Specifications
| Type | Description |
|---|---|
| Part Number | XLM611 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SOP6-W, SOP6-P; package outline dimensions referenced in mm but numeric dimensions not present in provided text |
| Data Rate | 10 MBit/s; feature rating |
| Isolation Voltage | 5000 Vrms; feature rating; between input and output |
| Operating Temperature | -40 to +85 °C; feature rating |
| Case | SOP6-W, SOP6-P; mechanical data |
| Molding Compound Flammability | UL 94V-0; mechanical data |
| Terminal Finish | Matte tin-plated leads; solderability per MIL-STD-202, Method 208 |
| Forward Current | 50 mA max; maximum rating, TA=25°C unless otherwise specified |
| Input Reverse Voltage | 5 V max; maximum rating, TA=25°C unless otherwise specified |
| Power Dissipation | 100 mW max; maximum rating, TA=25°C unless otherwise specified |
| Collector Output Power | 85 mW max; maximum rating, TA=25°C unless otherwise specified |
| Output Current | 50 mA max; maximum rating, TA=25°C unless otherwise specified |
| Supply Voltage | 7 V max; maximum rating, TA=25°C unless otherwise specified |
| Output Voltage | 7 V max; maximum rating, TA=25°C unless otherwise specified |
| Isolation Voltage | 5000 Vrms; thermal characteristics; 40 to 60% RH, AC for 1 minute |
| Operating Temperature Range | -40 to +85 °C; thermal characteristics |
| Storage Temperature Range | -55 to +125 °C; thermal characteristics |
| Soldering Temperature | 260 °C; thermal characteristics; for 10 seconds |
| Forward Voltage | 1.33 V typ, 1.8 V max; IF=10 mA, TA=25°C unless otherwise specified |
| Reverse Breakdown Voltage | 5 V min, 20 V typ, 45 V max; IR=10 µA, TA=25°C unless otherwise specified |
| Input Capacitance | 70 pF typ; VR=0 V, f=1 kHz, TA=25°C unless otherwise specified |
| Diode Temperature Coefficient | -1.9 mV/°C typ; IF=10 mA, TA=25°C unless otherwise specified |
| High Level Supply Current | 6.0 mA typ, 9 mA max; VCC=5.5 V, IF=0 mA |
| Low Level Supply Current | 7.5 mA typ, 10 mA max; VCC=5.5 V, IF=10 mA |
| High Level Output Current | 2.1 µA typ, 30 µA max; VCC=5.5 V, VO=5.5 V, IF=250 µA |
| Low Level Output Voltage | 0.4 V typ, 0.6 V max; VCC=5.5 V, IF=5 mA, ICL=13 mA |
| Input Threshold Current | 2.4 mA typ, 5 mA max; VCC=5.5 V, VO=0.6 V, IOL=13 mA |
| Isolation Resistance | 1×10^12 Ω typ; VIO=500 Vdc, 40 to 60% RH |
| Floating Capacitance | 0.6 pF typ; f=1 MHz |
| Propagation Delay Time to Output High Level | 41 ns typ, 100 ns max; TA=-40°C to +85°C, VCC=5 V, IF=7.5 mA, CL=15 pF, RL=350 Ω unless otherwise specified |
| Propagation Delay Time to Output Low Level | 50 ns typ, 100 ns max; TA=-40°C to +85°C, VCC=5 V, IF=7.5 mA, CL=15 pF, RL=350 Ω unless otherwise specified |
| Pulse Width Distortion | 9 ns typ, 35 ns max; |TPHL-TPLH|, CL=15 pF, RL=350 Ω, TA=25°C |
| Output Rise Time | 40 ns typ; 10% to 90%, TA=-40°C to +85°C, VCC=5 V, IF=7.5 mA unless otherwise specified |
| Output Fall Time | 10 ns typ; 90% to 10%, TA=-40°C to +85°C, VCC=5 V, IF=7.5 mA unless otherwise specified |
| Propagation Delay Skew | 40 ns max; TA=-40°C to +85°C, VCC=5 V, IF=7.5 mA unless otherwise specified |
| Common Mode Transient Immunity at Logic High | 20000 V/µs min; XL611, TA=25°C, IF=0 mA, |VCM|=1000 V peak, VOH=2.0 V, RL=350 Ω |
| Common Mode Transient Immunity at Logic Low | 20000 V/µs min; XL611, IF=7.5 mA, VOL=0.8 V, RL=350 Ω, TA=25°C, |VCM|=1000 V peak |
| Reflow Preheat Temperature | 150 to 200 °C; recommended reflow soldering profile |
| Reflow Preheat Time | 60 to 120 s; recommended reflow soldering profile |
| Reflow Ramp-Up Rate | 3 °C/s max; TL to TP |
| Reflow Liquidus Temperature | 217 °C; recommended reflow soldering profile |
| Reflow Time Above Liquidus | 60 to 150 s; time above TL |
| Reflow Peak Temperature | 260 °C; recommended reflow soldering profile |
| Reflow Peak Dwell Time | 30 s; time during which TC is between TP-5 and TP |
| Reflow Ramp-Down Rate | 6 °C/s max; TP to TL |
| Reflow Cycles | No more than 3 times; recommended soldering note |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; wave soldering profile |
| Wave Soldering Preheat Heating Rate | 1 to 2 °C/s typical, 4 °C/s max; during preheat |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp |
