XLR0213 Zero Cross Triac Driver

XINGLIGHT Power_Management — specifications, applications, sourcing support and RFQ.

XLR0213 Zero Cross Triac Driver

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XLR0213
Manufacturer
XINGLIGHT
Package
DIP7, DIP7-M, SMD7; package outline dimensions shown in mm but numeric dimensions not provided in extracted text
Category
Power Management
Product Type
LDO Regulator

Quick Sourcing Note

XLR0213 from XINGLIGHT is a Power_Management zero cross triac driver supplied in DIP7, DIP7-M, and SMD7 package options. The family feature summary lists 600 V peak breakdown voltage, 5000 Vrms input-to-output isolation, and peak current load options of 0.3 A, 0.6 A, 0.9 A, and 1.2 A. For XLR0213, the maximum ratings include 0.3 A RMS turn-on current and 3 A peak repetitive surge current. Electrical characteristics include max 10 mA LED trigger current, max 2.5 V peak on-state voltage, and min 200 V/µs critical rate of rise of off-state voltage. The device supports isolated zero-cross AC load control applications.

Specifications

TypeDescription
Part NumberXLR0213
ManufacturerXINGLIGHT
Product TypeLDO Regulator
CategoryPower Management
Package CaseDIP7, DIP7-M, SMD7; package outline dimensions shown in mm but numeric dimensions not provided in extracted text
Component TypePower_IC
Peak Breakdown Voltage600 V; feature summary
Peak Current Load0.3 A, 0.6 A, 0.9 A, 1.2 A; XLR0213, XLR1213, XLR2213, XLR3213 family feature summary
Isolation Voltage5000 Vrms; feature summary, input to output
Operating Temperature-55°C to 100°C; feature summary
Molding Compound Flammability RatingUL 94V-0; mechanical data
Package OptionDIP7; ordering information, XLRX213
Package OptionDIP7-M; ordering information, XLRX213M
Package OptionSMD7; ordering information, XLRX213S
DIP7 Shipping Quantity65 pcs/tube; ordering information
DIP7-M Shipping Quantity65 pcs/tube; ordering information
SMD7 Shipping Quantity1000 pcs/tape and reel; ordering information
Forward Current50 mA; maximum rating, TA=25°C unless otherwise specified
Input Reverse Voltage5 V; maximum rating, TA=25°C unless otherwise specified
Input Power Dissipation75 mW; maximum rating, TA=25°C unless otherwise specified
Output Power Dissipation300 mW; maximum rating, TA=25°C unless otherwise specified
Off-State Output Terminal Voltage600 V; VDRM maximum rating, TA=25°C unless otherwise specified
Peak Repetitive Surge Current3 A; ITSM, XLR0213, TA=25°C unless otherwise specified
Peak Repetitive Surge Current6 A; ITSM, XLR1213, TA=25°C unless otherwise specified
Peak Repetitive Surge Current9 A; ITSM, XLR2213, TA=25°C unless otherwise specified
Peak Repetitive Surge Current12 A; ITSM, XLR3213, TA=25°C unless otherwise specified
Turn-On Current RMS0.3 A; IT(RMS), XLR0213, TA=25°C unless otherwise specified
Turn-On Current RMS0.6 A; IT(RMS), XLR1213, TA=25°C unless otherwise specified
Turn-On Current RMS0.9 A; IT(RMS), XLR2213, TA=25°C unless otherwise specified
Turn-On Current RMS1.2 A; IT(RMS), XLR3213, TA=25°C unless otherwise specified
Total Power Dissipation375 mW; thermal characteristic
Isolation Voltage5000 Vrms; 40% to 60% RH, AC for 1 minute; pins 1,2,3 shorted and pins 4,5,6 shorted together
Operating Temperature-40°C to +85°C; thermal characteristic, TOPR
Storage Temperature Range-40°C to +125°C; thermal characteristic, TSTG
Soldering Temperature260°C; TSOL, for 10 seconds
Forward VoltageMax 1.4 V; IF=10 mA, TA=25°C unless otherwise specified
Input Reverse Leakage CurrentMax 10 µA; VR=5 V, TA=25°C unless otherwise specified
Input CapacitanceTyp 45 pF; f=1 kHz, TA=25°C unless otherwise specified
Peak Blocking CurrentMax 100 µA; VDRM=600 V, IF=0 mA, TA=25°C unless otherwise specified
Peak On-State VoltageMax 2.5 V; ITM=100 mA peak, IF=rated IFT, TA=25°C unless otherwise specified
Critical Rate of Rise of Off-State VoltageMin 200 V/µs; VPEAK=rated VDRM, TA=25°C unless otherwise specified
LED Trigger CurrentMax 10 mA; main terminal voltage=3 V, TA=25°C unless otherwise specified
Holding CurrentMax 25 mA; terminal voltage from ON to OFF state, IF=0 mA, TA=25°C unless otherwise specified
Turn-On TimeTyp 10 µs, Max 100 µs; IF=20 mA, VD=6 V, RL=100 Ω, TA=25°C unless otherwise specified
Isolation ResistanceMin 1×10^11 Ω; VIO=500 VDC, TA=25°C unless otherwise specified
Isolation CapacitanceTyp 0.25 pF; f=1 MHz, TA=25°C unless otherwise specified
Reflow Preheat Temperature150°C to 200°C; Ts, reflow soldering profile
Reflow Preheat Time60 s to 120 s; ts, reflow soldering profile
Reflow Ramp-Up RateMax 3°C/s; TL to TP, reflow soldering profile
Reflow Liquidus Temperature217°C; TL, reflow soldering profile
Reflow Time Above Liquidus60 s to 150 s; tL, above TL, reflow soldering profile
Reflow Peak Temperature260°C; Tp, reflow soldering profile
Reflow Peak TimeMax 30 s; tp, time during which Tc is between TP-5 and TP
Reflow Ramp-Down RateMax 6°C/s; TP to TL, reflow soldering profile
Recommended Reflow CyclesNo more than 3 times; reflow soldering note
Wave Soldering Average Ramp-Up Rate~200°C/s; wave soldering profile feature
Wave Soldering Heating Rate During PreheatTypical 1°C/s to 2°C/s, maximum 4°C/s; wave soldering profile feature
Wave Soldering Final Preheat Temperature~130°C; Ts, wave soldering profile feature
Wave Soldering Preheat Time>60 s; 25°C to Ts, wave soldering profile feature
Wave Soldering Peak Temperature260°C; Tp, wave soldering profile feature
Wave Soldering Peak Time10 s; tp, wave soldering profile feature
Wave Soldering Ramp-Down RateMax 5°C/s; wave soldering profile feature
Hand Soldering Iron Temperature360°C ±5°C; within 3 s; for product rework or sample testing
DIP7 Packing Quantity65 pcs/tube, 3250 pcs/box, 32500 pcs/carton; tube packing, 50 tubes/box, 10 boxes/carton
DIP7-M Packing Quantity65 pcs/tube, 3250 pcs/box, 32500 pcs/carton; tube packing, 50 tubes/box, 10 boxes/carton
SMD7 Packing Quantity1000 pcs/reel, 2000 pcs/box, 20000 pcs/carton; reel packing, 2 reels/box, 5 boxes/carton
Datasheet Statusrequest_only

