Specifications
| Type | Description |
|---|---|
| Part Number | XLM453-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Inferred Category | LED |
| Component Type | Other |
| Package Case | SOP5 |
| Data Rate | 1 MBit/s; feature statement |
| Isolation Voltage | 3750 Vrms; between input and output; feature statement |
| Operating Temperature | -40 to +100 °C; feature statement |
| Package | SOP5; mechanical data |
| Molding Compound Flammability Rating | UL 94V-0; mechanical data |
| Terminal Finish | Matte tin-plated leads; solderability per MIL-STD-202, Method 208 |
| Orderable Part Number | XLM453P; package SOP5 |
| Shipping Quantity | 3000 pcs/Tape & Reel; part number XLM453P, SOP5 package |
| Marking Code | XLM453; part number XLM453P |
| Forward Current | 50 mA; maximum rating, TA=25°C unless otherwise specified |
| Input Reverse Voltage | 5 V; maximum rating, TA=25°C unless otherwise specified |
| Power Dissipation | 45 mW; maximum rating, TA=25°C unless otherwise specified |
| Collector Output Power | 100 mW; maximum rating, TA=25°C unless otherwise specified |
| Output Current | 16 mA; maximum rating, TA=25°C unless otherwise specified |
| Output Supply Voltage | 30 V; maximum rating, TA=25°C unless otherwise specified |
| Output Voltage | 20 V; maximum rating, TA=25°C unless otherwise specified |
| Isolation Voltage, Thermal Characteristics | 3750 Vrms; 40 to 60% RH, AC for 1 minute |
| Operating Temperature Range | -40 to +100 °C; thermal characteristics |
| Storage Temperature Range | -55 to +125 °C; thermal characteristics |
| Soldering Temperature | 260 °C; for 10 seconds |
| Forward Voltage | Typ 1.45 V, Max 1.7 V; IF=16 mA, TA=25°C unless otherwise specified |
| Reverse Breakdown Input Voltage | Min 5 V, Typ 20 V; IR=10 µA, TA=25°C unless otherwise specified |
| Diode Temperature Coefficient | Typ -1.6 mV/°C; IF=10 mA, TA=25°C unless otherwise specified |
| High Level Supply Current | Typ 1 µA, Max 2 µA; VCC=15 V, IF=0 mA, VO=open, TA=0 to 70°C for max value |
| Low Level Supply Current | Typ 120 µA, Max 800 µA; VCC=15 V, IF=16 mA, VO=open, TA=25°C unless otherwise specified |
| High Level Output Current, 5.5 V | Typ 0.001 µA, Max 0.5 µA; IF=0 mA, VO=5.5 V, VCC=5.5 V |
| High Level Output Current, 15 V | Typ 0.005 µA, Max 1 µA; IF=0 mA, VO=15 V, VCC=15 V |
| High Level Output Current, TA=0 to 70°C | Max 50 µA; TA=0 to 70°C |
| Low Level Output Voltage, IO=3 mA | Typ 0.1 V, Max 0.4 V; VCC=4.5 V, IF=16 mA, IO=3 mA |
| Low Level Output Voltage, IO=2.4 mA | Typ 0.1 V, Max 0.5 V; VCC=4.5 V, IF=16 mA, IO=2.4 mA |
| Current Transfer Ratio, VO=0.4 V | Min 19%, Typ 24%, Max 80%; IF=16 mA, VCC=4.5 V, VO=0.4 V |
| Current Transfer Ratio, VO=0.5 V | Min 15%, Typ 25%; IF=16 mA, VCC=4.5 V, VO=0.5 V |
| Isolation Resistance | Typ 1×10^12 Ω; VIO=500 Vdc, 40 to 60% RH |
| Floating Capacitance | Typ 0.6 pF; f=1 MHz |
| Propagation Delay Time to Output High Level, Typical Row | Typ 150 ns, Max 800 ns; TA=-40°C to +85°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ, TA=25°C for typ row |
| Propagation Delay Time to Output High Level, Full Range | Max 800 ns; TA=-40°C to +85°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ |
| Propagation Delay Time to Output Low Level, Typical Row | Typ 200 ns, Max 800 ns; TA=-40°C to +85°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ, TA=25°C for typ row |
| Propagation Delay Time to Output Low Level, Full Range | Max 800 ns; TA=-40°C to +85°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ |
| Common Mode Transient Immunity at Logic High | Min 5000 V/µs; TA=25°C, IF=0 mA, |VCM|=10 V peak, CL=15 pF, RL=1.9 kΩ |
| Common Mode Transient Immunity at Logic Low | Min 5000 V/µs; TA=25°C, IF=16 mA, |VCM|=10 V peak, CL=15 pF, RL=1.9 kΩ |
| Reflow Preheat Temperature | 150 to 200 °C; reflow soldering profile |
| Reflow Preheat Time | 60 to 120 s; reflow soldering profile |
| Reflow Ramp-Up Rate | 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; reflow soldering profile |
| Reflow Time Above Liquidus | 60 to 150 s; above TL=217°C |
| Reflow Peak Temperature | 260 °C; reflow soldering profile |