| Wave Soldering Peak Time | 10 s; time within peak temperature |
| Wave Soldering Ramp-Down Rate | 5 °C/s max; wave soldering profile |
| Hand Soldering Iron Temperature | 360 °C +5°C within 3 s; for product rework or sample testing |
| Packing Form | Reel, diameter 330 mm; SOP6 package |
| Quantity Per Reel | 1000 pcs/reel; SOP6 reel packing |
| Quantity Per Box | 2000 pcs/box; 2 reels/box |
| Quantity Per Carton | 10000 pcs/carton; 5 boxes/carton |
| Antistatic Bag Specification | 380 × 420 mm; SOP6 reel packing |
| Box Specification | 350 × 340 × 60 mm; SOP6 reel packing |
| Carton Specification | 365 × 330 × 370 mm; SOP6 reel packing |
| Datasheet Status | request_only |
Product Overview
XLM611 is a XINGLIGHT high speed optocoupler listed under the LED category. The device is specified for a 10 MBit/s feature data rate and 5000 Vrms isolation between input and output, with operating temperature coverage from -40 to +85 °C. Case options are SOP6-W and SOP6-P, and the datasheet references package outline dimensions in millimeters without providing numeric dimensions in the extracted text.
Input-side ratings include 50 mA maximum forward current, 5 V maximum input reverse voltage, and 100 mW maximum power dissipation at TA=25°C unless otherwise specified. Output and supply limits include 85 mW maximum collector output power, 50 mA maximum output current, 7 V maximum supply voltage, and 7 V maximum output voltage.
Electrical characteristics include 1.33 V typical and 1.8 V maximum forward voltage at IF=10 mA, 70 pF typical input capacitance, and 1×10^12 Ω typical isolation resistance. Dynamic specifications include 41 ns typical propagation delay to output high level, 50 ns typical propagation delay to output low level, 9 ns typical pulse width distortion, and 20000 V/µs minimum common-mode transient immunity for both logic-high and logic-low conditions.
Assembly information includes 260 °C reflow peak temperature, no more than three reflow cycles, 260 °C wave soldering peak temperature, and 360 °C +5°C hand soldering within 3 s for rework or sample testing.
Key Features
- 10 MBit/s feature data rate
- 5000 Vrms input-to-output isolation rating
- -40 to +85 °C operating temperature range
- SOP6-W and SOP6-P case options
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads per MIL-STD-202 Method 208
- 41 ns typical output-high propagation delay
- 50 ns typical output-low propagation delay
- 20000 V/µs minimum common-mode transient immunity
- 1000 pcs per 330 mm SOP6 reel
Typical Applications
- Isolated high speed digital signaling
- Logic interface isolation
- Fast optocoupler output switching
- Systems requiring 5000 Vrms isolation
- Circuits operating across -40 to +85 °C
- SOP6 surface-mount assemblies
- Reflow or wave soldered boards
Procurement Notes
When requesting a quote for XLM611, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What product type is the XLM611 from XINGLIGHT?
XLM611 is identified as a high speed optocoupler in the LED category. The extracted datasheet facts list a 10 MBit/s feature data rate, 5000 Vrms isolation between input and output, and SOP6-W or SOP6-P case options.
What isolation rating is specified for XLM611?
The extracted facts specify 5000 Vrms isolation. It is listed as a feature rating between input and output and also appears under thermal characteristics with 40 to 60% relative humidity and AC applied for 1 minute.
What operating temperature range applies to XLM611?
XLM611 is specified for operation from -40 to +85 °C. The same range appears in the feature rating and in the thermal characteristics section of the extracted datasheet facts.
What are the main timing parameters for XLM611?
At VCC=5 V, IF=7.5 mA, CL=15 pF, and RL=350 Ω, propagation delay is 41 ns typical to output high and 50 ns typical to output low. Propagation delay skew is specified at 40 ns maximum.
What soldering limits are listed for XLM611 assembly?
The extracted assembly facts list a 260 °C reflow peak temperature, 30 s peak dwell time, and no more than three reflow cycles. Wave soldering peak temperature is 260 °C for 10 s, with 5 °C/s maximum ramp-down.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.