Specifications
| Type | Description |
|---|---|
| Part Number | XLM453L-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Inferred Category | LED |
| Component Type | Other |
| Package Case | SOP5; package outline shown in datasheet, numeric dimensions not provided in extracted text |
| Data Rate | 1 MBit/s |
| Package | SOP5 |
| Molding Compound Flammability | UL 94V-0 |
| Terminal Finish | Matte tin-plated leads |
| Ordering Part Number | XLM453LP |
| Shipping Quantity | 3000 pcs/tape & reel |
| Marking Code | XLM453L |
| Forward Current | 50 mA max |
| Input Reverse Voltage | 5 V max |
| Input Power Dissipation | 45 mW max |
| Collector Output Power Dissipation | 100 mW max |
| Output Current | 16 mA max |
| Output Supply Voltage | 30 V max |
| Output Voltage | 20 V max |
| Isolation Voltage | 3750 Vrms |
| Operating Temperature | -40 to +100 °C |
| Storage Temperature Range | -55 to +125 °C |
| Soldering Temperature | 260 °C |
| Forward Voltage | 1.45 V typ, 1.7 V max |
| Reverse Breakdown Input Voltage | 5 V min, 20 V typ |
| Diode Temperature Coefficient | -1.6 mV/°C typ |
| High Level Supply Current | 1 µA max |
| High Level Supply Current | 2 µA max |
| Low Level Supply Current | 120 µA typ, 800 µA max |
| High Level Output Current | 0.001 µA typ, 0.5 µA max |
| High Level Output Current | 0.005 µA typ, 1 µA max |
| High Level Output Current | 50 µA max |
| Low Level Output Voltage | 0.1 V typ, 0.4 V max |
| Low Level Output Voltage | 0.1 V typ, 0.5 V max |
| Current Transfer Ratio | 19% min, 24% typ, 80% max |
| Current Transfer Ratio | 15% min, 25% typ |
| Isolation Resistance | 1×10^12 Ω typ |
| Floating Capacitance | 0.6 pF typ |
| Propagation Delay Time to Output High Level | 150 ns typ, 800 ns max |
| Propagation Delay Time to Output High Level | 800 ns max |
| Propagation Delay Time to Output Low Level | 200 ns typ, 800 ns max |
| Propagation Delay Time to Output Low Level | 800 ns max |
| Common Mode Transient Immunity at Logic High | 5000 V/µs min |
| Common Mode Transient Immunity at Logic Low | 5000 V/µs min |
| Reflow Preheat Temperature | 150 to 200 °C |
| Reflow Preheat Time | 60 to 120 s |
| Reflow Ramp-Up Rate | 3 °C/s max |
| Reflow Liquidus Temperature | 217 °C |
| Reflow Time Above Liquidus | 60 to 150 s |
| Reflow Peak Temperature | 260 °C |
| Reflow Peak Dwell Time | 30 s max |
| Reflow Ramp-Down Rate | 6 °C/s max |
| Maximum Reflow Cycles | 3 times max |
| Wave Soldering Peak Temperature | 260 °C |
| Wave Soldering Peak Time | 10 s |
| Hand Soldering Temperature | 360 °C +5 °C |
| Packing Format | Reel, φ330 mm |
| Packing Quantity Per Reel | 3000 pcs/reel |
| Packing Quantity Per Box | 6000 pcs/box |
| Packing Quantity Per Carton | 60000 pcs/carton |
| Document Validity | Valid until Dec 31, 2026 |
| Datasheet Status | request_only |
Product Overview
The XLM453L-G is identified by XINGLIGHT as a high speed optocoupler in the LED category. It uses an SOP5 package, with the datasheet showing the package outline but not providing numeric package dimensions in the extracted text. Mechanical information includes UL 94V-0 molding compound flammability and matte tin-plated leads with solderability per MIL-STD-202, Method 208.
Electrical data centers on isolated digital transfer. The device has a 1 MBit/s data rate, 3750 Vrms isolation voltage for 1 minute at 40% to 60% RH, and 1×10^12 Ω typical isolation resistance at 500 Vdc. Output-side ratings include 30 V maximum output supply voltage, 20 V maximum output voltage, 16 mA maximum output current, and propagation delay maximums of 800 ns.
Assembly data includes a 260 °C peak reflow profile with up to three reflow cycles, 260 °C wave soldering for 10 seconds, and 360 °C +5 °C hand soldering within 3 seconds for rework or sample testing. Packing is reel-based, with 3000 pieces per reel.
Key Features
- 1 MBit/s high speed optocoupler data rate
- SOP5 package with shown package outline
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads per MIL-STD-202 Method 208
- 3750 Vrms isolation for one minute
- -40 to +100 °C operating temperature range
- 5000 V/µs minimum common-mode transient immunity
- 800 ns maximum high and low propagation delays
- 260 °C peak reflow temperature profile
- 3000 pieces per SOP5 reel packing
Typical Applications
- Isolated 1 MBit/s signal coupling
- SOP5 digital isolation interfaces
- Logic high transient immunity designs
- Logic low transient immunity designs
- Reel-packed assembly production
- Reflow soldered optocoupler boards
Procurement Notes
When requesting a quote for XLM453L-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What product type is XLM453L-G?
XLM453L-G is listed by XINGLIGHT as a high speed optocoupler in the LED category. The extracted datasheet facts specify a 1 MBit/s data rate and SOP5 package.
What isolation rating does XLM453L-G provide?
The datasheet lists 3750 Vrms isolation voltage under 40% to 60% RH with AC applied for 1 minute. It also lists 1×10^12 Ω typical isolation resistance at VIO=500 Vdc.
What are the key output-side maximum ratings?
The extracted maximum ratings list 16 mA maximum output current, 30 V maximum output supply voltage, 20 V maximum output voltage, and 100 mW maximum collector output power dissipation.
What soldering profiles are specified for this part?
The datasheet facts include a 260 °C peak reflow profile, 260 °C wave soldering peak temperature for 10 seconds, and 360 °C +5 °C hand soldering within 3 seconds for rework or sample testing.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.