| Reflow Peak Time | 30 s; time during which Tc is between TP-5 and TP |
| Reflow Ramp-Down Rate | 6 °C/s; TP to TL |
| Maximum Reflow Cycles | No more than 3 times; recommended reflow soldering profile |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; wave soldering profile |
| Wave Soldering Heating Rate During Preheat | Typical 1 to 2 °C/s, Maximum 4 °C/s; wave soldering profile |
| Wave Soldering Final Preheat Temperature | ~130 °C; wave soldering profile |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; wave soldering profile |
| Wave Soldering Peak Time | 10 s; time within peak temperature |
| Wave Soldering Ramp-Down Rate | Maximum 5 °C/s; wave soldering profile |
| Hand Soldering Iron Temperature | 360°C +5°C within 3 s; product rework or sample testing only |
| Packing Form | Reel, diameter 330 mm; SOP5 packing |
| Quantity Per Reel | 3000 pcs/reel; SOP5 packing |
| Quantity Per Box | 6000 pcs; 2 reels/box |
| Quantity Per Carton | 60000 pcs; 10 boxes/carton |
| Antistatic Bag Specification | 380 × 420 mm; SOP5 reel packing |
| Box Specification | 350 × 340 × 60 mm; SOP5 reel packing |
| Carton Specification | 365 × 330 × 370 mm; SOP5 reel packing |
| Guardband Speed | 200 mm/min; packing note |
| Document Validity | Valid until Dec 31, 2026; attention section |
| Datasheet Status | request_only |
Product Overview
The XLM453-G is a XINGLIGHT high speed optocoupler categorized under LED components and built in an SOP5 package. Its feature data lists a 1 MBit/s data rate, 3750 Vrms isolation between input and output, and an operating temperature range of -40 to +100 °C. The molding compound is rated UL 94V-0, and the terminals use matte tin-plated leads with solderability per MIL-STD-202, Method 208.
Input and output ratings include 50 mA maximum forward current, 5 V input reverse voltage, 45 mW input power dissipation, 100 mW collector output power, 16 mA output current, 30 V output supply voltage, and 20 V output voltage at TA=25 °C unless otherwise specified. Electrical data includes typical 0.6 pF floating capacitance, typical 1×10^12 Ω isolation resistance, and minimum 5000 V/µs common-mode transient immunity for both logic-high and logic-low conditions.
For assembly, the datasheet specifies 260 °C soldering for 10 seconds, a 260 °C peak reflow profile with no more than three reflow cycles, and SOP5 reel packing at 3000 pcs per reel.
Key Features
- 1 MBit/s high speed optocoupler data rate
- 3750 Vrms isolation between input and output
- -40 to +100 °C operating temperature range
- SOP5 package with UL 94V-0 molding compound
- Matte tin-plated leads per MIL-STD-202 Method 208
- 50 mA maximum forward current rating
- 30 V maximum output supply voltage rating
- Typical 0.6 pF floating capacitance at 1 MHz
- Minimum 5000 V/µs common-mode transient immunity
- 260 °C peak reflow temperature profile
Typical Applications
- Isolated 1 MBit/s digital links
- Logic signal isolation
- Common-mode transient environments
- SOP5 surface-mount assemblies
- Input-to-output galvanic isolation
- Reel-packed automated assembly
- Rework or sample solder testing
Procurement Notes
When requesting a quote for XLM453-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is the XLM453-G?
The XLM453-G is identified as a XINGLIGHT high speed optocoupler in the LED category. The extracted datasheet facts list an SOP5 package, 1 MBit/s data rate, and 3750 Vrms isolation between input and output.
What isolation rating does the XLM453-G provide?
The datasheet facts specify 3750 Vrms isolation between input and output. A thermal-characteristics entry also lists 3750 Vrms under 40 to 60% RH with AC applied for 1 minute.
What are the main temperature limits for this part?
The operating temperature range is -40 to +100 °C. The storage temperature range is -55 to +125 °C, and the soldering temperature rating is 260 °C for 10 seconds.
How is the SOP5 XLM453P orderable variant packed?
For the SOP5 package, the orderable part number is XLM453P with marking code XLM453. Shipping quantity is listed as 3000 pcs per Tape & Reel, and packing data also states 3000 pcs per reel.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.