Specifications
| Type | Description |
|---|---|
| Part Number | XLM452-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Component Type | Other |
| Package Case | SOP5 |
| Data Rate | 1 MBit/s; feature statement |
| Isolation Voltage | 3750 Vrms; between input and output; feature statement |
| Operating Temperature | -40 to +100 °C; feature statement |
| Molding Compound Flammability Rating | UL 94V-0; mechanical data |
| Terminal Plating | Matte tin-plated leads; solderability per MIL-STD-202, Method 208 |
| Package | SOP5; mechanical data / ordering information |
| Orderable Part Number | XLM452P; package SOP5 |
| Shipping Quantity | 3000 pcs/Tape & Reel; XLM452P, SOP5 |
| Marking Code | XLM452; XLM452P, SOP5 |
| Maximum Forward Current | 50 mA; TA=25°C unless otherwise specified |
| Maximum Input Reverse Voltage | 5 V; TA=25°C unless otherwise specified |
| Maximum Power Dissipation | 45 mW; TA=25°C unless otherwise specified |
| Maximum Collector Output Power | 100 mW; TA=25°C unless otherwise specified |
| Maximum Output Current | 16 mA; TA=25°C unless otherwise specified |
| Maximum Supply Voltage | 30 V; TA=25°C unless otherwise specified |
| Maximum Output Voltage | 20 V; TA=25°C unless otherwise specified |
| Isolation Voltage | 3750 Vrms; 40 to 60% RH, AC for 1 minute |
| Operating Temperature Range | -40 to +100 °C; thermal characteristics |
| Storage Temperature Range | -55 to +125 °C; thermal characteristics |
| Soldering Temperature | 260 °C; for 10 seconds |
| Forward Voltage | Typ 1.45 V, Max 1.7 V; IF=16 mA, TA=25°C unless otherwise specified |
| Reverse Breakdown Input Voltage | Min 5 V, Typ 20 V; IR=10 µA, TA=25°C unless otherwise specified |
| Diode Temperature Coefficient | Typ -1.6 mV/°C; IF=10 mA, TA=25°C unless otherwise specified |
| High Level Supply Current | Typ 1 µA, Max 2 µA; VCC=15 V, IF=0 mA, VO=open, TA=0 to 70°C for max value |
| Low Level Supply Current | Typ 120 µA, Max 800 µA; VCC=15 V, IF=16 mA, VO=open |
| High Level Output Current | Typ 0.001 µA, Max 0.5 µA; IF=0 mA, VO=5.5 V, VCC=5.5 V |
| High Level Output Current | Typ 0.005 µA, Max 1 µA; Max 50 µA at TA=0 to 70°C; IF=0 mA, VO=15 V, VCC=15 V |
| Low Level Output Voltage | Typ 0.1 V, Max 0.4 V; VCC=4.5 V, IF=16 mA, IO=3 mA |
| Low Level Output Voltage | Typ 0.1 V, Max 0.5 V; VCC=4.5 V, IF=16 mA, IO=2.4 mA |
| Current Transfer Ratio | Min 19%, Typ 24%, Max 80%; IF=16 mA, VCC=4.5 V, VO=0.4 V |
| Current Transfer Ratio | Min 15%, Typ 25%; IF=16 mA, VCC=4.5 V, VO=0.5 V |
| Isolation Resistance | Typ 1×10^12 Ω; VIO=500 Vdc, 40 to 60% RH |
| Floating Capacitance | Typ 0.6 pF; f=1 MHz |
| Propagation Delay Time to Output High Level | Typ 150 ns, Max 800 ns; TA=25°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ |
| Propagation Delay Time to Output High Level | Max 800 ns; TA=-40 to +85°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ |
| Propagation Delay Time to Output Low Level | Typ 200 ns, Max 800 ns; TA=25°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ |
| Propagation Delay Time to Output Low Level | Max 800 ns; TA=-40 to +85°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ |
| Common Mode Transient Immunity at Logic High | Min 5000 V/µs; TA=25°C, IF=0 mA, |VCM|=10 V peak, CL=15 pF, RL=1.9 kΩ |
| Common Mode Transient Immunity at Logic Low | Min 5000 V/µs; TA=25°C, IF=16 mA, |VCM|=10 V peak, CL=15 pF, RL=1.9 kΩ |
| Reflow Preheat Temperature | Min 150 °C, Max 200 °C; reflow soldering profile |
| Reflow Preheat Time | Min 60 s, Max 120 s; reflow soldering profile |
| Reflow Ramp-Up Rate | 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; reflow soldering profile |
| Reflow Time Above Liquidus | Min 60 s, Max 150 s; above TL=217 °C |
| Reflow Peak Temperature | 260 °C; reflow soldering profile |
| Reflow Peak Time | 30 s; time during which Tc is between TP-5 and TP |
| Reflow Ramp-Down Rate | 6 °C/s; TP to TL |
| Maximum Reflow Cycles | No more than 3 times; recommended reflow soldering profile |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; wave soldering profile feature |
| Wave Soldering Heating Rate During Preheat | Typical 1 to 2 °C/s, Max 4 °C/s; wave soldering profile feature |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts |
