Specifications
| Type | Description |
|---|---|
| Part Number | XLM601-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Component Type | Other |
| Package Case | SOP5; dimensions not readable in provided text |
| Data Rate | 10 MBit/s; feature statement |
| Isolation Voltage, Feature | 3750 Vrms; between input and output |
| Operating Temperature, Feature | -40 to +85 °C; feature statement |
| Case | SOP5; mechanical data |
| Molding Compound Flammability Rating | UL 94V-0; mechanical data |
| Terminal Finish | Matte tin-plated leads; solderability per MIL-STD-202, Method 208 |
| Package | SOP5; ordering information |
| Shipping Quantity | 3000 pcs/Tape & Reel; ordering information |
| Marking Code | XLM6XX; series marking |
| Forward Current | Max 50 mA; maximum ratings, TA=25°C unless otherwise specified |
| Input Reverse Voltage | Max 5 V; maximum ratings, TA=25°C unless otherwise specified |
| Power Dissipation | Max 100 mW; maximum ratings, TA=25°C unless otherwise specified |
| Collector Output Power Dissipation | Max 85 mW; maximum ratings, TA=25°C unless otherwise specified |
| Output Current | Max 50 mA; maximum ratings, TA=25°C unless otherwise specified |
| Supply Voltage | Max 7 V; maximum ratings, TA=25°C unless otherwise specified |
| Output Voltage | Max 7 V; maximum ratings, TA=25°C unless otherwise specified |
| Isolation Voltage, Test Condition | 3750 Vrms; 40 to 60% RH, AC for 1 minute |
| Operating Temperature, Thermal | -40 to +100 °C; thermal characteristics |
| Storage Temperature Range | -55 to +125 °C; thermal characteristics |
| Soldering Temperature | 260 °C; for 10 seconds |
| Forward Voltage | Typ 1.33 V, Max 1.8 V; IF=10 mA, TA=25°C |
| Reverse Breakdown Voltage | Min 5 V; IR=10 µA, TA=25°C |
| Input Capacitance | Typ 70 pF; VR=0 V, f=1 kHz, TA=25°C |
| Diode Temperature Coefficient | Typ -1.9 mV/°C; IF=10 mA, TA=25°C |
| High Level Supply Current | Typ 6.0 mA, Max 9 mA; VCC=5.5 V, IF=0 mA, TA=25°C |
| Low Level Supply Current | Typ 7.5 mA, Max 10 mA; VCC=5.5 V, IF=10 mA, TA=25°C |
| High Level Output Current | Typ 2.1 µA, Max 30 µA; VCC=5.5 V, VO=5.5 V, IF=250 µA, TA=25°C |
| Low Level Output Voltage | Typ 0.4 V, Max 0.6 V; VCC=5.5 V, IF=5 mA, ICL=13 mA, TA=25°C |
| Input Threshold Current | Typ 2.4 mA, Max 5 mA; VCC=5.5 V, VO=0.6 V, IOL=13 mA, TA=25°C |
| Isolation Resistance | Typ 1×10^12 Ω; VIO=500 Vdc, 40 to 60% RH, TA=25°C |
| Floating Capacitance | Typ 0.6 pF; f=1 MHz, TA=25°C |
| Propagation Delay Time to Output High Level | Typ 41 ns, Max 100 ns; TA=-40 to +85°C, VCC=5 V, IF=7.5 mA, CL=15 pF unless otherwise specified |
| Propagation Delay Time to Output Low Level | Typ 50 ns, Max 100 ns; TA=-40 to +85°C, VCC=5 V, IF=7.5 mA, CL=15 pF unless otherwise specified |
| Pulse Width Distortion | Typ 9 ns, Max 35 ns; |TPHL-TPLH|, CL=15 pF, RL=350 Ω, TA=25°C |
| Output Rise Time | Typ 40 ns; 10-90%, TA=-40 to +85°C, VCC=5 V, IF=7.5 mA unless otherwise specified |
| Output Fall Time | Typ 10 ns; 90-10%, TA=-40 to +85°C, VCC=5 V, IF=7.5 mA unless otherwise specified |
| Propagation Delay Skew | Max 40 ns; TA=-40 to +85°C, VCC=5 V, IF=7.5 mA unless otherwise specified |
| Common Mode Transient Immunity at Logic High | Min 5000 V/µs; XLM601, |CMH|, TA=25°C, IF=0 mA, |VCM|=50 V peak, VOH=2.0 V, RL=350 Ω |
| Common Mode Transient Immunity at Logic Low | Min 5000 V/µs; XLM601, |CML|, IF=7.5 mA, VOL=0.8 V, RL=350 Ω, TA=25°C, |VCM|=50 V peak |
| Reflow Preheat Temperature | Min 150 °C, Max 200 °C; reflow soldering profile |
| Reflow Preheat Time | Min 60 s, Max 120 s; reflow soldering profile |
| Reflow Ramp-up Rate | Max 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; reflow soldering profile |
| Reflow Time Above Liquidus | Min 60 s, Max 150 s; above TL |
