Specifications
| Type | Description |
|---|---|
| Part Number | XLM611-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package Case | SOP5 |
| Supported product series | XLM600, XLM601, XLM611 |
| Data rate | 10 MBit/s |
| Isolation voltage | 3750 Vrms |
| Operating temperature | -40 to 85 °C |
| Package | SOP5 |
| Molding compound flammability | UL 94V-0 |
| Terminal finish | Matte tin-plated leads |
| Shipping quantity | 3000 pcs/Tape & Reel |
| Forward current absolute maximum | 50 mA |
| Input reverse voltage absolute maximum | 5 V |
| Power dissipation absolute maximum | 100 mW |
| Collector output power dissipation | 85 mW |
| Output current absolute maximum | 50 mA |
| Supply voltage absolute maximum | 7 V |
| Output voltage absolute maximum | 7 V |
| Isolation voltage, AC 1 minute | 3750 Vrms |
| Operating temperature range | -40 to +100 °C |
| Storage temperature range | -55 to +125 °C |
| Soldering temperature | 260 °C |
| Forward voltage | typ 1.33 V, max 1.8 V |
| Reverse breakdown voltage | min 5 V |
| Input capacitance | typ 70 pF |
| Diode temperature coefficient | typ -1.9 mV/°C |
| High level supply current | typ 6.0 mA, max 9 mA |
| Low level supply current | typ 7.5 mA, max 10 mA |
| High level output current | typ 2.1 µA, max 30 µA |
| Low level output voltage | typ 0.4 V, max 0.6 V |
| Input threshold current | typ 2.4 mA, max 5 mA |
| Isolation resistance | typ 1×10^12 Ω |
| Floating capacitance | typ 0.6 pF |
| Propagation delay time to output high level | typ 41 ns, max 100 ns |
| Propagation delay time to output low level | typ 50 ns, max 100 ns |
| Pulse width distortion | typ 9 ns, max 35 ns |
| Output rise time | typ 40 ns |
| Output fall time | typ 10 ns |
| Propagation delay skew | max 40 ns |
| Common mode transient immunity at logic high for XLM611 | min 20000 V/µs |
| Common mode transient immunity at logic low for XLM611 | min 20000 V/µs |
| Reflow preheat temperature | 150 to 200 °C |
| Reflow preheat time | 60 to 120 s |
| Reflow ramp-up rate | max 3 °C/s |
| Reflow liquidus temperature | 217 °C |
| Reflow time above liquidus | 60 to 150 s |
| Reflow peak temperature | 260 °C |
| Reflow peak dwell time | 30 s |
| Reflow ramp-down rate | max 6 °C/s |
| Recommended reflow count | No more than 3 times |
| Wave soldering average ramp-up rate | ~200 °C/s |
| Wave soldering preheat heating rate | typ 1 to 2 °C/s, max 4 °C/s |
| Wave soldering final preheat temperature | ~130 °C |
| Wave soldering preheat time | >60 s |
| Wave soldering peak temperature | 260 °C |
| Wave soldering peak time | 10 s |
| Wave soldering ramp-down rate | max 5 °C/s |
| Hand soldering iron temperature | 360 °C +5 °C within 3 s |
| Packing form | Reel, diameter 330 mm |
| Quantity per reel | 3000 pcs/reel |
| Quantity per box | 6000 pcs, 2 reels/box |
| Quantity per carton | 60000 pcs, 10 boxes/carton |
| Antistatic bag specification | 380*420 mm |
| Box specification | 350*340*60 mm |
| Carton specification | 365*330*370 mm |
| Guardband speed | 200 mm/min |
| Datasheet Status | request_only |
Product Overview
XLM611-G is a XINGLIGHT high speed optocoupler listed in the LED category and supplied in an SOP5 package. The datasheet product family covers XLM600, XLM601, and XLM611, with XLM611-G specified for 10 MBit/s operation and 3750 Vrms input-to-output isolation.
Key Features
- 10 MBit/s high speed optocoupler data rate
- 3750 Vrms input-to-output isolation voltage
- SOP5 package with matte tin-plated leads
- UL 94V-0 molding compound flammability rating
- -40 to +100 °C thermal operating range
- 50 mA absolute maximum forward current
- 7 V absolute maximum supply voltage
- Typical 41 ns output-high propagation delay
- Typical 50 ns output-low propagation delay
- Minimum 20000 V/µs XLM611 common-mode transient immunity
Typical Applications
- Isolated 10 MBit/s digital links
- Input-to-output isolation barriers
- SOP5 surface-mount assemblies
- Logic interfaces using 5 V supply
- Common-mode transient environments
- Tape-and-reel production builds
Procurement Notes
When requesting a quote for XLM611-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package is specified for XLM611-G?
XLM611-G is specified in an SOP5 package. The datasheet also lists SOP5 ordering and packing details, including 3000 pcs per tape-and-reel and reel packing with a 330 mm diameter.
What data rate does the XLM611-G support?
The datasheet lists a 10 MBit/s data rate for the XLM600, XLM601, and XLM611 high speed optocoupler family. XLM611-G is part of this listed XLM611 product series.
What isolation rating is listed for XLM611-G?
The datasheet lists 3750 Vrms isolation voltage between input and output. A separate isolation entry specifies 3750 Vrms under 40 to 60% RH, AC applied for 1 minute.
What soldering limits are given for this device?
The datasheet lists 260 °C soldering temperature for 10 seconds. Reflow data includes 150 to 200 °C preheat, 217 °C liquidus, 260 °C peak temperature, and no more than 3 reflow cycles.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.