Specifications
| Type | Description |
|---|---|
| Part Number | XLM600-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SOP5 |
| Data Rate | 10 MBit/s; Feature rating |
| Isolation Voltage | 3750 Vrms; Feature rating |
| Operating Temperature | -40 to +85 °C; Feature rating |
| Case | SOP5; Mechanical data |
| Molding Compound Flammability | UL 94V-0; Mechanical data |
| Terminal Finish | Matte tin-plated leads; Solderability per MIL-STD-202, Method 208 |
| Shipping Quantity | 3000 pcs/Tape & Reel; SOP5 package |
| Maximum Forward Current | 50 mA; TA=25°C unless otherwise specified |
| Maximum Input Reverse Voltage | 5 V; TA=25°C unless otherwise specified |
| Maximum Power Dissipation | 100 mW; TA=25°C unless otherwise specified |
| Maximum Collector Output Power | 85 mW; TA=25°C unless otherwise specified |
| Maximum Output Current | 50 mA; TA=25°C unless otherwise specified |
| Maximum Supply Voltage | 7 V; TA=25°C unless otherwise specified |
| Maximum Output Voltage | 7 V; TA=25°C unless otherwise specified |
| Isolation Voltage, Test Condition | 3750 Vrms; 40 to 60% RH, AC for 1 minute |
| Operating Temperature Range | -40 to +100 °C; Thermal characteristics |
| Storage Temperature Range | -55 to +125 °C; Thermal characteristics |
| Soldering Temperature | 260 °C; For 10 seconds |
| Forward Voltage | Typ 1.33 V, Max 1.8 V; IF=10 mA, TA=25°C unless otherwise specified |
| Reverse Breakdown Voltage | Min 5 V; IR=10 µA, TA=25°C unless otherwise specified |
| Input Capacitance | Typ 70 pF; VR=0 V, f=1 kHz, TA=25°C unless otherwise specified |
| Diode Temperature Coefficient | Typ -1.9 mV/°C; IF=10 mA, TA=25°C unless otherwise specified |
| High Level Supply Current | Typ 6.0 mA, Max 9 mA; VCC=5.5 V, IF=0 mA |
| Low Level Supply Current | Typ 7.5 mA, Max 10 mA; VCC=5.5 V, IF=10 mA |
| High Level Output Current | Typ 2.1 µA, Max 30 µA; VCC=5.5 V, VO=5.5 V, IF=250 µA |
| Low Level Output Voltage | Typ 0.4 V, Max 0.6 V; VCC=5.5 V, IF=5 mA, ICL=13 mA |
| Input Threshold Current | Typ 2.4 mA, Max 5 mA; VCC=5.5 V, VO=0.6 V, IOL=13 mA |
| Isolation Resistance | Typ 1×10^12 Ω; VIO=500 Vdc, 40 to 60% RH |
| Floating Capacitance | Typ 0.6 pF; f=1 MHz |
| Propagation Delay Time to Output High Level | Typ 41 ns, Max 100 ns; TA=-40°C to +85°C, VCC=5 V, IF=7.5 mA, CL=15 pF, RL=350 Ω, TA=25°C unless otherwise specified |
| Propagation Delay Time to Output Low Level | Typ 50 ns, Max 100 ns; TA=-40°C to +85°C, VCC=5 V, IF=7.5 mA, CL=15 pF, RL=350 Ω, TA=25°C unless otherwise specified |
| Pulse Width Distortion | Typ 9 ns, Max 35 ns; |TPHL-TPLH|, CL=15 pF, RL=350 Ω, TA=25°C |
| Output Rise Time | Typ 40 ns; 10% to 90%, CL=15 pF, RL=350 Ω, TA=25°C |
| Output Fall Time | Typ 10 ns; 90% to 10%, CL=15 pF, RL=350 Ω, TA=25°C |
| Propagation Delay Skew | Max 40 ns; CL=15 pF, RL=350 Ω, TA=25°C |
| Common Mode Transient Immunity at Logic High, M601 | Min 5000 V/µs; M601, TA=25°C, IF=0 mA, |VCM|=50 V peak, VOH=2.0 V, RL=350 Ω |
| Common Mode Transient Immunity at Logic High, M611 | Min 20000 V/µs; M611, TA=25°C, IF=0 mA, |VCM|=1000 V peak, VOH=2.0 V, RL=350 Ω |
| Common Mode Transient Immunity at Logic Low, M601 | Min 5000 V/µs; M601, IF=7.5 mA, VOL=0.8 V, RL=350 Ω, TA=25°C, |VCM|=50 V peak |
| Common Mode Transient Immunity at Logic Low, M611 | Min 20000 V/µs; M611, IF=7.5 mA, VOL=0.8 V, RL=350 Ω, TA=25°C, |VCM|=1000 V peak |
| Reflow Preheat Temperature | Min 150 °C, Max 200 °C; Reflow soldering profile |
| Reflow Preheat Time | Min 60 s, Max 120 s; Reflow soldering profile |
