Temperature | ~130 °C; condition: Ts |
| Wave Soldering Preheat Time | >60 s; condition: 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; condition: Tp |
| Wave Soldering Time Within Peak Temperature | 10 s; condition: tp |
| Wave Soldering Ramp-Down Rate | Max 5 °C/s; condition: wave soldering profile |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s; condition: for product rework or sample testing |
| Packing Quantity Per Reel | 3000 pcs/reel; condition: SOP4 reel, φ330 mm |
| Packing Quantity Per Box | 6000 pcs/box; condition: 2 reels/box |
| Packing Quantity Per Carton | 60000 pcs/carton; condition: 10 boxes/carton |
| Datasheet Status | request_only |
Product Overview
XLM304X-G is identified in the manufacturer datasheet as a XINGLIGHT zero-cross triac driver within the LED category. The device family is specified with a 400 V peak breakdown/off-state output terminal voltage and 3750 Vrms isolation between input and output, supporting isolated triggering across the device input and output terminals.
The package is SOP4, with package outline dimensions shown in the datasheet but numeric body dimensions not readable in the provided text. Mechanical data lists UL 94V-0 molding compound and matte tin-plated leads, with solderability referenced to MIL-STD-202 Method 208.
Electrical limits include 60 mA forward current, 6 V reverse voltage, 100 mW input power dissipation, 300 mW output power dissipation, and 330 mW total power dissipation. Electrical characteristics include 1.23 V typical and 1.5 V maximum forward voltage at 20 mA, 100 nA maximum peak blocking current, and 1000 V/µs minimum critical rate of rise of off-state voltage.
Assembly information includes reflow peak temperature of 260 °C, wave soldering peak temperature of 260 °C, and hand soldering at 360 °C +5 °C within 3 seconds.
Key Features
- Zero-cross triac driver product type
- 400 V off-state output terminal voltage
- 3750 Vrms input-to-output isolation voltage
- SOP4 package with tape-and-reel ordering
- UL 94V-0 molding compound rating
- Matte tin-plated leads per terminal data
- 60 mA maximum input forward current
- 100 mA maximum RMS turn-on current
- 1000 V/µs minimum off-state dV/dt
- 260 °C peak reflow soldering profile
Typical Applications
- Isolated triac triggering
- Zero-cross AC switching
- SOP4 control assemblies
- Reflow soldered control boards
- Wave soldered control boards
- Hand-reworked sample boards
Procurement Notes
When requesting a quote for XLM304X-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package is specified for XLM304X-G?
The extracted datasheet facts identify XLM304X-G as an SOP4 device. The package outline is shown in the datasheet, but numeric body dimensions were not readable in the provided text.
What isolation voltage does the datasheet list?
The datasheet facts list 3750 Vrms isolation voltage between input and output. A maximum-rating entry also specifies 3750 Vrms for AC testing during 1 minute at 40-60% RH.
What output voltage rating applies to the XLM304X family?
The XLM304X device family is listed with a 400 V peak breakdown voltage or off-state output terminal voltage. The maximum-rating table also lists 400 V off-state output terminal voltage for XLM304X.
What soldering limits are provided for assembly?
The facts list 260 °C reflow peak temperature, 260 °C wave soldering peak temperature, and 360 °C +5 °C hand soldering iron temperature within 3 seconds for rework or sample testing.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.