| Reflow Peak Temperature | 260 °C; reflow soldering profile |
| Reflow Peak Time | Max 30 s; time during which TC is between TP-5 and TP |
| Reflow Ramp-down Rate | Max 6 °C/s; TP to TL |
| Wave Soldering Peak Temperature | 260 °C; wave soldering profile |
| Wave Soldering Peak Time | 10 s; time within peak temperature |
| Hand Soldering Temperature | 360 °C +5 °C within 3 s; hand soldering iron for rework or sample testing |
| Packing Form | Reel, φ330 mm; SOP5 packing |
| Quantity per Reel | 3000 pcs/reel; SOP5 packing |
| Quantity per Box | 6000 pcs; 2 reels/box; SOP5 packing |
| Quantity per Carton | 60000 pcs; 10 boxes/carton; SOP5 packing |
| Antistatic Bag Specification | 380×420 mm; SOP5 packing |
| Box Specification | 350×340×60 mm; SOP5 packing |
| Carton Specification | 365×330×370 mm; SOP5 packing |
| Datasheet Status | request_only |
Product Overview
XLM601-G is a XINGLIGHT high speed optocoupler listed in the LED category. It is specified for a 10 MBit/s data rate and provides 3750 Vrms isolation between input and output, with an isolation resistance of 1×10^12 Ω typical under the stated 500 Vdc test condition.
The device uses an SOP5 case with matte tin-plated leads and UL 94V-0 molding compound flammability rating. Ordering information identifies the SOP5 package, XLM6XX series marking code, and 3000 pcs per tape-and-reel quantity.
Electrical and switching data support isolated digital signal transfer. At 5 V VCC and 7.5 mA input current conditions, propagation delay is specified at 41 ns typical to output high and 50 ns typical to output low, with 100 ns maximum values. Common-mode transient immunity is listed at 5000 V/µs minimum for both logic-high and logic-low states.
Assembly information includes 260 °C peak reflow, 260 °C wave soldering peak for 10 s, and hand soldering at 360 °C +5 °C within 3 s for rework or sample testing.
Key Features
- 10 MBit/s high speed optocoupler data rate
- 3750 Vrms input-to-output isolation rating
- SOP5 case and package configuration
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads per MIL-STD-202 Method 208
- -40 to +100 °C operating temperature range
- 41 ns typical propagation delay to output high
- 50 ns typical propagation delay to output low
- 5000 V/µs minimum common-mode transient immunity
- 3000 pcs per tape-and-reel shipping quantity
Typical Applications
- Isolated digital signal interfaces
- 10 MBit/s logic isolation
- Systems needing 3750 Vrms isolation
- High-speed optocoupler signal transfer
- SOP5 surface-mount assemblies
- Common-mode transient environments
- Tape-and-reel production assembly
Procurement Notes
When requesting a quote for XLM601-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package is specified for XLM601-G?
XLM601-G is specified in an SOP5 case and SOP5 package. The provided text notes that package dimensions were not readable, but ordering and mechanical data both identify SOP5.
What isolation rating does XLM601-G provide?
The extracted datasheet facts list 3750 Vrms isolation between input and output. A separate test condition gives 3750 Vrms at 40 to 60% relative humidity with AC applied for 1 minute.
What switching speed parameters are listed?
The device is listed for 10 MBit/s operation. Propagation delay to output high is 41 ns typical and 100 ns maximum, while propagation delay to output low is 50 ns typical and 100 ns maximum under the stated 5 V and 7.5 mA test conditions.
What soldering limits are provided for assembly?
The assembly data lists a 260 °C reflow peak temperature, 260 °C wave soldering peak for 10 seconds, and hand soldering at 360 °C +5 °C within 3 seconds for rework or sample testing.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.