Product Overview

The XLR0213 is a XINGLIGHT zero cross triac driver in the Power_Management category. The extracted datasheet facts identify it as part of the XLRX213 family, with a 600 V peak breakdown voltage and 5000 Vrms input-to-output isolation. Maximum ratings at TA=25°C list 50 mA forward current, 5 V input reverse voltage, 75 mW input power dissipation, and 300 mW output power dissipation.

For the XLR0213 variant, the datasheet lists 0.3 A RMS turn-on current and 3 A peak repetitive surge current. Electrical characteristics include max 1.4 V forward voltage at IF=10 mA, max 10 µA input reverse leakage at VR=5 V, typ 45 pF input capacitance, max 100 µA peak blocking current at VDRM=600 V, and max 10 mA LED trigger current.

Package and assembly facts cover DIP7, DIP7-M, and SMD7 options. DIP7 and DIP7-M ship as 65 pcs/tube, while SMD7 ships as 1000 pcs/tape and reel. Reflow, wave, and hand soldering profiles are specified, including 260°C reflow and wave peak temperatures.

Key Features

  • Zero cross triac driver for Power_Management designs
  • 600 V peak breakdown and off-state terminal voltage
  • 5000 Vrms input-to-output isolation rating
  • XLR0213 RMS turn-on current rated 0.3 A
  • XLR0213 peak repetitive surge current rated 3 A
  • Maximum LED trigger current is 10 mA
  • Minimum off-state dV/dt rating is 200 V/µs
  • DIP7, DIP7-M, and SMD7 package options
  • UL 94V-0 molding compound flammability rating
  • Reflow peak temperature specified at 260°C

Typical Applications

  • Zero-cross triac driver circuits
  • AC load turn-on control
  • Isolated input-to-output control
  • 600 V off-state output designs
  • DIP7 through-hole assemblies
  • DIP7-M through-hole assemblies
  • SMD7 tape-and-reel assemblies
  • Reflow soldered board assemblies
  • Wave soldered board assemblies

Procurement Notes

When requesting a quote for XLR0213, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.

FAQ

What type of device is the XLR0213?

The XLR0213 is identified in the extracted datasheet facts as a XINGLIGHT Power_Management Power_IC and zero cross triac driver. The listed package options are DIP7, DIP7-M, and SMD7.

What isolation rating is listed for XLR0213?

The extracted datasheet facts list 5000 Vrms input-to-output isolation. A maximum-rating condition also specifies 5000 Vrms AC for 1 minute at 40% to 60% RH with the stated input and output pins shorted together.

What current ratings apply to the XLR0213 variant?

For XLR0213 specifically, the extracted maximum ratings list 0.3 A RMS turn-on current and 3 A peak repetitive surge current at TA=25°C unless otherwise specified.

Which package and packing options are provided?

Ordering facts list DIP7, DIP7-M, and SMD7 package options. DIP7 and DIP7-M ship as 65 pcs/tube, while SMD7 ships as 1000 pcs/tape and reel. Packing facts also list box and carton quantities.

What soldering limits are specified in the facts?

The soldering facts include a 260°C soldering temperature for 10 seconds, 260°C reflow peak temperature, 260°C wave soldering peak temperature, and 360°C ±5°C hand soldering iron temperature within 3 seconds.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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