| Wave Soldering Preheat Time | >60 s; 25 °C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp |
| Wave Soldering Peak Time | 10 s; time within peak temperature tp |
| Wave Soldering Ramp-Down Rate | Max 5 °C/s; wave soldering profile feature |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s; only for product rework or sample testing |
| Packing Form | Reel, φ330 mm; SOP5 package |
| Quantity Per Reel | 3000 pcs/reel; SOP5 packing |
| Quantity Per Box | 6000 pcs, 2 reels/box; SOP5 packing |
| Quantity Per Carton | 60000 pcs, 10 boxes/carton; SOP5 packing |
| Antistatic Bag Specification | 380*420 mm; SOP5 packing |
| Box Specification | 350*340*60 mm; SOP5 packing |
| Carton Specification | 365*330*370 mm; SOP5 packing |
| Guard Band Speed | 200 mm/min; packing note |
| Document Validity | Valid until Dec 31, 2026; attention note |
| Datasheet Status | request_only |
Product Overview
The XLM452-G is a XINGLIGHT high speed optocoupler in the LED category, using an SOP5 package. Datasheet feature statements identify a 1 MBit/s data rate and 3750 Vrms isolation between input and output, with operation over -40 to +100 °C. The SOP5 mechanical data includes UL 94V-0 molding compound and matte tin-plated leads with solderability per MIL-STD-202, Method 208.
Input and output ratings include 50 mA maximum forward current, 5 V maximum input reverse voltage, 30 V maximum supply voltage, 20 V maximum output voltage, and 16 mA maximum output current. Electrical characteristics include forward voltage of 1.45 V typical and 1.7 V maximum at IF=16 mA, current transfer ratio options, isolation resistance of 1×10^12 Ω typical, and floating capacitance of 0.6 pF typical.
For timing-sensitive isolated signal links, the datasheet lists propagation delay to output high of 150 ns typical and to output low of 200 ns typical at TA=25°C, VCC=5 V, IF=16 mA, and RL=1.9 kΩ. Assembly guidance includes reflow, wave, and hand soldering limits, with SOP5 reel packing at 3000 pcs per reel.
Key Features
- 1 MBit/s high speed optocoupler data rate
- 3750 Vrms input-to-output isolation rating
- SOP5 package with XLM452 marking code
- -40 to +100 °C operating temperature range
- 50 mA maximum forward current rating
- 30 V maximum supply voltage rating
- Propagation delay up to 800 ns maximum
- 5000 V/µs minimum common-mode transient immunity
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads per solderability specification
Typical Applications
- 1 MBit/s isolated signal links
- Input-to-output isolated interfaces
- SOP5 optocoupler board assemblies
- Logic signal isolation circuits
- Systems requiring 3750 Vrms isolation
- Circuits needing 5000 V/µs CMTI
- Tape-and-reel SOP5 production assembly
Procurement Notes
When requesting a quote for XLM452-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is the XLM452-G?
The XLM452-G is identified as a XINGLIGHT high speed optocoupler in the LED category. The extracted datasheet facts specify an SOP5 package, a 1 MBit/s data rate, and 3750 Vrms isolation between input and output.
What are the main isolation specifications for XLM452-G?
The datasheet facts list 3750 Vrms isolation voltage between input and output. A second isolation entry specifies 3750 Vrms under 40 to 60% RH with AC applied for 1 minute. Typical isolation resistance is 1×10^12 Ω at VIO=500 Vdc.
What operating temperature range does XLM452-G support?
The operating temperature range is specified as -40 to +100 °C. The storage temperature range is -55 to +125 °C, and the datasheet also includes timing data over -40 to +85 °C for propagation delay limits.
What package and packing format are specified?
The package is SOP5. Ordering and packing facts list orderable part number XLM452P, marking code XLM452, 3000 pcs per tape-and-reel shipment, φ330 mm reel packing, 6000 pcs per box, and 60000 pcs per carton.
What soldering limits are given for this part?
The datasheet facts specify 260 °C soldering temperature for 10 seconds. Reflow data includes 150 to 200 °C preheat, 217 °C liquidus, 260 °C peak, and no more than 3 reflow cycles. Hand soldering is 360 °C +5 °C within 3 seconds for rework or sample testing.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.