| Reflow Ramp-Up Rate | Max 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; Reflow soldering profile |
| Reflow Time Above Liquidus | Min 60 s, Max 150 s; Above TL |
| Reflow Peak Temperature | 260 °C; Reflow soldering profile |
| Reflow Time Near Peak | Max 30 s; Time during which TC is between TP-5 and TP |
| Reflow Ramp-Down Rate | Max 6 °C/s; TP to TL |
| Maximum Reflow Cycles | No more than 3 times; Recommended reflow soldering |
| Wave Soldering Peak Temperature | 260 °C; Wave soldering profile |
| Wave Soldering Time Within Peak Temperature | 10 s; Wave soldering profile |
| Hand Soldering Temperature | 360 °C +5 °C; Within 3 s; for product rework or sample testing |
| Reel Quantity | 3000 pcs/reel; SOP5 reel, φ330 mm |
| Box Quantity | 6000 pcs/box; 2 reels/box |
| Carton Quantity | 60000 pcs/carton; 10 boxes/carton |
| Datasheet Status | request_only |
Product Overview
The XLM600-G is a XINGLIGHT high speed optocoupler classified in the LED category. It uses an SOP5 case and is specified for a 10 MBit/s feature data rate with 3750 Vrms isolation. The molding compound is rated UL 94V-0, and the terminals use matte tin-plated leads with solderability referenced to MIL-STD-202, Method 208.
Electrical ratings include 50 mA maximum forward current, 5 V maximum input reverse voltage, 100 mW maximum input power dissipation, 85 mW maximum collector output power, 50 mA maximum output current, 7 V maximum supply voltage, and 7 V maximum output voltage. At IF=10 mA and TA=25°C, forward voltage is specified as 1.33 V typical and 1.8 V maximum.
Switching characteristics include 41 ns typical and 100 ns maximum propagation delay to output high, 50 ns typical and 100 ns maximum propagation delay to output low, 9 ns typical pulse width distortion, and 40 ns maximum propagation delay skew. Assembly data covers reflow, wave, and hand soldering profiles, with 3000 pcs per SOP5 reel packaging.
Key Features
- 10 MBit/s feature-rated data rate
- 3750 Vrms isolation voltage rating
- SOP5 case for surface-mount assembly
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads for solderability
- 50 mA maximum forward current rating
- 7 V maximum supply and output voltage
- 100 ns maximum propagation delay ratings
- 35 ns maximum pulse width distortion
- 5000 V/µs or 20000 V/µs CMTI options
Typical Applications
- Isolated digital signal links
- High-speed logic isolation
- Microcontroller interface isolation
- Industrial signal isolation
- Isolated data communication circuits
- Logic output level isolation
Procurement Notes
When requesting a quote for XLM600-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of component is the XLM600-G?
The XLM600-G is listed as a XINGLIGHT high speed optocoupler in the LED category. The extracted package information identifies the case as SOP5.
What isolation rating is specified for XLM600-G?
The datasheet facts list 3750 Vrms isolation voltage. A separate isolation entry specifies 3750 Vrms under 40 to 60% RH with AC applied for 1 minute.
What switching performance is listed for this optocoupler?
The device is feature-rated for 10 MBit/s. Propagation delay is specified as 41 ns typical, 100 ns maximum to output high, and 50 ns typical, 100 ns maximum to output low.
How is the SOP5 version packaged for shipment?
The SOP5 package is listed with 3000 pcs per Tape & Reel. Packaging data also lists 3000 pcs per reel, 6000 pcs per box, and 60000 pcs per carton.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.